• Korean Journal of Materials Research
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• v.15 no.12
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• pp.818-823
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• 2005

Sub-micron colloidal silica particles coated with nano-sized ceria were prepared by mixing of its silica and cerium salts hydrolysis, and modified by hydrothermal reaction. By using the slurries with and without hydrothermal modification containing above particles, oxide film coated on silicon wafer was polished. The modified slurries had higher polish rate due to increase of ceria fraction to silica through hydrothermal reaction. They revealed higher stability in wide range of pH $2\~10$ than ceria coated silica slurries without its modification.

• Tribology and Lubricants
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• v.25 no.1
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• pp.49-55
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• 2009

The frictional properties of automotive brake pads with four different ceramic materials such as magnesia, hematite, alumina, and zircon were investigated. A Krauss type friction tester using gray iron disks was used to examine the friction coefficient, intensity of friction force oscillation, and the tribe-surfaces. Results showed that the friction coefficient increased as the hardness of abrasives increases. Friction oscillation was also increased with hardness of the abrasives. However, the friction materials containing less abrasive particles produced stable friction films on the sliding surface. The transition between two-body and three body abrasion during sliding also played a crucial role in destructing the friction film on the pad surface and in determining various frictional properties.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.10a
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• pp.915-918
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• 1997

An internal finishing process by the application of magnetic abrasive machining has been developed as a new technology to obtain a fine inner surface of pipe. In this paper, an abrasive circulation system was designed and manufactured. As a result, it was found that a fine inner surface abrasive of pipe was available by the use of this machining methods. The basic machining characteristics of pin-type magnetic tools were analyzed experimentally. In addition, the experimental results show that we can realize that pin-type magnetic tools have more machining efficiency than iron particles as magnetic tools.

• Proceedings of the Korean Ceranic Society Conference
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• 2003.04a
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• pp.156.2-156
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• 2003

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.05a
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• pp.520-523
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• 2002

The o]d technique of sandblasting which has been used for paint or scale removing, deburring, and glass decorating has recently been developed into a powder blasting technique for brittle materials, capable of producing micro structures larger than $100\mu\textrm{m}$. In this study, we investigated the effect of the size of abrasive and the stand-off distance on the machinability of SUS 304. The varying parameters were the impact angle $90^{\circ}$, scanning times of nozzle 10 and the different nozzle height between 70mm and 140mm. The diameter of dot pattern were 0.2mm. The powder were alumina sharp particles, WA #600, #800 and #2000. The blasting pressure of powder at 0.3 Mpa.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.3 no.1
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• pp.38-44
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• 2004

An internal finishing process by the application of magnetic abrasive machining has been developed as a new technology to obtain a fine inner surface of non-ferromagnetic pipe. In this paper, an abrasive slurry circulation system was designed and manufactured. As a result, it was found that a fine inner surface of pipe was available by the use of these machining methods. The basic machining characteristics of pin-type magnetic tools were analyzed experimentally. In addition, the experimental results show that pin-type magnetic tools have more machining efficiency than Iron particles as magnetic tools.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.40-41
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• 2005

In this study, we proposed CMP micro-scratches generated by contaminative particle which existed on the wafer surface prior to CMP process. The CMP micro-scratches are one of the slurry abrasive related damage. To reduce the micro-scratches, research efforts have been devoted to the optimization of slurry abrasive size distribution. In addition of slurry abrasive, it was found that contaminative particles also were major CMP micro-scratch source.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.22 no.2
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• pp.114-118
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• 2009

PVA (polyvinyl alcohol) brush cleaning method is a typical cleaning method for semiconductor cleaning process especially post-CMP cleaning. PVA brush contacts with the wafer surface and abrasive particle, generating the contact rotational torque of the brush, which is the removal mechanism. The brush rotational torque can overcome theoretically the adhesion force generated between the abrasive particle and wafer by zeta potential. However, after CMP (chemical mechanical polishing) process, many particles remained on the wafer because the brush was contaminated in previous post-CMP cleaning step. The abrasive particle on the brush redeposits to the wafer. The level of the brush contamination increased according to the cleaning run time. After cleaning the brush, the level of wafer contamination dramatically decreased. Therefore, the brush cleanliness effect on the cleaning performance and it is important for the brush to be maintained clearly.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.10a
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• pp.488-491
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• 2005

Abrasive Jet Micromachining (AJM) is a process that uses high pressure air with micron-sized particles to erode a substrate. It has been considered as the most economic and appropriate technique to pattern glass surfaces for the flat panel applications. To accelerate the industrialization of AJM, it is necessary to understand the erosion mechanisms thoroughly. Thus, this paper introduces a new method to model the erosion mechanism in AJM. The model is developed by using the concept of the accumulation of the microdeformation caused by each particle. And this paper proposes the model added the effects of second impact. The developed model is used to simulate the erosion profile, and is compared with the model considered only first impact. It can be concluded that the proposed model predicts the erosion profile more accurately.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.487-487
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• 2009

One of the critical consumables in chemical mechanical polishing (CMP) is a specialized solution or slurry, which typically contains both abrasives and chemicals acting together to planarize films. In single abrasive slurry (SAS), the solid phase consists of only one type of abrasive particle. On the other hand, mixed abrasive slurry (MAS) consists of a mixture of at least two types of abrasive particles. In this paper, we have studied the CMP characteristics of mixed abrasive slurry (MAS) retreated by adding of $CeO_2$ abrasives within 1:10 diluted silica slurry (DSS). The slurry designed for optimal performance should produce reasonable removal rates, acceptable polishing selectivity with respect to the underlying layer, low surface defects after polishing, and good slurry stability. The modified abrasives in MAS are evaluated with respect to their particle size distribution, surface morphology, and CMP performances such as removal rate and non-uniformity. As an experimental result, we obtained the comparable slurry characteristics compared with original silica slurry in the viewpoint of high removal rate and low non-uniformity.