• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.11a
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• pp.126-127
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• 2005

Semiconductor carbon nanotube was grown on oxided silicon wafer with Atmosphere Pressure Chemical Vapor Deposition (APCVD) ethmod and investigated the electrical property after thermal oxidation at 300$^{\circ}C$ in air. The electrical property was measured at room temperature in air after thermal oxidation at 300$^{\circ}C$ for various times in air. Semiconductor carbon nanotube was steadily changed to metallic carbon nanotube as increasing of thermal oxidation times at 300$^{\circ}C$ in air.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1996.11a
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• pp.26-28
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• 1996

A high power SiGe HBT has been fabricated using APCVD(Atmospheric Pressure Chemical Vapor Deposition) and its perfermanoe has been analysed. The composition of Ge in the SiGe base was graded from 0% at the emitter-base junction to 20% at the base-collector junction. As a base electrode, titanium disilicide(TiSi$_2$) was used to reduce the extrinsic base resistance. The SiGe HBT with an emitter area of 2$\times$8${\mu}{\textrm}{m}$$^2$typically has a cutoff frequency(f$_{T}$) of 7.0GHz and a maximun oscillation frequency(f$_{max}$) of 16.1GHz with a pad de-embedding. The packaged high power SiGe HBT with an emitter area of 2xBx80${\mu}{\textrm}{m}$$^2$typically shows a cutoff frequency of 4.7GHz and a maximun oscillation frequency of 7.1GHz at Ic of 115mA.A.A.

• Proceedings of the IEEK Conference
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• 2006.06a
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• pp.473-474
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• 2006

Boron Phosphide films were deposited on (111) Si substrate at $650^{\circ}C$, by the reaction of B2H6 with PH3 using APCVD. N2 was carried out as carrier gas. The optimal gas rates were $20\;m{\ell}/min$ for B2H6, $60\;m{\ell}/min$ for PH3 and $1\;{\ell}/min$ for N2. After as grown the films were insitu annealed for 1hour in N2 ambient at $550^{\circ}C$ and measured. The measurement of AFM shows that the RMS is $29.626{\AA}$ for the reaction temperature at $650^{\circ}C$. The measurement of XRD shows that the films have the orientation of (101). Also, the measurement of AES is shown that the films have B13P2 stoichiometry.

• Journal of the Korean Institute of Telematics and Electronics
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• v.22 no.6
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• pp.53-57
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• 1985

Comparisons and analyses were made of the properties of double or triple passivation layer structures composed of APCVD SiOt or PSG and PECVD SiN films with various layer combinations and layer thicknesses. As a result of the analyses of the pro.peHics such as threshold-voltage shift, crack resistance, pinhole density, and moisture reslstancei a con-clusion was reached that the proper passivation layer structure is the double layer consisting of a 4,00$\AA$ or thicker PSG film and a 6,000$\AA$ SiN film.

• Proceedings of the KIEE Conference
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• 1987.07a
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• pp.561-564
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• 1987

The deposition and reflow properties or BPSG film deposited by APCVD was characterized by variation of each process parameter. As deposition temperature is increased higher, deposition rate is decreased. Maximum deposition rate of BPSG film is obtained in higher 02/Hyride ratio than CVD Oxide or PSG. BPSG film shows stable dielectric properties and we obtained good planarization effect at lower reflow temperature in case of BPSG film than PSG film.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.199-200
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• 2007

본 논문에서는 $SiO_2$ Gate 유전체를 대체할 재료의 하나인 $TiO_2$, Gate 유전체의 기판 증착 온도에 따른 특성을 알아보고자 한다. 디바이스의 고집적화가 높아짐에 따라 얇은 두께의 Gate 유전체의 절대적인 필요에 따라 두께를 최소화하면서 유전율은 높아 전기적 특성이 우수한 소재를 찾게 되었다. 본 논문의 실험에서는 비휘발성 메모리 소자 제작시 Gate Blocking Layer 적용을 위해 High-k 물질인 $TiO_2$, 박막 증착 실험을 하였고, APCVD 방법을 사용하여 성장하였다. 증착 온도에 따른 I-V 특성을 분석하고 그에 따른 소자의 물리적 구조를 SEM을 통해 확인하면서 소자 제작시 최적의 온도를 찾고자 하였다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.134-135
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• 2007

Growth of cubic SiC has been carried out on oxided Si substrate using atmospheric pressure chemical vapor deposition (APCVD). Hexamethyldisilane (HMDS) was used as the single precursor and nonflammable mixture of Ar and $H_2$ was used as carrier gas. Epitaxial growth had performed depositions under the various $H_2$ conditions which were adjusted from 0 to 100 seem. The effects of $H_2$ was characterized by surface roughness, thickness uniformity, films quality and elastic modulus. Thickness uniformity and films quality were performed by SEM. Surface roughness and elastic modulus were investigated by AFM and Nano-indentor, respectively. According to the $H_2$ flow rate, Poly 3C-SiC thin film quality was improved not only physical but also mechanical properties.

• Proceedings of the Materials Research Society of Korea Conference
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• 1997.10a
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• pp.96-96
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• 1997

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.4 no.2
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• pp.157-168
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• 1994

The surface morphology, electrical properties, and optical properties of textured $SnO_2(:F)$ films according to deposition parameters such as HF and $H_2O$ content was studies. The electron concentration, resistivity, and mobility was $3{\Times}10^{20}/cm^3$, $7{\Times}10^4~9{\Times}10^4{Omega}cm$ and $18~25cm^2/V.sec$, respectively, when HF bubbling rate over 0.9 slm. The surface morphology was sharp edged pyramid shape without bubbling $H_2O$ but changed to round edged hemispherical shape when $H_2O$ was added.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.10 no.2
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• pp.105-110
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• 2000

The $\alpha$-$Fa_{2}O_{3}/SnO_{2}$ thin film gas sensor was fabricated by APCVD and heat treated. The gas sensitivity to flammable gases ($CH_4$, $H_2$, LPG) was measured. This device was to heat treatment at $400^{\circ}C$, $450^{\circ}C$, $500^{\circ}C$, $550^{\circ}C$, $600^{\circ}C$ for 2 h to enhance the gas sensitivity. The heat treated device at $500^{\circ}C$ for 2 h had the best properties and especially it shows high sensitivity to H2 gas. The sensitivity to gases was studied in the temperature range from lOoC to $300^{\circ}C$ in order to find the optimum detection temperature. In the range of detection from 500 ppm to 10,000 ppm at $175^{\circ}C$ the fabricated device showed that the gas sensitivity to $H_2$ was from 62%~76% and to $CH_4$ was from 16 %~58% and to LPG was from 8%~37 %. The sensitivity difference between heat treated device and as fabricated one was about 10 8 The long-term stability to LPG at 1,000 ppm was converged to sensitivity of 30 %.