• 한국분말재료학회지
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• 제12권1호
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• pp.30-35
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• 2005

An aluminum powder compact consolidated by a powder-in sheath rolling (PSR) method was severely deformed by accumulative roll-bonding (ARB) process. The ARB process was performed up to 8 cycles at ambient temperature without lubrication. Optical microscope and transmission electron microscope observations revealed that microstructure of the ARB-processed Al powder compact is inhomogeneous in the thickness direction. The ultra-fine subgrains often reported in the ARB-processed bulky materials were also developed near surface of the Al powder compacts in this study. Tensile strength of the ARB-processed Al powder compact increased at the 1st cycle, but from the 2nd cycle it rather decreased slightly.

• 소성∙가공
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• 제14권1호
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• pp.71-77
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• 2005

Thermal stability and dry sliding wear behavior of ultra-fine grained 6061 Al alloy fabricated by an accumulative roll-bonding (ARB) process have been investigated. After 4 ARB cycles, an ultra-fine grained microstructure of the 6061 Al alloy composed of grains with average size of 500nm, and separated mostly by high-angle boundaries was obtained. Though hardness and tensile strength of the ARB processed Al alloy increased with ARB cycles up to 4 cycles, the processed alloy exhibited decreased ductility and little strain hardening. Thermal stability of the ARB-processed microstructure was studied by annealing of the severely deformed alloy at $423K{\sim}573K$. The refined microstructure of the alloy remained stable up to 473K, and the peak aging treatment of the alloy at 450K for 8 hrs increased the thermal stability of the alloy. Sliding-wear rates of the alloy increased with the number of ARB cycles in spite of the increased hardness with the cycles. Wear mechanisms of the ultra-fine grained alloy were investigated by examining worn surfaces, wear debris, and cross-sections by a scanning electron microscopy (SEM).

• 한국재료학회지
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• 제19권8호
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• pp.432-436
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• 2009

A Cu-Fe-P copper alloy was processed by accumulative roll-bonding (ARB) for ultra grain refinement and high strengthening. Two 1mm thick copper sheets, 30 mm wide and 300 mm long, were first degreased and wire-brushed for sound bonding. The sheets were then stacked on top of each other and roll-bonded by about 50% reduction rolling without lubrication at ambient temperature. The bonded sheet was then cut into two pieces of the same dimensions and the same procedure was repeated for the sheets up to eight cycles. Microstructural evolution of the copper alloy with the number of the ARB cycles was investigated by optical microscopy (OM), transmission electron microscopy(TEM), and electron back scatter diffraction(EBSD). The grain size decreased gradually with the number of ARB cycles, and was reduced to 290 nm after eight cycles. The boundaries above 60% of ultrafine grains formed exhibited high angle boundaries above 15 degrees. In addition, the average misorientation angle of ultrafine grains was 30 degrees.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2003년도 춘계학술대회논문집
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• pp.84-87
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• 2003

Microstructural evolution and dry sliding wear behavior of ultra-fine grained 5052 Al alloy obtained by an accumulative roll-bonding process have been investigated. After 7 ARB cycles, ultra-fine grains with large misorientations between neighboring grains were obtained. The grain size was about 0.2$\mu\textrm{m}$. The hardness, tensile and yield strengths of the ultra-fine grained alloy increased as the amount of accumulated strain increased with the ARB cycles. Sliding wear teats of the ultra-fine grained 5052 Al alloy were conducted at room temperature. Wear rate of the ultra-fine grained alloy increased in spite of the increase of hardness. Surfaces of the worn specimens were examined with SEM to investigate wear mechanism of the ultra-fine grained alloy.

• 소성∙가공
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• 제12권4호
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• pp.376-381
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• 2003

Microstructural evolution and dry sliding wear behavior of ultra-fine grained 5052 Al alloy obtained by an accumulative roll-bonding process have been investigated. After 7 ARB cycles, ultra-fine grains with a large misorientation between neighboring grains were obtained. The grain size was about 0.2 $\mu$m. The hardness, tensile and yield strengths of the ultra-fine grained alloy increased as the amount of accumulated strain increased with the ARB cycles. Sliding wear tests of the ultra-fine grained 5052 Al alloy were conducted at room temperature. Wear rate of the ultra-fine grained alloy increased in spite of the increase of hardness. Surface of the worn specimens were examined with SEM to investigate wear mechanism of the ultra-fine grained alloy.

