• Restorative Dentistry and Endodontics
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• 제21권1호
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• pp.136-149
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• 1996

The effects of various All-Etching Agents (10% phosphoric acid, 10% maleic acid and 10 % citric acid) and 32 % phosphoric acid and varied etching time were evaluated by observing the morphology of the etched enamel surfaces using Scanning electron microscopy and by measuring the shear bond strength of a composite resin to human enamel. A total of 156 extracted premolar and molar teeth free of irregularities were employed in this study. Specimens for the observation of enamel morphology were divided into 12 groups of 3 teeth each, based on the type of etchant used and application time. After exposure to the etching agent specimens were washed air-dried and then glued to aluminum stubs and coated with a layer of gold for examination in the scanning electron microscope. Specimens for the evaluation of bond strength were divided into 12 groups of 10 teeth each also based on the type of etchant used and application time. After exposure to the etching agent the specimens were washed, air-dried and a thin layer of bonding agent was applied using a brush. Z 100 composite resin was light cured to the surface and stored at $37^{\circ}C$, 100% humidity for 7 days. An Instron Universal Testing Machine was used to apply a shearing force at $90^{\circ}$ angle from the enamel surface. It is concluded from this study that commercial All-etching agents can be used with a 15-second etching without adversely affecting retention of dental resin materials. At the same time, the acid concentration is probably a suitable compromise regarding the acid's function as a dentin demineralizing all-etch conditioning agent. The following results were obtained. 1. Specimens etched with 10 % citric acid showed a random superficial etching pattern which could not be related to prism morphology. 2. Specimens etched with 10 % and 32 % phosphoric acid and 10 % maleic acid showed a type I pattern in which core material was preferentially removed leaving the prism peripheries relatively intact or a type II pattern in which prism peripheries were preferentially removed. This delineation became more distinguished as etching time was increased. 3. All-Etching Agents and 32 % phosphoric acid showed a statistically significant higher shear bond strength at 15 seconds etching time.(p<0.05) 4. 10 % maleic acid and 32 % phosphoric acid exhibited a statistically significant higher shear bond strength than 10 % phosphoric and citric acid at 15 seconds etching time.(p<0.05).

• 반도체디스플레이기술학회지
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• 제13권3호
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• pp.13-19
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• 2014

Phosphoric acid was used as etching agent instead of conventional peroxide - based chemicals for forming pattern of ultra definition display. Etchant was synthesized by mixing etching agent, oxidation agent, buffer solution, and additive into solvent, deionized water. Thicknesses of copper, main metal of ultra definition display, for etching, were 10,000 and $30,000{{\AA}}$. Etch stop of good low skew for proper pattern formation has been occurred at the content ratio of phosphoric acid 60 - 64%, nitric acid 4 - 5%, additive(potassium acetate) 1 - 3%. Buffer solution(acetic acid) decreased the metal contact angle $63.07^{\circ}$ to $42.49^{\circ}$ for benefiting pattern formation. Content variations on four components (phosphoric acid, nitric acid, acetic acid, potassium acetic acid) of the etchant with storage time were within 3 wt% after 24 hrs of etching work.

• 한국표면공학회지
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• 제49권3호
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• pp.231-237
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• 2016

This article reports a new chemical bath for preparing a mirror-like surface of AZ31 Mg alloy. In order to find an appropriate chemical polishing solution, four different acidic solutions of sulphuric acid, nitric acid, acetic acid and a specially designed mixture of nitric acid and acetic acid were investigated in view of the changes in surface appearance, roughness and dissolution rate of AZ31 Mg alloy. The surface scales on AZ31 Mg alloy were readily removed by all the acidic solutions, but a reflective surface was produced only by etching in the specially designed solution, and only after a specific etching time. The surface roughness increased with etching time in sulphuric acid, nitric acid, and acetic acid, but it lowered after a specific etching time in the specially designed mixture of nitric acid and acetic acid. Dissolution rate of the alloy in the specially designed mixture of nitric acid and acetic acid appeared to be more than twice than that in separate nitric acid or acetic acid. In this work, we recommend the mirror-like surface of AZ31 Mg alloy obtained by polishing for an optimum time in a mixture of nitric acid and acetic acid for following surface finishings, chemical conversion coating, electroplating, electrophoretic painting and anodizing treatment.

