• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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• pp.582-582
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• 2013

Oxide TFT (thin film transistor) active channel layer에 대한 저온 열처리 공정은 투명하고 flexibility을 기반으로하는 display 산업과 AMOLED (active matrix organic light emitting diode) 분야 등 다양한 분야에서 필요로 하는 기술로서 많은 연구가 이루어지고 있다. 과거 active layer는 ALD (atomic layer deposition), CVD (chemical vapor deposition), pulse laser deposition, radio frequency-dc (RF-dc) magnetron sputtering 등과 같은 고가의 진공 장비를 이용하여 증착 되어져 왔으나 현재에는 진공 장비 없이 spin-coating 후 열처리 하는 저가의 공정이 주로 연구되어 지고 있다. Flexible 기판들은 일반적인 OTFT (oxide thin films Transistor)에 적용되는 열처리 온도로 공정 진행시 열에 의한 기판의 손상이 발생한다. Flexible substrate의 열에 의한 기판 손상을 막기 위해 저온 열처리 공정이 연구되고 있지만 기존 열처리와 비교하여 소자의 특성 저하가 동반 되었다. 본 연구에서는 Si 기판위에 SiO2 (100)를 절연층으로 증착하고 그 위에 IZO (indium zinc oxide) solution을 spin-coating 한뒤 $250^{\circ}C$ 이하의 온도에서 열처리하였다. 저온 공정으로 인하여 소자의 특성 저하가 동반 되었으므로 소자의 저하된 특성 복원하고자 post-treatment로 고가의 진공장비가 필요 없고 roll-to roll system 적용이 수월한 remote-type의 APP (atmospheric pressure plasma) 처리를 하였다. Post-treatment로 APP를 이용하여 $250^{\circ}C$ 이하에서 소자에 적용 가능한 on/off ratio를 얻을 수 있었다.

• 한국안전학회지
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• 제29권3호
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• pp.34-38
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• 2014

In Display such as LCD, LED, and AMOLED or semiconductor related industries are required to have static ionizer in order to produce reliable goods since the ionizer can create balanced ion that is delivered to producing goods to minimize electrical damages when manufacturing. However, the most general type of ionization is called, "Corona Discharge" that has a slight chances to generate unequal and unstable amount of each +/- ion to the target object. Then, the ionization performance will drastically decrease and end up with quality deterioration problem. In this research, our objective to resolve the current issue via applying "Coupling Condenser" on each counter electrodes of Corona discharging type ionizer. The result is that the ion balance was maintained the satisfied range that is within +/-100V when we changed the duty ratio of the High Voltage of Pulse AC about 40 ~ 70%. In addition, when levelling the High Voltage of Pulse AC, the ion balance holds the range within +20 ~ 0V. Even though we have tested the same experiment for a year, we have seen the range changes roughly ${\pm}50V$.

• Journal of Information Display
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• 제10권3호
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• pp.111-116
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• 2009

In this paper, a plasma-assisted patterning method for the organic layers of organic light-emitting diodes (OLEDs) and its effect on the OLED performances are reported. Oxygen plasma was used to etch the organic layers, using the top electrode consisting of lithium fluoride and aluminum as an etching mask. Although the current flow at low voltages increased for the etched OLEDs, there was no significant degradation of the OLED efficiency and lifetime in comparison with the conventional OLEDs. Therefore, this method can be used to reduce the ohmic voltage drop along the common top electrodes by connecting the top electrode with highly conductive bus lines after the common organic layers on the bus lines are etched by plasma. To further analyze the current increase at low voltages, the plasma patterning effect on the OLED performance was investigated by changing the device sizes, especially in one direction, and by changing the etching depth in the vertical direction of the device. It was found that the current flow increase at low voltages was not proportional to the device sizes, indicating that the current flow increase does not come from the leakage current along the etched sides. In the etching depth experiment, the current flow at low voltages did not increase when the etching process was stopped in the middle of the hole transport layer. This means that the current flow increase at low voltages is closely related to the modification of the hole injection layer, and thus, to the modification of the interface between the hole injection layer and the bottom electrode.

• 전자공학회논문지
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• 제53권5호
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• pp.87-97
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• 2016

