• Title/Summary/Keyword: AIGaN/GaN

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Temperature Dependence of Electrical Characteristics of AIGaAs/GaAs Heterojunction Bipolar Transistors (AIGaAs/GaAs 이종접합 바이폴라 트랜지스터의 온도 변화에 따른 전기적 특성에 대한 연구)

  • 박문평;이태우;김일호;박성호;편광의
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 1996.11a
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    • pp.349-352
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    • 1996
  • When the ideality factor of collector current of AIGaAs/GaAs Heterojunction Bipolar Transistors (HBTs) is larger than unity, conventional $I_{CO}$ / $T^2$ versus 1000/T plot used in the determination of the barrier height of base-emitter junction of HBT was deviated from the straight line. We introduced the effective temperature $T_{eff}$ as nT in the Thermionic-emission equation. The modified $I_{CO}$ /TB versus 1000/ $T_{eff}$ plot was on the straight line in the temperature range considered. The activation energy obtained from the modified plot is 1.61 eV. The conduction band discontinuity calculated using this value was 0.305 eV and this value is coincident with the generally accepted value of 0.3 eV. eV.

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Thermal Effect Modeling for AIGaN/GaN HFET on Various Substrate (AlGaN/GaN HFET의 기판에 따른 열효과 분석 모델링)

  • Park, Seung-Wook;Shin, Moo-Whan
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2001.11b
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    • pp.221-225
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    • 2001
  • In the paper, we report on the DC and Thermal effect of the GaN based HFET. A physics-based a model was applied and found to be useful for predicting the DC performance and Thermal effect of the GaN based HFET by Various substrate. The performance of device on the sapphire substrates is found to be significantly improve compared with that of a device with an sapphire substrate. The peak drain current of the device achieved at HFET on the SiC substrate

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MOCVD growth of GaN and InGaN in a rotating-disk reactor

  • 문용태;김동준;김준형
    • Proceedings of the Korean Vacuum Society Conference
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    • 1998.02a
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    • pp.109-109
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    • 1998
  • 최근 들어 MOCVD 법으로 성장시킨 GaN, InGaN, AIGaN를 이용한 광소자 ( (LED, LD)와 전자소자(FET, MODFET)에 대한 관심이 고조되면서, MOCVD 법 을 이용한 GaN 중심의 질화물 반도체 성장에 관심이 집중되고 있다. 금번 실험에 사용된 MOCVD 장비는 수직형 MOCVD 장비이다. 특히, wafer c carner를 1$\alpha$)() rpm이상의 고속으로 회전시킬 수 있는 장치로서 원료 가스의 반웅 기 내에서의 흐름을 균일하게 하여 uniformity가 높은 질화물 반도체를 성장시킬 수 있다 .. GaN 에피충은 c-plane 사파이어를 기판으로 하여 11 00 "C 이상의 고온 에서 수소를 이용하여 기판을 cleaning하고, 500 "C 부근에서 핵생성충올 성장시 킨 후 1050 "C에서 trimethylgallium(TMGa)과 NI-h를 이용하여 성장시켰다. n n -GaN를 성장시키기 위해서는 SiH4을 사용하였으며, InGaN의 경우는 t trimethylindium(TMIn)을 In원 료 가스로 하여 635 - 725 "C 범 위 에 서 성 장시 켰 다. 성 장된 undoped GaN, n-GaN, InGaN는 X -ray di잔raction(XRD), H떠l m measurement, Photoluminescence(PU동올 이용하여 결정성과 전기적 및 광학적 특성올 고찰하였다 .. 2ttm 두께로 성장된 undoped G값V박막의 경우 Hall 측정결과 6 6 X lOI6/e며 정도의 낮은 도핑 농도를 보였으며, V!lII ratio(2500 - 5000)증가에 따라 결정성이 향상됨을 GaN (102)면의 X -ray e -rocking분석올 통하여 확인하 였다 .. n-GaN의 경우 SiH4양올 3 - 13 sccm으로 증가시킴에 따라 n -type 도명농 도가 선형적으로 증가하였고, 1017/c며 범위 내로 도평이 된 경우 상온에서 300 e마 N Ns 이상의 high mobility를 얻올 수 있었다 .. PL 관측 결과로부터 Si 도핑으로 인 하여 GaN bandedge emission이 강화됨을 알 수 있었다 .. InGaN 박막의 경우 성 장온도를 낮춤에 따라서 m의 양을 증가시킬 수 있었다. 또한 유량비(TMIn I T TMGa)가 1에 가까운 경 우에서도 온도를 635 "C 정도로 낮훈 경우 410 nm정도에 서 PL bandedge peak올 얻을 수 있었으며, 이 때의 반치폭은 50 meV정도의 낮 은 값을 보였다. 반치폭은 50 meV정도의 낮 은 값을 보였다.

