• Journal of the Korean Society for Precision Engineering
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• v.15 no.3
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• pp.99-106
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• 1998

Recently, scientists introduced a new type of microscope capable of investigating nonconducting surfaces in an atomic scale, which is called AFM (Atomic Force Microscope). It was an innovative attempt to overcome the limitation of STM (Scanning Tunnelling Microscope) which has been able to obtain the image of conducting surfaces. Surfaces of samples are imaged with atomic resolution. The AFM is an imaging tool or a profiler with unprecedented 3-D resolution for various surface types. The AFM technology, however, leaves a lot of room for improvement due to its delicate and fragile probing mechanism. One of the room for improvements is gap control between probe tip and sample surface. Distance between probe tip and sample surface must be kept in below one Angtrom in order to measure the sample surface in Angstrom resolution. In this paper, AFM system modeling, experimental system identification and control scheme based on system identification are performed and finally sample surface is measured by home-built AFM with such a control scheme.

• Journal of Integrative Natural Science
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• v.9 no.4
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• pp.223-227
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• 2016

The Zn, Sn, and ZnSn thin films were deposited on Si(100) substrate using radio frequency (RF) magnetron co-sputtering method. A surface profiler and X-ray photoelectron spectroscopy (XPS) were used to investigate the Zn, Sn, and ZnSn thin films. Thickness of the thin films was measured by a surface profiler. The deposition rates of pure Zn and Sn thin films were calculated with thickness and sputtering time for optimization. From the survey XPS spectra, we could conclude that the thin films were successfully deposited on Si(100) substrate. The chemical environment of the Zn and Sn was monitored with high resolution XPS spectra in the binding energy regions of Zn 2p, Sn 3d, O 1s, and C 1s.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2000.11a
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• pp.643-648
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• 2000

The AFM is an imaging tool or a profiler with unprecedented 3-D resolution for various surface types. The AFM technology, however, leaves a lot of room for improvement due to its delicate and fragile probing mechanism. The distance between probe tip and sample surface must be maintained in below the nano meter level in order to measure the sample surface in Angstrom resolution. In this paper, the mode analysis of AFM system, modification based on the mode analysis are performed and finally the sample surface is measured by the home-built AFM.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2007.10a
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• pp.124-127
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• 2007

In this study, we focused on investigation of governing parameters affected on the fatigue properties in the hyper-eutectoid steel wires used for TBR tires. Steel wires are fabricated under different drawing strain from 3.36 to 3.80. Their diameters are 0.21 mm and 0.185mm, respectively. The fatigue properties was measured by hunter rotating beam tester, specially designed thin-sized steel wires. The results showed that the fatigue properites of steel wire, marked as A-1, were greater than the others, due to the low value of residual stress. In order to elucidate the variations of fatigue properties, the microstructure, surface defect and residual stress were observed and measured by useful analysis technique, such as TEM, 3D profiler and FIB.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.1
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• pp.39-45
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• 2012

Three-dimensional integrated circuit(3D IC) technology has become increasingly important due to the demand for high system performance and functionality. In this work, BOE and HF wet etching of Cu line surfaces after CMP were conducted for Cu-Cu pattern direct bonding. Step height of Cu and $SiO_2$ as well as Cu dishing after Cu CMP were analyzed by the 3D-Profiler. Step height increased and Cu dishing decreased with increasing BOE and HF wet etching times. XPS analysis of Cu surface revealed that Cu surface oxide layer was partially removed by BOE and HF wet etching treatment. BOE treatment showed not only the effective $SiO_2$ etching but also reduced dishing and Cu surface oxide rather than HF treatment, which can be used as an meaningful process data for reliable Cu-Cu pattern bonding characteristics.

• Journal of the Korean Society of Fisheries and Ocean Technology
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• v.46 no.4
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• pp.449-457
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• 2010

This study shows that the vertical migration speed of sound scattering layers (SSLs), which is distributed in near Funka Bay, were measured by 3D velocity components acquired from a bottom moorng ADCP. While the bottom mooring type has a problem to measure the velocity vectors of sound scattering layer distributed near to surface, both the continuous vertical migration patterns and variability of backscatterers were routinely investigated as well. In addition, the velocity vectors were compared with the vertical migration velocity estimated from echograms of Mean Volume Backscattering Strength, and estimated to produce observational bias due to SSLs which is composed of backscatterers such as euphausiids, nekton, and fishes have swimming ability.