본 논문에서는 시분할 기법을 적용하여 AMOLED 컬럼 구동회로용 DAC의 유효 채널 면적을 최소화한 2단 저항 열 기반의 10비트 DAC를 제안한다. 제안하는 DAC는 시분할 기법 기반의 DEMUX, 6비트 및 4비트의 2단 저항 열 구조를 기반으로 하는 롬 구조의 디코더를 2단계로 사용하여 기존의 디스플레이용 DAC보다 빠른 변환속도를 가지는 동시에 하나의 패널 컬럼 구동을 위한 DAC의 유효 면적을 최소화하였다. 두 번째 단 4비트 저항 열에서는 DAC 채널의 면적과 부하 영향을 줄이는 동시에 버퍼 증폭기로 인한 채널 간 오프셋 부정합을 제거하기 위해 기존의 단위-이득 버퍼 대신 간단한 구조의 전류원으로 대체하였다. 제안하는 1:24 DEMUX는 하나의 클록과 5비트 2진 카운터만을 사용하여, 하나의 DAC 채널이 24개의 컬럼을 순차적으로 구동할 수 있도록 하였다. 각 디스플레이 컬럼을 구동하는 출력 버퍼 입력 단에는 0.9pF의 샘플링 커패시터와 작은 크기의 source follower를 추가하여 top-plate 샘플링 구조를 사용하면서 채널 전하 주입에 의한 영향을 최소화하는 동시에 출력 버퍼의 신호정착 정확도를 향상시켰다. 제안하는 DAC는 $0.18{\mu}m$ CMOS 공정으로 제작하였으며, DAC 출력의 정착 시간은 입력을 '$000_{16}$'에서 '$3FF_{16}$'으로 인가했을 때 62.5ns의 수준을 보인다. 제안하는 DAC 단위 채널의 면적 및 유효 채널 면적은 각각 $0.058mm^2$ 및 $0.002mm^2$이며, 3.3V의 아날로그 및 1.8V의 디지털 전원 전압에서 6.08mW의 전력을 소모한다.

• JSTS:Journal of Semiconductor Technology and Science
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• 제15권5호
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• pp.519-525
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• 2015

Positive bias stress-induced instability in amorphous indium-gallium-zinc-oxide (a-IGZO) bottom-gate thin-film transistors (TFTs) was investigated under high $V_{GS}$/low $V_{DS}$ and low $V_{GS}$/high $V_{DS}$ stress conditions through incorporating a forward/reverse $V_{GS}$ sweep and a low/high $V_{DS}$ read-out conditions. Our results showed that the electron trapping into the gate insulator dominantly occurs when high $V_{GS}$/low $V_{DS}$ stress is applied. On the other hand, when low $V_{GS}$/high $V_{DS}$ stress is applied, it was found that holes are uniformly trapped into the etch stopper and electrons are locally trapped into the gate insulator simultaneously. During a recovery after the high $V_{GS}$/low $V_{DS}$ stress, the trapped electrons were detrapped from the gate insulator. In the case of recovery after the low $V_{GS}$/high $V_{DS}$ stress, it was observed that the electrons in the gate insulator diffuse to a direction toward the source electrode and the holes were detrapped to out of the etch stopper. Also, we found that the potential profile in the a-IGZO bottom-gate TFT becomes complicatedly modulated during the positive $V_{GS}/V_{DS}$ stress and the recovery causing various threshold voltages and subthreshold swings under various read-out conditions, and this modulation needs to be fully considered in the design of oxide TFT-based active matrix organic light emitting diode display backplane.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2005년도 International Meeting on Information Displayvol.I
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• pp.61-63
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• 2005

Pentacene based OTFT on PC and PES plastic substrates have been fabricated in a scale of 5 inches. We could get a small OTFT device enough to be applicable for AMOLED by acquiring the at least misalignment margin through a contact aligner. And also we could find out the degradation of device parameter through the integration processes and improve the properties by using a buffer layer as an etch stopper in an active patterning. Through these, the mobility of device is more than about $0.2cm^2/Vs$ and $I_{on}/I_{off}$ is higher than $10^5$.

• 대한전자공학회논문지SD
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• 제45권5호
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• pp.12-18
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• 2008

본 연구는 PC(polycarbonate) 기판 위에 소스(source)/드레인(drain) 전극으로 Ag 페이스트를 스크린 인쇄하여 OTFT(organic thin film transistor)를 제작하였다. 또한 이렇게 제작된 OTFT를 적용하여 OTFT-OLED(organic light emitting diode) 어레이를 제작하였으며 OTFT의 소스 및 드레인 전극과 더불어 데이터 배선전극을 Ag 페이스트를 이용하여 형성하였다. Ag 페이스트는 스크린 마스크의 mesh에 따라 325 mesh용과 500 mesh용을 사용하였으며, 325 mesh용 페이스트는 선폭 60 ${\mu}m$, 500 mesh용 페이스트는 선폭 40 ${\mu}m$까지 인쇄가 가능하였다. 그리고 면저항은 각각 $60m{\Omega}/\square,\;133.1m{\Omega}/\square$이었다. 제작된 OTFT의 성능은 이동도가 자각 0.35 $cm^2/V{\cdot}sec$와 0.12 $cm^2/V{\cdot}sec$, 문턱전압 -4.7 V와 0.9 V이었으며, 전류 점멸비는 ${\sim}10^5$이었다. OTFT-OLED 어레이는 인쇄성이 우수한 500 mesh용 Ag 페이스트를 사용하였으며 OTFT의 채널길이를 50 ${\mu}m$로 설계하여 제작하였다. OTFT-OLED 어레이의 화소는 2개의 OTFT, 1개의 캐패시터 그리고 1개의 OLED로 구성하였고, 크기는 $2mm{\times}2mm$이며, 해상도는 $16{\times}16$ 이다. 제작된 어레이는 일부 불량 화소를 포함하고 있지만 능동형 모드로 동작함을 확인할 수 있었다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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• pp.100-101
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• 2012

