• 제목/요약/키워드: A roughness measuring device

검색결과 21건 처리시간 0.025초

원통연삭가공시 반도체 레이저 빔을 이용한 금속표면거칠기의 인프로세스 측정 (A Study on the In-process Measurement of Metallic Surface roughness in Cylindrical Grinding by Diode Laser)

  • 김희남
    • 한국공작기계학회:학술대회논문집
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    • 한국공작기계학회 1995년도 춘계학술대회 논문집
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    • pp.1-8
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    • 1995
  • This paper proposed a simple method for measuring surface roughness of ground surface. utilizing non-contact in-process measuring system using the diode laser. The measurement system is consisted of a laser unit with a diode laser and a cylindrical lens a detecting unit with polygon mirror and CCD array sensor. and a signal processing unit with a computer and device. During operation, this measuring system can provide information on surface roughness in the measuring distance with a single sampling and simultanilusly monitor the state of the grind wheel. The experimental results, showed that the increase of the feed rate and the dressing speed an caused increase in the surface roughness and when the surface roughness is 4Rmax-10Rmax, the cutting speed is 1653m/min-1665m/min. the feed rate is 0.2m/min-0.9m/min, the dressing speed is 0.2mm/rev-0.4mm/rev, the stylus method and the in-process method can be obtained the same results. thus under limited working conditions. using the proposed system. the surface roughness of the ground surface during cylindrical grinding can be obtained through the in-process measurement method using the diode laser.

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원통연삭가공시 반도체 레이저 빔을 이용한 금속표면거칠기의 인프로세스 측정 (A Study on the In-Process Measurement of Metallic Surface Roughness in Cylindrical Grinding by Diode Laser)

  • 김희남;이주상
    • 한국안전학회지
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    • 제10권3호
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    • pp.30-41
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    • 1995
  • This paper proposed a simple method for measuring surface roughness of ground surface. Utilizing non-contact in-process measuring system using the diode laser. The measurement system is consisted of a laser unit with a diode laser and a cylindrical lens, a detecting unit with polygon mirror and CCD array sensor, and a signal processing unit with a computer and device. During operation, this measuring system can provide information on surface roughness in the measuring distance with a single sampling and simultaniously monitor the state of the grind wheel. The experimental results, showed that the Increase of the feed rate and the dressing speed an caused increase in the surface roughness and when the surface roughness is 4Rmax-10Rmax, the cutting speed is 1653m/min-1665m/min, the table speed is 0.2n1/min -0.9m/min, the dressing speed is 0.2mm/rev~0.4mm/rev, the stylus method and the in-process method can be obtained the same results. Thus, under limited working conditions, using the proposed system, the surface roughness of the ground surface during cylindrical grinding can be obtained through the in-process measurement method using the diode laser.

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기초 연암부 벽면거칠기 시험과 하중전이 시험 결과의 비교 및 단위주면마찰력의 산정에 대한 연구 (A Comparison of Roughness Measurement and Load Transfer Test for the Calculation of Unit Skin Friction of Pile Foundation in Soft Rocks)

  • 홍석우;황근배
    • 한국지반공학회논문집
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    • 제39권6호
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    • pp.21-30
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    • 2023
  • 현장타설말뚝의 연암 근입부의 단위주면마찰력을 산정하는 방법 중 암반 벽면거칠기에 의한 산정 방법이 있다. 현장타설말뚝의 굴착 시공 시 암반 굴착공에 거칠기 장치를 설치하고 벽면 거칠기 모양을 측정하고 그 결과를 이용하여 주면마찰력을 산정하는 것이다. 본 연구에서는 암반벽면의 거칠기를 직접 측정한 결과와 하중전이 시험결과를 비교분석하여 거칠기시험에 의한 단위주면마찰력을 말뚝의 발생 변위에 대응하는 단위 주면마찰력으로 변환할 수 있도록 저감계수 Rf = -0.14n + 1.48(여기서, n은 하중전이시험에서 도출된 발생변위 δ를 말뚝직경 D로 나눈 변위비)을 제안하였다.