• Transactions of Materials Processing
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• v.19 no.2
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• pp.132-137
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• 2010

In the multi-pass shape drawing process, the appropriate process design is very important to produce sound products. The reduction ratio, die angle, and the intermediate die shape are very important process variable of the multi-pass shape drawing. The aim of this study is the determination of the reduction ratio, die angle, and the intermediate die shape of the 2 pass shape drawing process for producing steering spline shaft. In this study, FE analysis, Taguchi method, and ANN(artificial neural network) were applied to determine the appropriate reduction ratio, die angle, and intermediate die shape. After the determination of the process variables, FE analysis and drawing experiment were performed to evaluate the effectiveness of the determined process variables. The dimensional accuracy of the final drawn spline shaft was evaluated by using 3D surface profiler and 3D laser digitizing system.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.52 no.8
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• pp.325-329
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• 2003

Effects of thermal treatment on the structural properties of diamond-like carbon (DU) films were examined. The DLC films were deposited by using a modified filtered cathodic vacuum arc (FCVA) deposition system and by varying the negative substrate bias voltage, deposition time, and nitrogen flow rate. Thermal treatment on DLC films was performed using a rapid thermal annealing (RTA) process at $600^{\circ}C$ for 2min. Raman spectroscopy, x-ray photoemission spectroscopy (XPS), atomic force microscope (AFM), and surface profiler were used to characterize the I$_{D}$I$_{G}$ intensity ratio, sp$^3$ hybrid carbon fraction, internal stress, and surface roughness. It was found for all the deposited DLC films that the RTA-treatment results in the release of internal compressive stress, while at the same time it leds to the decrease of sp$^3$ fraction and the increase of I$_{D}$I$_{G}$ intensity ratio. It was also suggested that the thermal treatment effect on the structural property of DLC films strongly depends on the diamond-like nature (i.e., sp$^3$ fraction) of as-deposited film.ed film.

• The Journal of Advanced Prosthodontics
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• v.9 no.3
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• pp.188-194
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• 2017

PURPOSE. This study was to evaluate the effect of repeated ultrasonic scaling and surface polishing with intraoral polishing kits on the surface roughness of three different restorative materials. MATERIALS AND METHODS. A total of 15 identical discs were fabricated with three different materials. The ultrasonic scaling was conducted for 20 seconds on the test surfaces. Subsequently, a multi-step polishing with recommended intraoral polishing kit was performed for 30 seconds. The 3D profiler and scanning electron microscopy were used to investigate surface integrity before scaling (pristine), after scaling, and after surface polishing for each material. Non-parametric Friedman and Wilcoxon signed rank sum tests were employed to statistically evaluate surface roughness changes of the pristine, scaled, and polished specimens. The level of significance was set at 0.05. RESULTS. Surface roughness values before scaling (pristine), after scaling, and polishing of the metal alloys were $3.02{\pm}0.34{\mu}m$, $2.44{\pm}0.72{\mu}m$, and $3.49{\pm}0.72{\mu}m$, respectively. Surface roughness of lithium disilicate increased from $2.35{\pm}1.05{\mu}m$ (pristine) to $28.54{\pm}9.64{\mu}m$ (scaling), and further increased after polishing ($56.66{\pm}9.12{\mu}m$, P<.05). The zirconia showed the most increase in roughness after scaling (from $1.65{\pm}0.42{\mu}m$ to $101.37{\pm}18.75{\mu}m$), while its surface roughness decreased after polishing ($29.57{\pm}18.86{\mu}m$, P<.05). CONCLUSION. Ultrasonic scaling significantly changed the surface integrities of lithium disilicate and zirconia. Surface polishing with multi-step intraoral kit after repeated scaling was only effective for the zirconia, while it was not for lithium disilicate.

• Korean Journal of Materials Research
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• v.22 no.9
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• pp.482-488
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• 2012

To fabricate a precise micro metal mold, the electrochemical etching process has been researched. We investigated the electrochemical etching process numerically and experimentally to determine the etching tendency of the process, focusing on the current density, which is a major parameter of the process. The finite element method, a kind of numerical analysis, was used to determine the current density distribution on the workpiece. Stainless steel(SS304) substrate with various sized square and circular array patterns as an anode and copper(Cu) plate as a cathode were used for the electrochemical experiments. A mixture of $H_2SO_4$, $H_3PO_4$, and DIW was used as an electrolyte. In this paper, comparison of the results from the experiment and the numerical simulation is presented, including the current density distribution and line profile from the simulation, and the etching profile and surface morphology from the experiment. Etching profile and surface morphology were characterized using a 3D-profiler and FE-SEM measurement. From a comparison of the data, it was confirmed that the current density distribution and the line profile of the simulation were similar to the surface morphology and the etching profile of the experiment, respectively. The current density is more concentrated at the vertex of the square pattern and circumference of the circular pattern. And, the depth of the etched area is proportional to the current density.