• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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• pp.342-342
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• 2008

The low temperature sintering and microwave dielectric properties of ceramic/glass composites which were composed of ceramics in the $Bi_2(Zn_{1/3}Nb_{2/3})_2O_7$ and zinc borosilicate glass/bismuth-zinc borosilicate glass were investigated with a view to applying the microwave dielectrics to low temperature co-fired ceramics. The $Bi_2(Zn_{1/3}Nb_{2/3})_2O_7$ addition of 5 wt% ZBS and BZBS glass ensured a successful sintering below $900^{\circ}C$. In addition, pyrochlore phase was observed in the all composition. $Bi_2(Zn_{1/3}Nb_{2/3})_2O_7$ with 5 wt% BZBS glasss demonstrated 70 as the dielectric constant ($\varepsilon_r$), 2,500 GHz as the Q$\times$f value, and -40 ppm/$^{\circ}C$ as TCF.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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• pp.314-314
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• 2008

The low temperature sintering and the dielectric properties of $Al_2O_3/SiO_2$-zinc borosilicate glass composites were investigated in the view of the application for LTCC. When the sintering was conducted at $900^{\circ}C$ $ZnAl_2O_4$ and $ZnB_2O_4$ compounds formed at the $Al_2O_3$-rich and the $SiO_2$-rich compositions, respectively. The reaction between ZBS glass and $Al_2O_3/SiO_2$ caused the formation of these compounds. The $Al_2O_3/SiO_2$ ratio affected the dielectric properties. The excellent dielectric properties, i.e., Q$\times$f value= 40,000 GHz and ${\varepsilon}_r$=4.5, were obtained in the $Al_2O_3/SiO_2$-ZBS glass system and fabricated the LTCC substrate materials.

• International Journal of Internet, Broadcasting and Communication
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• 제10권3호
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• pp.109-114
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• 2018

In order to improve performance for the size of the BLPD, the CCL is used for the realization as the delay line. As realizing lower coupling coefficient and lower characteristic impedance, the CCL has good performance of the phase delay. The CCL is applied as the compact BLPD with optimized coupling factor and matched impedance because the lower coupling coefficient and lower characteristic impedance are increased the size and the loss, respectively. Designed BLPD using the CCL has the size of $0.13{\lambda}_g{\times}0.13{\lambda}_g$ and the size-reduction ratio of fabricated BLPD using the CCL has 58.5% ($21.08{\times}21.40mm^2$). Also, fabricated BLPD is measured the insertion loss of 3.16dB at the center frequency of 1.78GHz and the 20dB bandwidth is 9.58%. Differenced magnitude and phase between threw port and coupled port are measured 0.1dB and $89.9^{\circ}$, respectively. These performances are almost same compared with the conventional BLPD. Suggested application of the CCL can be used various devices and circuits for the size-reduction.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.1
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• pp.125-129
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• 2004

[ $BaTi_4O_9$ ] thin film were grown on $Pt/Ti/SiO_2/Si$ substrate using rf magnetron sputter, and the microstructure and dielectric properties of the thin films were investigated. For the film grown at $350^{\circ}C$ and rapidly thermal annealed at $900^{\circ}C$, the $BaTi_5O_{11}$ Phase was formed. However, the $BaTi_4O_9$ phase was formed when the growing temperature exceeded $450^{\circ}C$ The dielectric constant of the $BaTi_4O_9$ thin film grown at $550^{\circ}C$ and rapidly thermal annealed at $900^{\circ}C$ was about 40 at low frequency range($100kHz{\sim}1MHz$) and 36 at microwave range($1{\sim}10GHz$) which is very close to that of the bulk $BaTi_4O_9$ phase. The dissipation factor was very low, about 0.005 at low frequency as well as microwave range.

• 한국전자파학회논문지
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• 제18권6호
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• pp.577-583
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• 2007

Schroeder 방식의 QRD(quadratic Residue Diffuser) 구조에서 더욱 진화한 경사진 QRD를 사용하여 전자파 잔향실(reverberation chamber) 내의 전자기장 균일도를 향상시켰다. FDTD(Finite-Difference Time-Domain) 수치 해석방식을 이용하여 $2{\sim}3GHz$ 대역에서의 전자파 잔향실 내의 전자기장의 분포를 해석하였다. QRD 경사 각도의 조절과 경사 방향을 전환하여 전자파 잔향실 내부의 시험 공간에서의 E_x,\;E_y,\;E_z$ 샘플의 표준편차 및 공차가 각각 0.3 dB, 2.5 dB 향상되고 전체적으로 전자기장 분포의 균일성이 확보되었다.