The plasma damage free and room temperature processedthin film deposition technology is essential for realization of various next generation organic microelectronic devices such as flexible AMOLED display, flexible OLED lighting, and organic photovoltaic cells because characteristics of fragile organic materials in the plasma process and low glass transition temperatures (Tg) of polymer substrate. In case of directly deposition of metal oxide thin films (including transparent conductive oxide (TCO) and amorphous oxide semiconductor (AOS)) on the organic layers, plasma damages against to the organic materials is fatal. This damage is believed to be originated mainly from high energy energetic particles during the sputtering process such as negative oxygen ions, reflected neutrals by reflection of plasma background gas at the target surface, sputtered atoms, bulk plasma ions, and secondary electrons. To solve this problem, we developed the NBAS (Neutral Beam Assisted Sputtering) process as a plasma damage free and room temperature processed sputtering technology. As a result, electro-optical properties of NBAS processed ITO thin film showed resistivity of $4.0{\times}10^{-4}{\Omega}{\cdot}m$ and high transmittance (>90% at 550 nm) with nano- crystalline structure at room temperature process. Furthermore, in the experiment result of directly deposition of TCO top anode on the inverted structure OLED cell, it is verified that NBAS TCO deposition process does not damages to the underlying organic layers. In case of deposition of transparent conductive oxide (TCO) thin film on the plastic polymer substrate, the room temperature processed sputtering coating of high quality TCO thin film is required. During the sputtering process with higher density plasma, the energetic particles contribute self supplying of activation & crystallization energy without any additional heating and post-annealing and forminga high quality TCO thin film. However, negative oxygen ions which generated from sputteringtarget surface by electron attachment are accelerated to high energy by induced cathode self-bias. Thus the high energy negative oxygen ions can lead to critical physical bombardment damages to forming oxide thin film and this effect does not recover in room temperature process without post thermal annealing. To salve the inherent limitation of plasma sputtering, we have been developed the Magnetic Field Shielded Sputtering (MFSS) process as the high quality oxide thin film deposition process at room temperature. The MFSS process is effectively eliminate or suppress the negative oxygen ions bombardment damage by the plasma limiter which composed permanent magnet array. As a result, electro-optical properties of MFSS processed ITO thin film (resistivity $3.9{\times}10^{-4}{\Omega}{\cdot}cm$, transmittance 95% at 550 nm) have approachedthose of a high temperature DC magnetron sputtering (DMS) ITO thin film were. Also, AOS (a-IGZO) TFTs fabricated by MFSS process without higher temperature post annealing showed very comparable electrical performance with those by DMS process with $400^{\circ}C$ post annealing. They are important to note that the bombardment of a negative oxygen ion which is accelerated by dc self-bias during rf sputtering could degrade the electrical performance of ITO electrodes and a-IGZO TFTs. Finally, we found that reduction of damage from the high energy negative oxygen ions bombardment drives improvement of crystalline structure in the ITO thin film and suppression of the sub-gab states in a-IGZO semiconductor thin film. For realization of organic flexible electronic devices based on plastic substrates, gas barrier coatings are required to prevent the permeation of water and oxygen because organic materials are highly susceptible to water and oxygen. In particular, high efficiency flexible AMOLEDs needs an extremely low water vapor transition rate (WVTR) of $1{\times}10^{-6}gm^{-2}day^{-1}$. The key factor in high quality inorganic gas barrier formation for achieving the very low WVTR required (under ${\sim}10^{-6}gm^{-2}day^{-1}$) is the suppression of nano-sized defect sites and gas diffusion pathways among the grain boundaries. For formation of high quality single inorganic gas barrier layer, we developed high density nano-structured Al2O3 single gas barrier layer usinga NBAS process. The NBAS process can continuously change crystalline structures from an amorphous phase to a nano- crystalline phase with various grain sizes in a single inorganic thin film. As a result, the water vapor transmission rates (WVTR) of the NBAS processed $Al_2O_3$ gas barrier film have improved order of magnitude compared with that of conventional $Al_2O_3$ layers made by the RF magnetron sputteringprocess under the same sputtering conditions; the WVTR of the NBAS processed $Al_2O_3$ gas barrier film was about $5{\times}10^{-6}g/m^2/day$ by just single layer.