• 한국콘텐츠학회논문지
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• 제18권10호
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• pp.361-367
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• 2018

이 연구의 목적은 불화 수소산 에칭 처리가 안정화된 정방 정계 지르코니아 다결정 (Y-TZP)의 결합 강도에 미치는 영향을 평가하는 것이었다. 4 그룹의 지르코니아 - 수지 시멘트 시편을 준비 하였다. 1) ZGS 그룹 (zirconia, no treatment) 2) ZGSH 그룹 (zirconia, hydrofluoric acid etching treatment) 3) H-ZGS 그룹 (Hybrid zirconia, no treatment) 4) H-ZGSH 그룹 (Hybrid zirconia, hydrofluoric acid etching treatment). 지르코니아와 도재 사이의 전단 결합 강도는 Instron Universal Testing Machine (ModelBBP-500, Instron Corporation, Kyunggi, Korea)을 사용하여 측정 하였다. 독립표본 t-test와 two-way ANOVA (${\alpha}=0.05$)를 사용하여 데이터를 통계적으로 분석했다. 세라믹 - 수지 시멘트 결합강도는 불화 수소산 에칭 처리에 영향을 받았다 (p <0.05). 파단 표면의 디지털 현미경 검사는 불화 수소산 에칭 처리한 표면처리 된 지르코니아 및 하이브리드 지르코니아 그룹에서 접착성 및 응집성 파절이 동시에 발생하는 결함을 보였다.

• 한국의류산업학회지
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• 제3권4호
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• pp.344-350
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• 2001

Wool fabrics were treated with dichloro isocyanuric acid (DCCA) and dyed with acid dyes (C.I. Acid Red 18), and then, they were treated by sputter etching. Wool fabrics had been sputtered with aluminium under various conditions such as sputter etching time and discharge power in the presence of argon gas. We compared mechanical properties, colour difference and fastness properties of these samples one another: Mechanical properties and colour difference of sputtered wool fabrics changed by sputter etching time, discharge power and DCCA concentration. Light fastness showed a rising tendency but rubbing fastness showed a downward tendency when sputter etching time was 7 minutes.

• 대한소아치과학회지
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• 제10권1호
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• pp.85-93
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• 1983

In one group that tested for the effects of grinding and etching on the deciduous teeth, S.E.M. examination on the ground or unground labial surface of deciduous maxillary central incisors were made after etching procedure with 40% phosphoric acid for 60 secs., 120 secs., 180 sees. each. In another group that tested for the degree of resin penetration to the ground and etched deciduous teeth, composite resin application was done to the ground deciduous maxillary central incisors that had been acid-etched for 30 secs., 60 secs., 90 sees., 120 sees., 180 secs. each. The tooth-resin specimens were cut at the middle 1/3 of the crown by 2mm thickness, and the adjacent tooth materials were demineralized by 10% hydrochloric acid, the author observed the tags of the resin replica with S.E.M.. Following results were obtained. 1. After 40% phosphoric acid etching, the unground deciduous enamel surface showed various types of etching pattern. 2. For the formation of regular micropores on deciduous enamel surface by acid etching with 40% phosphoric acid, the time over 120 secs. should be requested. 3. After 40% phosphoric acid etching, the ground deciduous enamel surface showed the same etching pattern that has been a preferential removal of prism peripheries despite different etching time. 4. On the ground group that etched over 60 secs. to 180 secs., the length of tags was $5{\mu}m$ to $8{\mu}m$, with a mean of $7{\mu}m$.

• Restorative Dentistry and Endodontics
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• 제6권1호
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• pp.37-50
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• 1980

