• Proceedings of the Korea Electromagnetic Engineering Society Conference
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• 2005.11a
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• pp.111-114
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• 2005

The isolation performance of the S-band single-pole single-throw (SPST) monolithic microwave integrated circuit (MMIC) switch with two different RF-interconnection approaches, microstrip and grounded coplanar waveguide (GCPW) lines, are investigated. On-to-off isolation is improved by 5.8 dB with the GCPW design compared with the microstrip design and additional improvement of 6.9dB is obtained with the coplanar wire-bond interconnection (CWBI) at 3.4 GHz. The measured insertion loss and third-order inter-modulation distortion (IMD3) are less than 2.43 dB over 2.5 CHz $\sim$ 4 GHz and greater than 64 dBc.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.25 no.4
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• pp.487-490
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• 2014

This paper describes a design of an automotive radar frontend module with taking care of the routing of 77-GHz signals on a printed circuit board including wire-bond and waveguide transitions.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.22 no.1
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• pp.72-80
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• 1997

A 750 MHz CATV amplifier module has been designed and fabricated using PHEMT chips on alumina board. Developed 2-stage push-pull amplifier using wire bounded PHEMT chips shows 19dB gain, 15dB return loss and 4. 2dB noise figure over 50-750MHz frequency range. These results are superior to the characteristics of the commer-cially abailable 750MHz amplifier module. In this paper, brief background of the amplifier design, the circuit diagram and the test result have been presented.

• Proceedings of the KIEE Conference
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• 2000.07c
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• pp.1888-1890
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• 2000

This paper describes the analysis results for the protection of lightning surge at 154 kV substation. We found that the surge arrester is needed at the inlet structure. The maximum overvoltage is about 1,500 kV at the circuit breaker without the surge arrester at the inlet structure. This value can be lower than 600 kV by installing the surge arrestor at the inlet structure. In addition to the incoming surge from transmission line, the shield wire should be considered to prevent the shielding failure by the direct lightning stroke.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2004.05b
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• pp.472-474
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• 2004

In this study, we investigated the characteristics of the input impedance and the gain of a ‘Folded dipole antenna with stub’ by the Method of Moments. The center frequency in this study is 200MHz, the radius of wire is 0.5nm, and the distance between two linear dipoles is 2cm. The inside variation of stub length within 18cm and the outside variation of stub length 4.5cm ive the value of SWR(Standing Wave Ratio) within 3. This means that the impedance matching between the ‘Folded dipole antenna with stub’ and receiver can easily be performed without a supplementary matching circuit.

• Journal of the Korean Society of Industry Convergence
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• v.12 no.4
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• pp.215-219
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• 2009

A packaging technology based on flip-chip bonding and Pb-free solder for silicon pressure sensors on printed circuit board (PCB) is presented. First, the bump formation process was conducted by Pb-free solder. Ag-Sn-Cu solder and the pressed-screen printing method were used to fabricate solder bumps. The fabricated solder bumps had $189-223{\mu}m$ width, $120-160{\mu}m$ thickness, and 5.4-6.9 standard deviation. Also, shear tests was conducted to measure the bump shear strength by a Dage 2400 PC shear tester; the average shear strength was 74 g at 0.125 mm/s of test speed and $5{\mu}m$ shear height. Then, silicon pressure sensor packaging was implemented using the Pb-free solder and bump formation process. The characteristics of the pressure sensor were analogous to the results obtained when the pressure sensor dice are assembled and packaged using the standard wire-bonding technique.

• Proceedings of the KIEE Conference
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• 1992.07b
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• pp.961-965
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• 1992

It is well-known that shock waves frequently occur inside the nozzle of the interrupter, and that they play important roles in the arc interruption. A model interrupter with two-dimensional dual-airflow nozzles was used for this experiment. The arc was ignited with 1.4 mil copper wire stretched between the electrodes which were spaced out 56 mm. The arc current of 60 to 230 A was achieved by adjusting the external resistance from 5.5 to 1.6 ohms. The arc tests have been conducted for investigating the air arc characteristics, and the effects of shock waves and nozzle pressure ratios on the arc voltage, the arc resistance, the arc power, and average electric field. The results of these tests have been analyzed to provide insights into the arc characteristics for gas circuit breakers. The average electric field is represented by the function of the arc current to show the negative E-I characteristic explicitly. The effects of shock waves and nozzle pressure ratios are shown to be significant for a circuit breaker performance.

• Journal of Korea Multimedia Society
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• v.4 no.6
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• pp.570-578
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• 2001

Boundary scan architecture test methodology was introduced to facilitate the testing of complex printed circuit board. The boundary scan architecture has a tremendous potential for real time monitoring of the operational status of a system without interference of normal system operation. In this paper, a new type of embedded controller for real time monitoring of the operational status of a system is proposed and designed by using boundary scan architecture. The proposed real time monitoring embedded controller consists of test access port controller and an embedded controller proposed real time monitoring embedded controller using boundary scan architecture can save the hard-wire resource and can easily interface with boundary scan architecture chip. Experimental results show that the real time monitoring using proposed embedded controller is more effective then the real time monitoring using host computer.

• The KIPS Transactions:PartA
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• v.14A no.2
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• pp.107-116
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• 2007

In this paper, we present a method on the construction of multiple-valued circuits using Reed-Muller Expansions(RME). First, we discussed the input output interconnection of multiple valued function using Perfect Shuffle techniques and Kronecker product and designed the basic cells of performing the transform matrix and the reverse transform matrix of multiple valued RME using addition circuit and multiplication circuit of GF(4). Using these basic cells and the input-output interconnection technique based on Perfect Shuffle and Kronecker product, we implemented the multiple valued logic circuit based on RME. The proposed design method of multiple valued RME is simple and very efficient to reduce addition circuits and multiplication circuits as compared with other methods for same function because of using matrix transform based on modular structures. The proposed design method of multiple valued logic circuits is simple and regular for wire routing and possess the properties of concurrency and modularity of array.

• Journal of Fashion Business
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• v.11 no.4
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• pp.173-182
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• 2007

The concept of wearable computer says to be able to connect to network freely without restrict of place and time through the garment that contain the wire and circuit. Thereby we can realize the ubiquitous circumstances. Wearable computer plays a role of center in controlling the electronic equipments under the ubiquitous circumstances and also it will become the main stream of the future computer development. The current wearable computer displays ugly appearance by attaching the parts of computer on the garment instead of installing them in the box. However, as size of computer components are minimized and it's speed is getting faster, it is certain that wearable computer will evolve as fashionable computer, still retaining garment's original purpose such as fitting and fasion even though the computer is being installed to the clothing. This study reviewed about components, future market share, developed goods, human-being becoming cyborg, application area, restrict and on-going research of wearable computer.