액체호닝에 의한 금형 자동 사상기계개발 및 가공 특성 (Polishing Characteristics and Development of Automatic Die Polishing Machine by Liquid Honing)

  • 김재도;류기덕;홍정석
    • 한국정밀공학회지
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    • 제17권6호
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    • pp.162-168
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    • 2000
  • The automatic die polishing machine by liquid honing has been developed and experimented on the surface of machined die. The goal of development in the automatic die polishing machine by liquid honing is to increase the accuracy and the productivity in die polishing. To reach this goal, the polishing machine consists of the automatic measuring device for contour of die, the nozzle and pumping system to spray the powder mixed with liquid, and the 3-axis guides. Before polishing, the measuring device with a semiconductor laser scans the surface of mould to get the data of contour. The data store a PC and use to control the nozzle head to move above a couple of centimeters on the machined surface of die. The experimental parameters are the spraying time, the pressure, the size of abrasive grain and the mixing ratio between abrasive grain and liquid. The surface roughness is measured on the polished die which are SKDl 1 and Al7075 machined by NC. The surface roughness indicates the values of Rmax 0.5${\mu}{\textrm}{m}$ for Al7075 and Rmax 1.4${\mu}{\textrm}{m}$ for SKDl 1. It reduces the polishing time significantly and reduces the monotonous work for labors. As the results, the liquid honing system is useful method to apply for the die polishing and the automatic die polishing machine using liquid honing shows that it's very effective processing ability.

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연암부 벽면거칠기를 이용한 단위주면마찰력 특성에 관한 연구 (A Study on Characteristics of the Unit Skin Friction Using the Wall Roughness in the Soft Rock)

  • 홍석우;황근배
    • 한국지반공학회논문집
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    • 제35권12호
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    • pp.7-13
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    • 2019
  • 현장타설말뚝인 경우에 연암 소켓부의 단위주면마찰응력을 산정하는 방법 중 벽면 거칠기에 의한 산정 방법이 있다. 이 방법은 현장타설말뚝을 시공하기 위한 굴착 단계에서 거칠기 측정 장치를 굴착공에 설치하여 암반 벽면의 거칠기 양상을 측정하여 주면마찰력을 산정하는 것이다. 본 연구에서는 현장타설말뚝의 암반 소켓부 벽면의 거칠기 양상을 천공홀에서 직접 측정하였으며 그 결과를 이용하여 암반의 주면마찰력 특성을 파악하고자 한다. 그리고, 거칠기 시험 결과를 검증하기 위하여 동일 말뚝에 정재하시험 및 하중전이시험을 수행하였다.

레이저광 반사 화상을 이용한 표면 거칠기 측정법의 개발과 적용 (Development of a Surface Roughness Measurement Method Using Reflected Laser Beam Image and Its Application)

  • ;김화영;안중환;최이존
    • 한국정밀공학회지
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    • 제18권11호
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    • pp.51-57
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    • 2001
  • A light beam reflected from a machined surface generally containes information concerning about its surface roughness. This study examines and proposes a surface roughness measurement technique for on-machine measurement of machined surfaces. The technique is based on the measurement of a reflected laser beam pattern and the statistical analysis of its light intensity distribution. The surface roughness was found to be closely related to the standard deviation of the light intensity on the primary axis of the reflected pattern. An image acquisition device is made up of a laser diode, a half mirror, a screen, and a CCD camera. The exact image with the primary and secondary axes of a reflected laser beam pattern is calculated through such image processing algorithm as thresholding, edge detection, image rotation, segmentation, etc. A median filter and a surrounding light correction algorithm are improve the image quality and reduce the measuring error. Using the developed measuring device the effect of screen materials and workpiece and workpiece materials was investigated. Experimental results regarding to relatively high-quality surfaces machined by grinding, polishing, lapping processes have shown the measurement error is within 10% in the range of $0.1{mu}m~0.8{\mu}m R_q.$Therefore, the proposed method is thought to be effectively used when quick measurements is needed with workpieces fixed on the machine.