• Journal of information and communication convergence engineering
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• 제11권3호
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• pp.147-152
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• 2013

A novel balun being the structure of a Wilkinson power divider is suggested and fabricated. One of the power dividing paths in the suggested balun uses a conventional ${\lambda}/4$ transmission line for $-90^{\circ}$ phase shifting, and the other path uses a composite right/left-handed -${\lambda}/4$ transmission line for $+90^{\circ}$ phase shifting with four series capacitors and three parallel inductors. In addition, the suggested balun uses two $50-{\Omega}$ resistors and a conventional $50-{\Omega}$ transmission line of ${\lambda}/2$ electrical length between the two output ports, achieving good isolation and reflection values of two balanced ports. The suggested balun is simulated by the advanced design system simulation program and fabricated on TLX-9 20-mil substrate. The fabricated balun has a very good values of $S_{11}$ = -27.46 dB, $S_{21}$ = -3.40 dB, and $S_{31}$ = -3.28 dB, a phase difference of $-179.5^{\circ}$, a magnitude difference of 0.12 dB, and a delay difference of 0.1 ns, with $S_{22}$ = -36.28 dB, $S_{33}$ = -27.19 dB, and $S_{32}$ = -25.2 dB at 1 GHz, respectively.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2006년도 제37회 하계학술대회 논문집 C
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• pp.1609-1610
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• 2006

이 논문은 인위적으로 전자파를 발생시켜 이 전자파에 의한 반도체 소자의 피해 효과를 조사한 것이다. 동작주파수가 2.45 GHz인 마그네트론으로부터 발생되는 전자파는 끝단이 개방되어있는 도파관을 통해 자유공간으로 전파되고, 도파관 끝단으로부터 $30\;cm\;{\sim}\;50\;cm$인 지점에 반도체 소자들을 위치시켜 동작상태를 확인하였다. 시험에 사용된 피시험체인 반도채 소자로는 TTL과 CMOS 기반기술의 반도체를 사용하였고, LED 구동회로를 구성하여 LED의 점등 여부로 오동작 및 파괴 여부를 육안 식별하였다. 또한 시험 전후의 반도체 소자 표면을 제거 후 칩 상태를 SEM 분석하였다. 시험 결과 도파관 끝단으로부터 50 cm, 40 cm 떨어진 지점에 반도체 소자를 위치시키고 도파관 끝단에서 발생되는 전자파에 의한 반도체 소자의 피해는 전혀 없었다. 그러나 30 cm 떨어진 지점에서 오동작 및 파괴가 일어났다. 오동작 및 파괴가 일어난 시료의 칩 상태를 SEM 분석한 결과 칩 내부의 onchipwire의 용융으로 인한 파괴와 bondingwire의 완전파괴를 확인할 수 있었다. 위의 시험 결과는 인위적인 전자파 환경에서 반도체 소자의 결합 기구를 해석하는 기초 자료로 활용되며, 전자 장비들의 전자파 장해에 대한 이해에 도움이 되는 자료로 활용될 수 있을 것이다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 하계학술대회 논문집 Vol.7
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• pp.307-308
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• 2006

In this paper, we propose an ultra wideband pass filter of ring type with embedded stripline stub. The fractional bandwidth was 98 % at the center frequency of 8 GHz and insertion loss was below 1 dB in passband. Two kinds of dielectric materials with the permittivity of 7.8 and 40, respectively were adopted in evaluating the suggested filter structure. As the permittivity of material became larger, the size of filter smaller as expected without any sacrifice in filter performance. In summary, the suggested filter structure has smaller size due to the embedded stripline stub and can be minimized by adopting dielectric material with higher permittivity again.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 추계학술대회 논문집
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• pp.268-269
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• 2007

In this study, the structural and microwave dielectric properties of the $Sr_5Nb_4O_{15}$ cation-deficient perovskite ceramics with sintering temperature were investigated. All sample of the $Sr_5Nb_4O_{15}$ ceramics were prepared by the conventional mixed oxide method and sintered at $1350^{\circ}C{\sim}1500^{\circ}C$. The bulk density, dielectric constant and quality factor of the $Sr_5Nb_4O_{15}$ ceramics were increased with increasing sintering temperature. In the case of the $Sr_5Nb_4O_{15}$ ceramics sintered at $1500^{\circ}C$ for 5h, the dielectric constant, quality factor and temperature coefficient of the resonant frequency (TCRF) were 22.35, 16,577GHz, +13.40ppm/$^{\circ}C$, respectively.

• 대한기계학회논문집A
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• 제25권6호
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• pp.959-964
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• 2001

An experimental investigation on the near-field electromagnetic loss of thin copper layers has been presented using microfabricated microwave transceivers for applications to multi-chip microsystems. Copper layers in the thickness range of 0.2$\mu$m∼200$\mu$m have been electroplated on the Pyrex glass substrates. Microwave transceivers have been fabricated using the 3.5mm$\times$3.5mm nickel microloop antennas, electroformed on the silicon substrates. Electromagnetic radiation loss of the copper layers placed between the microloop transceivers has been measured as 10dB∼40dB for the wave frequency range of 100MHz∼1GHz. The 0.2$\mu$m-thick copper layer provides a shield loss of 20dB at the frequencies higher than 300MHz, whereas showing a predominant decreases of shield loss to 10dB at lower frequencies. No substantial increase of the shield effectiveness has been found for the copper shield layers thicker that 2 $\mu$m.