Scanning Electron Microscopic (SEM) examination on the labial surface of 91 permanent upper incisors were made after etching procedure with phosphoric acid, sulfuric acid, nitric acid, hydro chloric acid, oxalic acid, formic acid, citric acid and zinc phosphate liquid for 2 minutes. Following results were obtained. 1. In the surfaces etched by 10%. 50% phosphoric acid, 50% sulfuric acid, 10%. 30% nitric acid, 10%. 50% oxalic acid, 10%. 30%. 50% formic acid, 30%. 50% citric acid and zinc phosphate liquid, there appeared to be a preferential removal of prism cores, but in the surfaces etched by 10% phosphoric acid, 50% nitric acid, 10%. 30% hydrochloric acid and 30% oxalic acid, the prism peripheries were removed preferentially. 2. According to Silverstone classification on enamel etching pattern the surface treated by zinc phosphate liquid, 30. 50% citric acid, 10%. 30%. 50% formic acid, 10%. 50% oxalic acid, 10%. 30% nitric acid, 50% sulfuric acid and 10%. 50%. phosphoric acid showed Type 1, and etched by 30% oxalic acid, 10%. 30% hydrochloric acid, 50% nitric acid and 10% phosphoric acid showed Type II. Etching of prism cores was by far the most common occurence. The changes produced could be related to intrinsic differences in histology and / or solubility of enamel.

• 한국표면공학회지
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• 제47권3호
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• pp.128-136
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• 2014

In the present study, we successfully developed an eco-friendly chemical etching solution and proper condition for plating on ABS material. The mechanism of forming Ni plating layer on ABS substrate is known as following. In general, the etching solution used for the etching process is a solution of chromic acid and sulfuric acid. The etching solution is given to the surface resulting in elution of butadiene group, so-called anchor effect. Such a rough surface can easily adsorb catalyst resulting in the increase of adhesion between ABS substrate and Ni plating layer. However a use of chromic acid is harmful to environment. It is, therefore, essential to develop a new alternative solution. In the present study, we proposed an eco-friendly etching solution composed of potassium permanganate, sulfuric acid and phosphoric acid. This solution was testified to observe the surface microstructure and the pore size of electrical Ni plating layer, and the adhesive correlation between deposited layers fabricated by electro Ni plating was confirmed. The result of the present study, the newly developed, eco-friendly etching solution, which is a mixture of potassium permanganate 25 g/L, sulfuric acid 650ml/L and phosphoric acid 250ml/L, has a similar etching effect and adhesion property, compared with the commercially used chromium acid solution in the condition at $70^{\circ}C$ for 5 min.

• 대한치과교정학회지
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• 제43권1호
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• pp.23-28
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• 2013

Objective: The purpose of this study was to evaluate the effect of casein phosphopeptide amorphous calcium phosphate (CPP-ACP) on the shear bond strength (SBS) of brackets bonded to non-demineralized teeth with either phosphoric acid etching or self-etching primer. Methods: Sixty human premolars were randomly assigned to 1 of 4 treatment groups (n = 15 each): phosphoric acid etching (group 1); self-etching primer (group 2); CPP-ACP for 2 weeks + phosphoric acid etching (group 3), and CPP-ACP for 2 weeks + self-etching primer (group 4). After bonding of the maxillary premolar metal brackets, specimens were subjected to shear forces in a testing machine. Scanning electron microscopy was used to observe etching patterns on the enamel surfaces of all teeth. A 2-way analysis of variance was used to test for effects of CPP-ACP and etching system on SBS. Results: Significantly higher mean SBSs were observed in groups subjected to phosphoric acid etching (i.e., groups 1 and 3; p < 0.05). On the other hand, SBSs did not appear to be influenced by CPP-ACP (i.e., groups 3 and 4; p > 0.05). We observed a uniform and clear etched pattern on the enamel surface of the phosphoric acid etching groups. Conclusions: CPP-ACP does not significantly affect the SBS of orthodontic brackets bonded to non-demineralized teeth, regardless of which adhesive method is used to bond the brackets.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 추계학술대회 논문집
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• pp.70-71
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• 2007

Multicrystalline silicon(mc-Si) solar cells are steadily increasing their share of the PV market due to the lower material costs. However, commercial mc-Si solar cells have lower efficiency than singlecrystalline silicon solar cells. To improve efficiency of mc-Si solar cells, it is important to reduce optical losses from front surface reflection. Isotropic etching with acid solution based on hydrofluoric acid(HF) and nitric acid$(HNO_3)$ is one of the promising methods that can reduce surface reflectance for mc-Si solar cells. Anisotropic etching is not suitable for mc-Si because of its various grain orientations. In this paper, we isotropically etched mc-Si using acid solution. After that, etched surface was observed by Scanning Electron Microscope(SEM) and surface reflectance was measured. We obtained 29.29% surface reflectance by isotropic etching with acid solution in wavelength from 400nm to 1000nm for fabrication of mc-Si solar cells.