• Title/Summary/Keyword: Additive Layer

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산화알루미늄 세라믹 보트 기판을 이용한 탄소마이크로 코일의 대량 합성 (Large scale synthesis of the geometrically controlled carbon coils using $Al_2O_3$ ceramic boat for the supporting substrate)

  • 김성훈
    • 한국응용과학기술학회지
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    • 제30권3호
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    • pp.423-430
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    • 2013
  • Carbon coils could be synthesized using $C_2H_2/H_2$ as source gases and $SF_6$ as an incorporated additive gas under thermal chemical vapor deposition (CVD) system. Prior to the carbon coils deposition reaction, two kinds of samples having different combination of Ni catalyst and substrate were employed, namely, a commercially-made $Al_2O_3$ ceramic boat with Ni powders and a commercially-made $Al_2O_3$ substrate with Ni layer. By using a commercially-made $Al_2O_3$ ceramic boat, the synthesis of carbon coils could be enhanced as much as 10 times higher than that of $Al_2O_3$ substrate. Furthermore, the dominant formation of the microsized carbon coils could be obtained by using $Al_2O_3$ ceramic boat. The surface roughness of the supporting substrate of $Al_2O_3$ ceramic boat was understood to be associated with the large scale synthesis of carbon coils as well as the dominant formation of the larger-sized, namely the microsized carbon coils.

혼합 산화제를 사용한 텅스텐 막의 전기화학적 부식 및 CMP 특성 (Electrochemical Corrosion and Chemical Mechanical Polishing(CMP) Characteristics of Tungsten Film using Mixed Oxidizer)

  • 나은영;서용진;이우선
    • 한국전기전자재료학회논문지
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    • 제18권4호
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    • pp.303-308
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    • 2005
  • In this paper, the effects of oxidants on tungsten chemical mechanical polishing (CMP) process were investigated using three different oxidizers such as Fe(NO₃)₃, KIO₃ and H₂O₂. Moreover, the interaction between the tungsten film and the oxidizer was discussed by potentiodynamic polarization measurement with three different oxidizers, in order to compare the effects of W-CMP and electrochemical characteristics on the tungsten film as a function of oxidizer. As an experimental result, the tungsten removal rate reached a maximum at 5 wt% Fe(NO₃)₃concentration, and when 5 wt% H₂O₂was added in the slurry, the removal rate of W increased. Also, the microstructures of surface layer by atomic force microscopy(AFM) image were greatly influenced by the slurry chemical composition of oxidizers. It was shown that the surface roughness and removal rate of the polished surface were improved in Fe(NO₃)₃than KIO₃. The electrochemical results indicate that the corrosion current density of the 5 wt% H₂O₂ and 5 wt% H₂O/sub 2+/+ 5 wt% Fe(NO₃)₃was higher than the other oxidizers. Therefore, we conclude that the W-CMP characteristics are strongly dependent on the kinds of oxidizers and the amounts of oxidizer additive.

고전류밀도 구리도금공정에서 알시안블루(Alcian Blue) 농도와 기계적 특성과의 상관관계 (Relationship between Concentration of Alcian Blue and Mechanical Properties on High Current Density Copper Electroplating)

  • 우태규
    • 한국재료학회지
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    • 제30권4호
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    • pp.160-168
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    • 2020
  • The current density in copper electroplating is directly related with the productivity; then, to increase the productivity, an increase in current density is required. This study is based on an analysis of changes in surface characteristics and mechanical properties by applying the addition of Alcian Blue (AB, C56H68Cl4CuN16S4). The amount of Alcian Blue in the electrolytes is changed from 0 to 100 ppm. When Alcian Blue is added at 20 ppm, a seed layer is formed homogeneously on the surface at the initial stage of nucleation. However, crystals electroplated in electrolytes with more than 40 ppm of Alcian Blue are observed to have growth in the vertical direction on the surface and the shapes are like pyramids. This tendency of initial nucleation formation causes protrusions when the thickness of copper foil is 12 ㎛. Thereafter, a lot of extrusions are observed on the group of 100 ppm Alcian Blue. Tensile strength of groups with added Alcian Blue increased by more than 140% compare to no-addition group, but elongation is reduced. These results are due to the decrease of crystal size and changes of prior crystal growth plane from (111) and (200) to (220) due to Alcian Blue.

