• Title/Summary/Keyword: Additional etching

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THE EFFECT OF ADDITIONAL ENAMEL ETCHING ON MICROLEAKAGE OF THE ADHESION OF SELF-ETCHING PRIMER SYSTEM (자가 산부식 프라이머 시스템 사용시 인산에 의한 부가적인 산부식이 미세누출에 미치는 영향)

  • Yoon, Jung-Jin;Min, Kyung-San;Hong, Chan-Ui
    • Restorative Dentistry and Endodontics
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    • v.28 no.5
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    • pp.363-368
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    • 2003
  • The purpose of this study is to evaluate the effect of additional enamel etching with phosphoric acid on the microleakage of the adhesion of self-etching primer system. Class V cavity($4mm{\times}3mm{\times}1.5mm$) preparations with all margins in enamel were prepared on buccal surface of 42 extracted human upper central incisor teeth. Prepared teeth were randomly divided into 3 groups. Group 1:no additional pretreatment with 37% phosphoric acid (NE). Group 2:additional pretreatment with 37% phosphoric acid for 10 seconds (E10s). Group 3:additional pretreatment with 37% phosphoric acid for 20 seconds (E20s). The adhesives(Clearfil SE $Bond^{\circledR}$, Kuraray, Osaka, Japan) and composite resins(Clearfil $AP-X^{\circledR}$, Osaka, Kuraray, Japan) were applied following the manufacturer's instructions. All the specimens were finished with the polishing disc(3M dental product, St Paul, MN, USA), thermocycled for 500 cycles between $5^{\circ}C$ and $55^{\circ}C$ and resected apical 3-mm root. 0.028 stainless steel wire was inserted apically into the pulp chamber of each tooth and sealed into position with sticky wax. Surrounding tooth surface was covered with a nail varnish 2 times except areas 1mm far from all the margins. After drying for one day, soaked the samples in the distilled water. Microleakage was assessed by electrochemical method(System 6514, $Electrometer^{\circledR}$), Keithley, USA) in the distilled water. In this study, the microleakage was the lowest in group 1 (NE) and the highest in group 3(E20s)(NE

SHEAR BOND STRENGTH OF SELF-ETCHING ADHESIVES TO TOOTH ENAMEL WITH ADDITIONAL ETCHING (부가적 산부식 시간에 따른 자가 산부식 접착제의 법랑질 전단결합강도)

  • Lee, Hyung-Sook;Kim, Sung-Ki;Lee, Dong-Soo;Kim, Shin;Jeong, Tae-Sung
    • Journal of the korean academy of Pediatric Dentistry
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    • v.36 no.4
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    • pp.514-521
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    • 2009
  • The aim of this study was to evaluate the bonding ability of two self etch systems to human primary and permanent enamel and the effect of additional acid etching time. Exfoliated, caries free human primary molar(n=65) and permanent molar extracted (n=65) were used. prepared enamel specimens were randomly divided into 2 test groups and a control group. The control group(n=10) were treated with 35% phosphoric acid gel and Scotchbond Multi-purpose adhesive. Experimental groups(self-etching systems) were subdivided into 6 groups(each n=10) according to additional etching time(0s, 5s, 10s, 15s, 20s, 30s). The result were as follows : 1) The shear bond strengths of the self-etching adhesives(Clearfil SE Bond, Adper Prompt L-pop) without additional etching were lower than control group(Scotch Bond Multipurpose). 2) Between the same self-etch adhesive groups, additional etched groups showed higher shear bond strength 3) There was no significant difference between primary and permanent enamel. In conclusion, bond strength of self-etch adhesives to enamel could be increased with additional etching.

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The effect of additional etching and curing mechanism of composite resin on the dentin bond strength

  • Lee, In-Su;Son, Sung-Ae;Hur, Bock;Kwon, Yong-Hoon;Park, Jeong-Kil
    • The Journal of Advanced Prosthodontics
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    • v.5 no.4
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    • pp.479-484
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    • 2013
  • PURPOSE. The aim of this study was to evaluate the effects of additional acid etching and curing mechanism (light-curing or self-curing) of a composite resin on the dentin bond strength and compatibility of one-step self-etching adhesives. MATERIALS AND METHODS. Sixteen human permanent molars were randomly divided into eight groups according to the adhesives used (All-Bond Universal: ABU, Clearfil S3 Bond: CS3), additional acid etching (additional acid etching performed: EO, no additional acid etching performed: EX), and composite resins (Filtek Z-250: Z250, Clearfil FII New Bond: CFNB). Group 1: ABU-EO-Z250, Group 2: ABU-EO-CFNB, Group 3: ABU-EX-Z250, Group 4: ABU-EX-CFNB, Group 5: CS3-EO-Z250, Group 6: CS3-EO-CFNB, Group 7: CS3-EX-Z250, Group 8: CS3-EX-CFNB. After bonding procedures, composite resins were built up on dentin surfaces. After 24-hour water storage, the teeth were sectioned to make 10 specimens for each group. The microtensile bond strength test was performed using a microtensile testing machine. The failure mode of the fractured specimens was examined by means of an optical microscope at ${\times}20$ magnification. The data was analyzed using a one-way ANOVA and Scheffe's post-hoc test (${\alpha}$=.05). RESULTS. Additional etching groups showed significantly higher values than the no additional etching group when using All-Bond Universal. The light-cured composite resin groups showed significantly higher values than the self-cured composite resin groups in the Clearfil S3 Bond. CONCLUSION. The additional acid etching is beneficial for the dentin bond strength when using low acidic one-step self-etch adhesives, and low acidic one-step self-etch adhesives are compatible with self-cured composite resin. The acidity of the one-step self-etch adhesives is an influencing factor in terms of the dentin bonding strength and incompatibility with a self-cured composite resin.