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3D Simulation on Polarization Effect in AlGaN/GaN HEMT (AlGaN/GaN HEMT의 분극 현상에 대한 3D 시뮬레이션)

  • Jung, Kang-Min;Kim, Jae-Moo;Kim, Hee-Dong;Kim, Dong-Ho;Kim, Tae-Geun
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.47 no.10
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    • pp.23-28
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    • 2010
  • In this paper, we investigated the polarization effects on the electrical and structural characteristics of AlGaN/GaN HEMT. Both the Al mole-fraction and the barrier thickness of AlGaN, which determine the profiles of a two-dimensional electron gas, were simulated to obtain the optimum HEMT structure affecting the polarization effect. As a results, we found that the amount of bound sheet charges was increased by 16% and the maximum drain current density ($I_D$,max) was increased by more than 37%, while AI mole fractions are changed from 0.3 to 0.4. We also observed a 37% improvement in maximum drain current density ($I_D$,max) by increasing AIGaN layer thickness from 17 to 38 nm. However when AlGaN layer thickness reached the critical thickness, DC characteristics were dramatically lowered due to 'bulk' relaxation in AlGaN layer.

n-A1GaAs/GaAs 이종구조의 PL 특성

  • Maeng, Seong-Jae;Lee, Jae-Jin;Kim, Jin-Seop
    • ETRI Journal
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    • v.11 no.3
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    • pp.3-10
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    • 1989
  • 변조도핑 AIGaAs/GaAs 이종구조의 양자우물에 감금된 이차원 전자가스층의 생성과 그 농도 및 이동도의 파악은 이 구조를 이용한 소자의 성능을 평가하기 위해 필수적이다. 그리고소자제작에 앞서 이차원 전자가스층 생성여부의 확인은 에피층 성장공정과 제작공정을 분리 검증하여 소자 제작후에 나타나는 문제점을 해결하기 위한 진단 단계를 줄일 수 있다. 본 논문에서는 이차원 전자가스층의 확인방법을 개발하기 위하여 변조도핑 이종구조의 PL을 측정하여 분석하고 지금까지 보고된 자료를 분석하여 새로운 피크에 대한 기구해석과 검증방법을 마련하였다.

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A Study on the I-V characteristics of a delta doped short-channel HEMT (단채널 델타도핑 HEMT의 전압-전류 특성에 대한 2차원적 해석)

  • Lee Jung-Ho;Chae Gyoo-Soo;Kim Min-Nyun
    • Proceedings of the KAIS Fall Conference
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    • 2004.06a
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    • pp.158-161
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    • 2004
  • In this study, an analytical model for I-V characteristics of an n-AIGaAs / GaAs Delta doped HEMT is proposed. The two-dimensional electron gas density and the conduction band edge profile are calculated from a self-consistent iterative solution of the Poisson equation. The parameters, which include the saturation velocity, two-dimensional electron gas concentration, thickness of the doped and undoped layer(AIGaAs, GaAs, spacer etc.,), are in good agreement with the independent calculations.