알루미나의 첨가가 ${\alpha}-SiC$의 가압소결 및 기계적 성질에 미치는 영향 (Effect of $Al_2O_3$ on Hot-Press of ${\alpha}-SiC$ and Mechanical Properties)

  • 이수영;고재웅;김해두
    • 한국세라믹학회지
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    • 제28권7호
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    • pp.561-567
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    • 1991
  • Submicron ${\alpha}-SiC$ powder with $Al_2O_3$ addition was hot-pressed under the controlled heating and pressurizing schedule. $SiO_2$ layer on ${\alpha}-SiC$ powder was effective for the sintering of ${\alpha}-SiC$ powder when $Al_2O_3$ was used as an additive. Applying of pressure under the controlled schedule accelerated the rearrangment of SiC grains, yielding 98% of theoretical density of SiC even at $1900^{\circ}C$. Flexural strength of the specimen containing 2 wt% $Al_2O_3$ was increased as increasing the hot-pressing temperature up to $2050^{\circ}C$ and maximum value was 800 MPa, while the flexural strength of the specimen containing 10 wt% $Al_2O_3$ was decreased as increasing the hot-pressing temperature above $2000^{\circ}C$ due to the formation of continuous grain boundary phase. Fracture toughness of the specimens was in the range of $3.5~4.5\;MNm^{-3/2}$ regardless of the amount of $Al_2O_3$ addition.

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직접 스크린 프린팅법으로 제조된 고분자 전해질 연료전지의 고성능 전극 (High Performance Electrode of Polymer Electrolyte Membrane Fuel Cells Prepared by Direct Screen Printing Process)

  • 임재욱;최대규;류호진
    • 마이크로전자및패키징학회지
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    • 제11권1호
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    • pp.65-69
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    • 2004
  • 스크린 프린팅법은 고분자 전해질 연료전지의 전극 촉매층 제조의 편리함과 적용성의 면에서 가장 일반적인 방법 중에 하나이다. 본 논문은 기존의 방법과 비교하여 매우 낮은 백금 함침량을 가지기 때문에 경쟁적이고, 부가적인 공정 없이 swelling 문제를 간단하게 억제시켜 개선된 스크린 프린팅 법을 제안하였다. 특히, 가스켓 일체형 MEA는 고분자 전해질 연료전지의 작동 중에 가스 침투의 영향을 방지하여 고전류 영역에서 기존의 방법으로 제조된 MEA보다 높은 성능을 가지게 제작하였다. 이와 같은 방법들은 보다 간단하고 빠른 제조의 기회를 준다.

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Lyophobized Ordered Mesoporous Silica Additives for Li-O2 Battery Cathode

  • Roev, Victor;Ma, Sang Bok;Lee, Dong Joon;Im, Dongmin
    • Journal of Electrochemical Science and Technology
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    • 제5권2호
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    • pp.58-64
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    • 2014
  • The surface of an ordered mesoporous silica (OMS) was functionalized using 1H,1H,2H,2H-perfluorooctyltrimethoxysilane at $20^{\circ}C$ and $60^{\circ}C$. It was shown that only elevated temperature allows lyophobic properties on the walls of OMS, eventually preventing pore flooding with nonaqueous electrolytes. The functionalized OMSs (OMS-F) were characterized with various techniques: wettability test, $N_2$ sorption measurement, high-resolution transmission electron microscopy (HR-TEM). Cathodes of $10mg/cm^2$ loading were prepared with a commercial Pt/C catalyst and polyvinylidene fluoride (PVDF, 2.5 wt.%) binder using a typical doctor blade method on a commercial gas diffusion layer (GDL) in the presence or in the absence of OMS-F additives. Subsequent discharge-charge curves were taken in a 1M LiTFSI-TEGDME electrolyte at 60oC in pure oxygen atmosphere. It was found that the discharge capacity was significantly affected by OMS-F: 5 wt.% of additive extended discharge capacity by a factor 1.5. On the other hand, a similar OMS material but synthesized at $20^{\circ}C$ did not show lyophobic properties and deteriorated cathode capacity.