Influence of additional etching on shear bond strength of self-etching adhesive system to enamel (부가적인 산부식이 자가산부식 접착제의 법랑질에 대한 전단결합강도에 미치는 영향)

  • Yoo Sun-Jin;Kim Young-Kyung;Park Jeong-Won;Jin Myoung-Uk;Kim Sung-Kyo
    • Restorative Dentistry and Endodontics
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    • v.31 no.4
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    • pp.263-268
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    • 2006
  • Recently, self-etching adhesive system has been introduced to simplify the clinical bonding proce- dures. It is less acidic compared to the phosphoric acid, thus there is doubt whether this system has enough bond strength to enamel. The purpose of this study was to investigate the influence of additional etching on the adhesion of resin composite to enamel. Ninety extracted bovine permanent anterior teeth were used. The labial surfaces of the crown were ground with 600-grit abrasive paper under wet condition. The teeth were randomly divided into six groups of 15 teeth each. Clearfil SE $Bond^{\circledR},\;Adper^{TM}$ Prompt L-Pop and Tyrian $SPE^{TM}$ were used as self-etching primers. Each self-etching primers were applied in both enamel specimens with and without additional etching. For additional etching groups, enamel surface was pretreated with 32% phosphoric acid (UNI-ETCH, Bisco, Inc., Schaumburg, IL. USA). Hybrid resin composite Clearfil AP-X, (Kuraray Co., Ltd., Osaka, Japan) was packed into the mold and light-cured for 40 seconds. Twenty-four hours after storage, the specimens were tested in shear bond strength. The data for each group were subjected to independent t - test at p < 0.01 to make comparisons among the groups. In Clearfil SE $Bond^{\circledR}$, shear bond strength of additional etching group was higher than no additional etching group (p < 0.01). In $Adper^{TM}$ Prompt L-Pop and Tyrian SPE, there were no significant difference between additional etching and non-etching groups (p > 0.01). In conclusion, self-etching adhesive system with weak acid seems to have higher bond strength to enamel with additional etching, while self-etching adhesive system with strong acid seems not.

Effect of additional etching and ethanol-wet bonding on the dentin bond strength of one-step self-etch adhesives

  • Ahn, Joonghee;Jung, Kyoung-Hwa;Son, Sung-Ae;Hur, Bock;Kwon, Yong-Hoon;Park, Jeong-Kil
    • Restorative Dentistry and Endodontics
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    • v.40 no.1
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    • pp.68-74
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    • 2015
  • Objectives: This study examined the effects of additional acid etching on the dentin bond strength of one-step self-etch adhesives with different compositions and pH. The effect of ethanol wetting on etched dentin bond strength of self-etch adhesives was also evaluated. Materials and Methods: Forty-two human permanent molars were classified into 21 groups according to the adhesive types (Clearfil SE Bond [SE, control]; G-aenial Bond [GB]; Xeno V [XV]; Beauti Bond [BB]; Adper Easy Bond [AE]; Single Bond Universal [SU]; All Bond Universal [AU]), and the dentin conditioning methods. Composite resins were placed on the dentin surfaces, and the teeth were sectioned. The microtensile bond strength was measured, and the failure mode of the fractured specimens was examined. The data were analyzed statistically using two-way ANOVA and Duncan's post hoc test. Results: In GB, XV and SE ($pH{\leq}2$), the bond strength was decreased significantly when the dentin was etched (p < 0.05). In BB, AE and SU (pH 2.4 - 2.7), additional etching did not affect the bond strength (p > 0.05). In AU (pH = 3.2), additional etching increased the bond strength significantly (p < 0.05). When adhesives were applied to the acid etched dentin with ethanol-wet bonding, the bond strength was significantly higher than that of the no ethanol-wet bonding groups, and the incidence of cohesive failure was increased. Conclusions: The effect of additional acid etching on the dentin bond strength was influenced by the pH of one-step self-etch adhesives. Ethanol wetting on etched dentin could create a stronger bonding performance of one-step self-etch adhesives for acid etched dentin.

