• 대한전기학회:학술대회논문집
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• 대한전기학회 2006년도 제37회 하계학술대회 논문집 A
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• pp.603-604
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• 2006

We investigated the effects of oxidizer additive on the performance of Cu-CMP process using commonly used tungsten slurry. According to the CMP removal rates and particle size distribution, and the micro- structures of surface layer as a function of oxidizer contents were greatly influenced by the slurry chemical composition of oxidizers. The difference in removal rate and roughness of copper surface are believed to cause by modification in the mechanical behavior of $Al_{2}O_3$ abrasive particles in CMP slurry.

• 한국윤활학회:학술대회논문집
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• 한국윤활학회 1998년도 제27회 춘계학술대회
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• pp.91-96
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• 1998

In recent years, the tribological behavior of coated ceramic material has been the topic of much interest. Particularly, the understanding of the tribological performance of thin film under light load is important for potential applications in MEMS. In this work under light load and low speed, the tribological behavior of coated silicon was investigated. The results show that both adhesive and abrasive wear occur depending on the sliding condition. Also the effect of humidity on friction was influenced by the apparent ares of contact between the two surfaces. Finally, undulations on the silicon wafer were found to be effective in trapping wear particles.

• 대한기계학회논문집A
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• 제33권4호
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• pp.329-336
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• 2009

A fretting wear test rig for cross contacting tube specimens, which employs a piezoelectric actuator, has been developed. Along with the simple loading scheme using dead weights, the rig is very simple to be used also. The accuracy was found acceptable. Inconel 690 tubes were tested in room temperature and ambient condition. Normal load and sliding amplitude range up to 35N and $100{\mu}m$, respectively. The sizes of wear scar and the wear volumes were measured, and wear coefficients have been calculated based on those. A study on the fretting wear mechanism of the tubes has been attempted via microscopic observation. Rugged wear surfaces are induced by the separation and adhesion of particles and formation and subsequent fracture of surface layers. Lapped specimens were also tested and abrasive wear seems to be playing a dominant role.

• 한국정밀공학회지
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• 제20권6호
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• pp.27-36
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• 2003

The Electro-Rheological (ER) fluid has been used to the ultraprecision polishing of single crystal silicon as new polishing slurry whose properties such as yield stress and particle structure changed with the application of an electric field. In this work, it is aimed to find the effective parameters in the ER fluid on material removal in the polishing system whose structure is similar to that of the simple hydrodynamic bearing. The generated pressure in the gap between a moving wall and a workpiece, as well as the electric field-induced stress of the mixture of ER fluid-abrasives, is evaluated experimentally, and their influence on the polishing of single crystal silicon is analyzed. Moreover, the behavior of abrasive and ER particles is described.

• International Journal of Precision Engineering and Manufacturing
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• 제5권2호
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• pp.32-38
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• 2004

The electrorheological(ER) fluid has been used to the ultraprecision polishing of single crystal silicon as new polishing slurry whose properties such as yield stress and particle structure changed with the application of an electric field. In this work, it is aimed to find the effective parameters in the ER fluid on material removal in the polishing system whose structure is similar to that of the simple hydrodynamic bearing. The generated pressure in the gap between a moving wall and a workpiece, as well as the electric field-induced stress of the mixture of ER fluid-abrasives, is evaluated experimentally, and their influence on the polishing of single crystal silicon is analyzed. Moreover, the behavior of abrasive and ER particles is described.

• Tribology and Lubricants
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• 제15권1호
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• pp.29-38
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• 1999

In recent years, the tribological behavior of coated ceramic material has been the issue of much interest. Particularly, the understanding of the tribological performance of thin film under light load is important for its potential in applications of MEMS. The friction and wear behavior of ceramic material that occur at light load depends on several factors such as surface roughness, contact area and material properties. In this work, the tribological behavior of coated silicon under light load and low speed was investigated. Particularly, the effects of coated materials, humidity and undulated surface were also studied. The results show that the effect of humidity on fiction was influenced by the apparent area of contact between the two surfaces. Also both adhesive and abrasive wear occurred depending on the sliding condition. Finally, undulations on the silicon wafer were found to be effective in trapping wear particles and resulted in the reduction of friction.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2000년도 춘계학술대회논문집A
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• pp.772-779
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• 2000

The friction and wear behavior of short carbon fiber reinforced polyetheretherketone was studied experimentally under dry sliding conditions against SCM440(AISI 4140) disks with a different surface roughness and hardness at the low sliding speeds and the high pressures on a pin-on-disk apparatus. Under the low disk surface roughness value the earsplitting noise and stick-slip were occurred. The increased adhesion friction and wear factor with stick-slip made the friction and wear behavior worse. Under the high disk surface hardness the break and falling-off of carbon fibers were accelerated. The carbon fibers fallen off from the matrix were ground into powder between two wear surfaces and this phenomenon caused a abrasive friction and wear factor to increase. So the friction and wear behavior became worse. With the transfer film made of wear particles formed on a disk, the carbon powder film formed on a pin lowered a friction coefficient.

• Journal of Welding and Joining
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• 제17권6호
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• pp.62-69
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• 1999

The advantages of Thermal sprayed coatings as a replacement for cast iron liners are reduced weight, better heat transfer and reduced cost. One of the most important performance attributes of a cylinder bore coating is its wear resistance, since it must survive the abrasive sliding of both the piston rings and the piston skirt. In this study, composite powders were prepared by ball milling of Al-13Si-3Mg(wt%) alloy with SiC particles. The concentrations of SiC were 40 and 60wt%. The composite powders were sprayed using Metco-9MB plasma torch. Plasma sprayed coatings were heat-treated at 500℃ for 3 hours. The wear resistances of the plasma sprayed coatings were found to improve with heat treatment and superior to the commercially available G.C.I.(gray cast iron). AlSiMg-40SiC heat-treated coatings showed the best wear resistance in this study.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2006년도 제37회 하계학술대회 논문집 B
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• pp.1269-1270
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• 2006

We investigated the effects of oxidizer additive on the performance of Cu-CMP process using commonly used tungsten slurry. According to the CMP removal rates and particle size distribution, and the micro-structures of surface layer as a function of oxidizer contents were greatly influenced by the slurry chemical composition of oxidizers. The difference in removal rate and roughness of copper surface are believed to cause by modification in the mechanical behavior of $Al_2O_3$ abrasive particles in CMP slurry.

• 반도체디스플레이기술학회지
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• 제6권2호
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• pp.35-40
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• 2007

An integrated material removal model considering thermal, chemical and contact mechanical effects in CMP process is proposed. These effects are highly coupled together in the current modeling effort. The contact mechanics is employed in the model incorporated with the heat transfer and chemical reaction mechanisms. The mechanical abrasion actions happening due to the mechanical contacts between the wafer and abrasive particles in the slurry and between the wafer and pad asperities cause friction and consequently generate heats, which mainly acts as the heat source accelerating chemical reaction(s) between the wafer and slurry chemical(s). The proposed model may be a help in understanding multi-physical interactions in CMP process occurring among the wafer, pad and various consumables such as slurry.