Semiconductor Behavior of Passive Films Formed on Cr with Various Additive Elements

  • Tsuchiya, Hiroaki;Fujimoto, Shinji;Shibata, Toshio
    • Corrosion Science and Technology
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    • 제2권1호
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    • pp.7-11
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    • 2003
  • Photoelectrochemical response and electrochemical impedance behavior was investigated for passive film formed on sputter-deposited Cr alloy in $0.1kmol{\cdot}m^{-3}$. Photoelectrochemical action spectrum could be separated into two components, which were considered to be derived from $Cr_2O_3$ ($E_g\sim3.6eV$) and $ Cr(OH)_3 $ ($E_g\sim2.5eV$). The band gap energy, $E_g$, of each component was almost constant for various applied potentials. polarization periods and alloying additives. The photoelectrochemical response showed negative photo current for most potentials in the passive region. Therefore, the photo current apparently exhibited p-typesemiconductor behavior. On the other hand, Mort-Schottky plot of the capacitance showed positive slope, which means that passive film formed on Cr alloy has n-type semiconductor property. These apparently conflicting results are rationally explained assuming that the passive film on Cr alloy formed in the acid solution has n-type semiconductor property with a fairly deep donor level in the band gap and forms an accumulation layer in the most of potential region in the passive state.

Percutaneous Absorption-Enhancing Activity of Urea Derivatives

  • Han, Suk-Kyu;Jun, Young-Hee;Rho, Yong-Jae;Hong, Sung-Cheul;Kim, Young-Mi
    • Archives of Pharmacal Research
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    • 제14권1호
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    • pp.12-18
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    • 1991
  • The effect of urea and urea derivatives on the percutaneous absorption of salicylic acid and sodium salicylate through the skin of rabbit from petrolatum ointment was investigated. It was found that addition of urea or urea derivatives to the ointment base significantly increased the percutaneous absorption of the drugs in proportion to the concentratoin of the additive. The percutaneous absorptoin-enhancing activities of these compounds were that urea derivatives with the more and longer alkyl substituents showed the stronger activities. These activities of urea and urea derivatives were ascribed to the binding of these compounds with the lipids and proteins of the stratum corneum of the skin and the swelling of the tissues, which leads to the reduction of the barrier property of the layer. The preliminary skin irritation test showed that urea and urea derivatives were quite non-irritating to the skin. These results suggest that urea derivatives have a strong possibility to be developed as a percutaneous absorption enhancer.

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스파타링에 의한 탄화티탄 피복에 관한 연구

  • 김병옥;방병옥;윤병하
    • 한국표면공학회지
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    • 제23권1호
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    • pp.16-26
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    • 1990
  • The standrd electrolyte for the electrodeposition of chromium were preparwith reagent grade chromic acid(200g/L), sulfuric acid(pH=1.8)and oxalic acalic acid(640g/L)as additive. Carbon content in chromium plating varied about2.0-3.8 wt% with current density and temperatures of the bath. The hardeness of chromium platings incresed with increasing the annealing temperatures and showed maximum value of about Hv 1700 after annealing at$ 700^{\circ}C$for 60min. But, decreased it as annealing at above $700^{\circ}C$. The reason for varing thee hardness of chromium codeposited with carbon gradually foumed chromium carbide(Cr7C3), but that changed to Cr23C6 as annealing temperature at above $^700{\circ}C$. The X-ray diffraction pattern indicated that chromium carbides, such as Cr7C3 or Cr3C2, formed at formed at above $300^{\circ}C$. titanium coating sputtered on the on surface of chromium plating had performed and determined the hardness after annealing at 500, 600, $700^{\circ}C$ for 60min. the maximum hardeness was about Hv 2400 as annealing at $700^{\circ}C$. The titanium carbide formed in layer was identified by X-ray diffraction. It was confirmed that chromium and titanium carbide has effect of increasing the hardness.

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전사방식 광조형 시스템의 해상도 최적화를 통한 출력물의 정밀도 향상 (Accuracy Improvement of Output in Projection Stereolithography by Optimizing Projection Resolution)

  • 김영흠;김규언;이치범
    • 한국생산제조학회지
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    • 제24권6호
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    • pp.710-717
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    • 2015
  • Projection stereolithography is an additive manufacturing method that uses beam projection to cure the photo-reactive resin used. The light source of a cross-section layer-form illuminates photo-curable resin for building a three-dimensional (3D) model. This method has high accuracy and a fast molding speed because the processing unit is a face instead of a dot. This study describes a Scalable Projection Stereolithography 3D Printing System for improving the accuracy of the stereolithography. In a conventional projection 3D printer, when printing a small sized model, many pixels are not used in the projection or curing. The proposed system solves this problem through an optical adjustment, and keeps using the original image as possible as filling the whole projection area. The experimental verification shows that the proposed system can maintain the highest level of precision regardless of the output size.