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External Feedback Effects on the Relative Intensity Noise Characteristics of InAIGaN Blue Laser Diodes

  • Cho Hyung-Uk;Yi Jong-Chang
    • Journal of the Optical Society of Korea
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    • v.10 no.2
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    • pp.86-90
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    • 2006
  • The external feedback effect on the relative intensity noise (RIN) characteristics of blue InAlGaN laser diode has been analyzed taking into account the spontaneous emission noise and the injection current for the high frequency modulation. A Langevin diffusion model was exploited to characterize its relative intensity noise. The simulation parameters were quantitatively evaluated from the optical gain properties of the InAlGaN multiple quantum well active regions by using the multiband Hamiltonian for the strained wurtzite crystals. The extracted parameters were then applied to the rate equations taking into account the external feedback and the high frequency modulation current. The RIN characteristics were investigated to optimize the low frequency laser diode noise characteristics.

Performance of GaAs-AIGaAs V-Grooved Inner Stripe Quantum-Well Wire Lasers with Different Current Blocking Configurations (V형 양자선 레이저의 전류 차단층에 대한 연구)

  • Cho, Tae-Ho;Kim, Tae-Geun
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2003.04a
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    • pp.189-192
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    • 2003
  • V-grooved inner stripe (VIS)형 양자선 레이저의 전류 주입 효율을 높이기 위하여 세가지 서로 다른 전류 차단층 구조, n-blocking on p-substrate (VIPS), p-n-p-n blocking on n-substrate ($VI(PN)_{n}S$), p-blocking on n-substrate (VINS)를 설계, 제작하였다. 그 중 VIPS 구조는 다른 두 구조에 비하여 약 5mW/facet 정도의 높은 광출력을 보였으며, 중심파장 818 nm, 문턱전류 39.9 mA, 외부양자효과 24%/facet, 특성온도 92K의 특성을 보였다. 또한 전류 및 온도 변화에 따른 파장변화를 각각 0.031 nm/mA와 $0.14nm/^{\circ}C$로 관찰되었다.

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Analysis and Design of High-Brightness LEDs (고휘도 LED의 구조 해석 및 설계)

  • 이성재;송석원
    • Journal of the Korean Institute of Telematics and Electronics D
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    • v.35D no.6
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    • pp.79-91
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    • 1998
  • Design principles for high-brightness ligh-temitting diodes have been derived by using escape cone concepts. Based on the design principles, some important high-brightness LED structures developed thus far have been reviewed and, in addition, their external coupling efficiencies have also been estimated. In AlGaAs or InGaAIP LEDs, in which photon absorption in the ohmic electrodes is known to be serious, photon shielding by the electrodes is minimized by using window layer (WL) as well as transparent substrate (TS) leading to significantly improved light-emitting efficiency. However, in InGaN LEDs emitting blue to green lights, the photon absorption in ohmic contact to wide bandgap GaN may be negligible and therefore, photon shielding by the electrodes would not lead to as significant problems as in conventional In AIGaAs or InGaAIP LEDs.

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Pd/Ge/Pd/Ti/Au Ohmic Contact for Application to AlGaAs/GaAs HBT (AIGaAs/GaAs HBT 응용을 위한 Pd/Ge/Pd/Ti/Au 오믹 접촉)

  • 김일호;박성호(주)가인테크
    • Journal of the Korean Vacuum Society
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    • v.11 no.1
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    • pp.43-49
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    • 2002
  • Pd/Ge/Pd/Ti/Au ohmic contact to n-type InGaAs was investigated with rapid thermal annealing conditions. Minimum specific contact resistivity of $1.1\times10^{-6}\Omega\textrm{cm}^2$ was achieved after annealing at $400^{\circ}C$/10sec, and a ohmic performance was degraded at higher annealing temperature due to the chemical reaction between the ohmic contact materials and the InGaAs substrate. However, non-spiking planar interface and relatively good ohmic contact($high-10^{-6};{\Omega}\textrm{cm}^2$) were maintained. This ohmic contact system is expected to be a promising candidate for compound semiconductor devices.