• 한국재료학회지
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• 제17권10호
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• pp.521-525
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• 2007

The microstructure and mechanical properties of an oxygen free copper processed by accumulative roll bonding(ARB) at low strain rate were studied. The copper sheets were highly strained up to an equivalent strain of ${\sim}6.4$ by ARB process at ambient temperature. The strain rate of the copper during the ARB was $2.6sec^{-1}$. The microstructure and mechanical properties of the ARB-processed copper were compared to those of the specimens processed by ARB at relatively high strain rate ($37sec^{-1}$). The microstructure and mechanical properties of the copper with ARB process was very similar to each other despite of some differences in recovery.

• 한국재료학회지
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• 제16권9호
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• pp.592-597
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• 2006

A deoxidized low-phosphorous (DLP) copper was processed by accumulative roll-bonding (ARB) for ultra grain refinement and high strengthening. Two copper sheets 1 mm thick, 30 mm wide and 300 mm long are first degreased and wire-brushed for sound bonding. The sheets are then stacked to each other, and roll-bonded by about 50% reduction rolling without lubrication at ambient temperature. The bonded sheet is then cut to the two pieces of same dimensions and the same procedure was repeated to the sheets up to eight cycles (${\varepsilon}{\sim}6.3$). TEM observation revealed that ultrafine grains were developed after the 4th cycle, and their size decreased at higher cycles. Tensile strength of the copper increased with the equivalent strain, and it reached 547 MPa which was 3 times higher than that of the initial material. It is concluded that the ARB process is an effective method for high strengthening of the DLP copper.

• 한국분말재료학회지
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• 제13권1호
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• pp.39-45
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• 2006

The $Al/SiC_p$ particle reinforced composite fabricated by a powder-in sheath rolling (PSR) method was severely. deformed by the accumulative roll-bonding (ARB) process. The ARB process was performed up to 8 cycles at ambient temperature without lubricant. The ARBed composite exhibited an ulbricant. grained structure similar to the other ARBed bulky materials. Tensile strength of the composite increased gradually with the number of ARB cycles, but from the 6th cycle it rather decreased slightly. These characteristics of the composite were somewhat different from those of Al powder compact fabricated by the same procedures. The difference in microstructure and mechanical properties between Al powder compact and the composite was discussed.

• 한국재료학회지
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• 제17권7호
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• pp.361-365
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• 2007

A deoxidized low-phosphorous copper processed by eight cycles of accumulative roll-bonding (ARB) was annealed at various temperatures ranging from 100 to $400^{\circ}C$. The annealed copper was characterized by transmission electron microscopy (TEM) and tensile & hardness test. TEM observation revealed that the ultrafine grains developed by the ARB still remained up to $350^{\circ}C$, however above $400^{\circ}C$ they were replaced by equiaxed and coarse grains due to an occurrence of the static recrystallization. The hardness of the copper decreased slightly with the annealing temperature up to $350^{\circ}C$, however they dropped largely above $400^{\circ}C$. Annealing characteristics of the copper were compared with those of an oxygen free copper processed by ARB and subsequently annealed.

• 한국재료학회지
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• 제15권9호
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• pp.555-559
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• 2005

An oxygen free copper severely-deformed by eight cycles (an equivalent strain of $\~6.4$) of accumulative roll-bonding (ARB) was annealed at various temperatures ranging from 100 to $300^{\circ}C$. The annealed copper was characterized by transmission electron microscopy (TEM) and tensile & hardness test. TEM observation revealed that the ultrafine grains developed by the ARB still remained up to $150^{\circ}C$, however above $200^{\circ}C$ they were replaced by equiaxed and coarse grains due to an occurrence of the static recrystallization. Tensile strength and hardness of the copper decreased slightly with the annealing temperature up to $150^{\circ}C$, however they dropped largely above $200^{\circ}C$. Annealing characteristics of the copper were compared with those of a commercially pure aluminum processed by ARB and subsequently annealed.