RESIN TAG FORMATION OF SELF-ETCHING ADHESIVES (자가부식 접착제의 레진 Tag 형성)

  • Kim, Young-Jae;Jang, Ki-Taeg
    • Journal of the korean academy of Pediatric Dentistry
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    • v.30 no.1
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    • pp.143-152
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    • 2003
  • The aims of the present study was to observe resin tag of the resin/enamel, dentin interface produced by self-etching adhesive systems and evaluate effect of additional acid etching on resin tag formation. Three self-etching primer(SE bond, AQ bond and L Pop) and an one bottle adhesive(Single bond) were used. Flat occlusal enamel and dentin disks were obtained from extracted human molars. A total of 20 surfaces were collected and divided into four groups of 5 samples. One-half of each specimen in each group was etched with 35% phosphoric acid prior to the application of each adhesive system, with the second half being kept unetched. Subsequently, resin composite was placed and polymerized. The samples were sliced and immersed into HCl and NaOCl solutions, followed by drying and sputter coating for examination with a SEM. The results were as follows; 1. Additional etching side of dentin displayed longer and thicker resin tag than unetched side in all self-etching adhesive groups. 2. In enamel, additional etching side displayed deeper and more distinct etching pattern than unetched side except L Pop. There is no difference between etched and unetched enamel in L Pop. The results obtained suggest the self-etching adhesive did not etch enamel and penetrate into dentinal tubule as deeply as did additional etching. Further research should include the evaluation of the relationship of boding strength, microleakage and resin tag morphology.

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Nanoscale Processing on Silicon by Tribochemical Reaction

  • Kim, J.;Miyake, S.;Suzuki, K.
    • Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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    • 2002.10b
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    • pp.67-68
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    • 2002
  • The properties and mechanism of silicon protuberance and groove processing by diamond tip sliding using atomic force microscope (AFM) in atmosphere were studied. To control the height of protuberance and the depth of groove, the processed height and depth depended on load and diamond tip radius were evaluated. Nanoprotuberances and grooves were fabricated on a silicon surface by approximately 100-nm-radius diamond tip sliding using an atomic force microscope in atmosphere. To clarify the mechanical and chemical properties of these parts processed, changes in the protuberance and groove profiles due to additional diamond tip sliding and potassium hydroxide (KOH) solution etching were evaluated. Processed protuberances were negligibly removed, and processed grooves were easily removed by additional diamond tip sliding. The KOH solution selectively etched the unprocessed silicon area. while the protuberances, grooves and flat surfaces processed by diamond tip sliding were negligibly etched. Three-dimensional nanofabrication is performed in this study by utilizing these mechanic-chemically processed parts as protective etching mask for KOH solution etching.

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EFFECT OF THE ADDITIONAL ETCHING PROCEDURE ON PUSH-OUT BOND STRENGTH OF ONE-STEP RESIN CEMENT (부가적 부식 과정이 단일 접착 과정 레진 시멘트의 접착 강도에 미치는 영향)

  • Kang, Soon-Il;Park, Jeong-Kil;Hur, Bock;Kim, Hyeon-Cheol
    • Restorative Dentistry and Endodontics
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    • v.33 no.5
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    • pp.443-451
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    • 2008
  • The purpose of this study was to evaluate the effect of additional etching procedure prior to Maxcem resin cement application in indirect restoration cementation using push-out bonding strength. One hundred and two extracted human molars were used to make indirect resin restorations of gold inlay and Synfony. These restorations were cemented using Maxcem and Variolink II. Additional etching procedures were done for one group with Maxcem. Three groups have 17 specimens in both restoration types. Push-out bond strength was measured using multi-purpose tester and calculated for bonding strength per sqaure-millimeter area. The mean bonding strength values were compared using SPSS 12.0K program for one-way ANOVA and Scheffe's Test with 95% significance. Under the condition of this study, the additional etching procedure prior to usage of Maxcem resulted in reduced bond strength for both of restoration types.

Si(100) ETCHING BY THERMAL-ENERGY HYDROGEN ATOMS

  • Kang, Joo-Hyun;Jo, Sam-Keun;John G. Ekerdt
    • Journal of the Korean Vacuum Society
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    • v.6 no.S1
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    • pp.59-65
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    • 1997
  • Efficient Si(100) etching by thermal H atoms at low substrate temperatures has been achieved. Gas-phase etching product $SiH_4$(g) upon H atom bombardment resulting from direct abstraction of $SiH_3$(a) by impinging H atoms was detected with a quadrupole mass spectrometer over the substrate temperature range of 105-408 K Facile depletion of all surface silyl ($SiH_3$) groups the dissociative adsorption product of disilane ($Si_2H_6$) at 105K from Si(100)2$\times$1 by D atoms and continuous regeneration and removal of $SiD_3$(a) were all consumed. These results provide direct evidence for efficient silicon surface etching by thermal hydrogen bombardment at cryogenic temperatures as low as 105K We attribute the high etching efficiency to the formation and stability of $SiH_3$(a) on Si(100) at lowered surface temperatures allowing the $SiH_3$(a) abstraction reaction by additional H atom to produce $SiH_4$((g).

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