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레이저 표면 거칠기 측정 성능 향상을 위한 입사 광강도 조정 알고리즘 (Adjustment Algorithm of Incident Light Power for Improving Performance of Laser Surface Roughness Measurement)

  • 서영호;김화영;안중환
    • 한국정밀공학회지
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    • 제21권4호
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    • pp.79-87
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    • 2004
  • The light pattern reflected from a machined surface contains some information like roughness and profile on the projected surface as expected in the Beckmann-Spizzichino model. In applying the theory into a real reliable measuring device, many parameters such as incident light power, wave length, spot size should be kept a constant optical value. However, the reflected light power is likely to change with the environmental noise, the variations of the light source, the reflectivity of the surface, etc. even though the incident light power is constant. In this study, a method for adjusting the incident light power to keep the reflected light power projected on a CMOS image sensor constant was proposed and a simple adjustment algorithm based on PI digital control was examined. Experiments verified that the proposed method made the surface roughness measurement better and more reliable even under variations of the height of light source.

금형의 자동연마 시스템 개발 (Development of Automatic System for Die Polishing)

  • 안중환;정해도;이민철;전차수;이만형;조규갑
    • 한국정밀공학회지
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    • 제17권4호
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    • pp.69-80
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    • 2000
  • Generally, die polishing is a lime consuming process, resulting in 30∼50% of the whole die manufacturing time. However, die polishing has not been automated yet, since it needs a great deal of experience and skill. This paper describes a new development of automated system for die polishing and focuses on the successful achievements of the element techniques to realize from hand skill to automation, as followings: (1) The 5 axes polishing system by the aid of robot with 2 degrees of freedom, is developed for the application of curved surface die. (2) The CAM system realizes a 5 axes tool path control for polishing and measuring. (3) The conductive elastic tool is able to meet curved surfaces of die and gives a high efficient and quality polishing characteristics. (4) The surface roughness measurement device with noncontact laser is developed and has a high reliability without surface damage.

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광섬유센서에 의한 간이 비접촉 표면조도 측정기의 개발 (Development of the Handy Non-contact Surface Roughness Measurement Device by using the Optical Fiber Sensor)

  • 홍준희
    • 대한공업교육학회지
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    • 제34권2호
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    • pp.346-362
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    • 2009
  • 본 연구는 광섬유센서를 이용하여 표면조도의 간이 비접촉 측정기를 개발하는데 목적이 있다. 광섬유 센서의 장점은 우수한 고속 응답성, 자기의 무영향, 제작의 편이성이다. 광섬유센서 표면조도 측정 원리는 측정물의 표면조도에 따라 반사되는 광의 세기와 기지의 표면조도 값을 일대일 대응시키는 것이다. 반사광의 세기는 센서 프로브로부터 표면까지의 거리와 표면조도에 따른 반사한계각에 따라 결정되는데 본 연구에서는 표면까지의 거리를 일정하게 하여 표면조도에 따른 반사한계각만을 가지고 표면조도가 결정되도록 측정 프로브를 제작하였다. 측정 시스템은 발광부, 수광부과 신호처리부로 구성되었다. 이 실험에서 사용된 표준 측정 재료는 SM45C, STS303과 Al60이었다. 연구결과 첫째, 재료에 따른 표면조도와 센서출력의 상관관계로부터 근사표면조도식을 도출하고 임의 가공된 시료의 표면조도 측정을 통해 근사표면조도식이 유효함을 입증하였다. 둘째, 실제 제작한 간이 광섬유센서 표면조도 측정기가 유용함을 입증하였다.

가공면의 상태 변화 측정에 관한 연구

  • 조남규;최한광;한창수;안유민;박균명
    • 한국정밀공학회지
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    • 제18권2호
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    • pp.54-62
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    • 2001
  • This paper describes a new method for measuring the changes in specific surface asperities arising from processes such as finishing, coating, wear and corrosion. In repetitive measurements, relocation device gives the same position and orientation so that specific profile can be obtained. A low-cost relocation device is designed and its performance is assessed. The error in relocation process is compensated by statistic compensation algorithm. And, a removing process of cusp by grinding is observed by the proposed method.

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