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http://dx.doi.org/10.3740/MRSK.2007.17.7.361

Change in Microstructure and Mechanical Properties of Deoxidized Low-Phosphorous Copper Processed by Accumulative Roll-Bonding with Annealing  

Lee, Seong-Hee (Department of Advanced Materials Science and Engineering, Mokpo National University)
Kim, Chun-Su (Department of Advanced Materials Science and Engineering, Mokpo National University)
Kim, Sang-Shik (Division of Materials Science and Engineering, Engineering Research Institute, Gyeongsang National University)
Han, Seung-Zeon (Department of Materials Technology, Korea Institute of Machinery and Materials)
Lim, Cha-Yong (Department of Materials Technology, Korea Institute of Machinery and Materials)
Publication Information
Korean Journal of Materials Research / v.17, no.7, 2007 , pp. 361-365 More about this Journal
Abstract
A deoxidized low-phosphorous copper processed by eight cycles of accumulative roll-bonding (ARB) was annealed at various temperatures ranging from 100 to $400^{\circ}C$. The annealed copper was characterized by transmission electron microscopy (TEM) and tensile & hardness test. TEM observation revealed that the ultrafine grains developed by the ARB still remained up to $350^{\circ}C$, however above $400^{\circ}C$ they were replaced by equiaxed and coarse grains due to an occurrence of the static recrystallization. The hardness of the copper decreased slightly with the annealing temperature up to $350^{\circ}C$, however they dropped largely above $400^{\circ}C$. Annealing characteristics of the copper were compared with those of an oxygen free copper processed by ARB and subsequently annealed.
Keywords
accumulative roll-bonding; annealing; deoxidized low-phosphorous copper; transmission electron microscopy; mechanical property;
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Times Cited By KSCI : 3  (Citation Analysis)
Times Cited By SCOPUS : 3
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