• Title/Summary/Keyword: 3D placement

Search Result 155, Processing Time 0.027 seconds

Stress distributions in peri-miniscrew areas from cylindrical and tapered miniscrews inserted at different angles

  • Choi, Sung-Hwan;Kim, Seong-Jin;Lee, Kee-Joon;Sung, Sang-Jin;Chun, Youn-Sic;Hwang, Chung-Ju
    • The korean journal of orthodontics
    • /
    • v.46 no.4
    • /
    • pp.189-198
    • /
    • 2016
  • Objective: The purpose of this study was to analyze stress distributions in the roots, periodontal ligaments (PDLs), and bones around cylindrical and tapered miniscrews inserted at different angles using a finite element analysis. Methods: We created a three-dimensional (3D) maxilla model of a dentition with extracted first premolars and used 2 types of miniscrews (tapered and cylindrical) with 1.45-mm diameters and 8-mm lengths. The miniscrews were inserted at $30^{\circ}$, $60^{\circ}$, and $90^{\circ}$ angles with respect to the bone surface. A simulated horizontal orthodontic force of 2 N was applied to the miniscrew heads. Then, the stress distributions, magnitudes during miniscrew placement, and force applications were analyzed with a 3D finite element analysis. Results: Stresses were primarily absorbed by cortical bone. Moreover, very little stress was transmitted to the roots, PDLs, and cancellous bone. During cylindrical miniscrew insertion, the maximum von Mises stress increased as insertion angle decreased. Tapered miniscrews exhibited greater maximum von Mises stress than cylindrical miniscrews. During force application, maximum von Mises stresses increased in both groups as insertion angles decreased. Conclusions: For both cylindrical and tapered miniscrew designs, placement as perpendicular to the bone surface as possible is recommended to reduce stress in the surrounding bone.

Analysis of Gas Flow Behavior with Experiments for LPG releasing and 3D Mapping of Gas Sensor (LPG 누출 및 가스센서 3D Mapping을 통한 가스유동현상 분석)

  • Kim, Jeong Hwan;Lee, Min-Kyung;Kil, Seong-Hee;Lee, Jin-han;Jo, Young-do;Moon, Jong-Sam
    • Journal of the Korean Institute of Gas
    • /
    • v.21 no.5
    • /
    • pp.45-55
    • /
    • 2017
  • Release and fire/explosion tests of flammable gas are extremely dangerous. Furthermore, it is difficult to select the site where the experiment can be performed. In these reasons, gas flow analysis(CFD) has been used as much as possible. However, with the opening of the Energy Safety Empirical Research Center in Yeongwol-gun, Gangwon-do in October 2016, it was possible to conduct releases and detection tests of small scale combustible gas as well as large scale / high pressure / ultra low temperature experiments. In this study, LPG leaked after the calibration and placement of the sensor, the sensor detected LPG and the data were visualized as a contour map. And the differences between the actual release(28s, max 3.7[m]) and the analysis were analyzed compared to the FLACS analyzed under the same conditions.

Role of Multislice Computerized Tomographic Angiography after Clip Placement in Aneurysm Patients Based on Comparison with Three Dimensional Digital Subtraction Angiography

  • Han, Myung-Hwan;Kim, Young-Don
    • Journal of Korean Neurosurgical Society
    • /
    • v.42 no.2
    • /
    • pp.103-111
    • /
    • 2007
  • Objective : We evaluated the accuracy of multislice computerized tomographic angiography (MCTA) in the postoperative evaluation of clipped aneurysms by comparising it with three dimensional digital subtraction angiography (3D-DSA). Methods : Between May 2004 and September 2006, we included patients with ruptured cerebral aneurysm of the anterior circulation that was surgically clipped and evaluated by both postoperative MCTA and postoperative 3D-DSA. We measured the diagnostic performance and calculated the sensitivity and specificity of postoperative MCTA compared to 3D-DSA in the detection of aneurysm remnants. Results : A total of 11 neck remnants among the 92 clipped aneurysms (11.9%) were confirmed by 3D-DSA. According to Sindou's classification of aneurysm remnants, 8.7% of clipped aneurysms (8/92) had only neck remnant on 3D-DSA and 3.2% (3/92 aneurysms) had residuum of the neck and sac on 3D-DSA. There were 12 (13.04%) equivocal cases that were difficult to interpret based on the postoperative MCTA. The reasons for the equivocal cases included multiple clips (6 cases, 50.0%). beam-hardening effect (4 cases, 33.3%), motion artifact (1 case, 8.3%), fenestrated clip (1 case, 8.3%) and other combined causes. The sensitivity and specificity of the postoperative MCTA was 81.8% and 88.9%, respectively by ROC curve (p=0.000). Conclusion : MCTA is an accurate noninvasive imaging method used for the assessment of clipped aneurysms in the anterior circulation. If the image quality of postoperative MCTA is good quality and the patient has been treated with a single titanium clip, except a fenestrated clip, the absence of an aneurysm remnant can be diagnosed by MCTA alone and the need for postoperative DSA can be reduced in a large percentage of cases.

Integration Technologies for 3D Systems

  • Ramm, P.;Klumpp, A.;Wieland, R.;Merkel, R.
    • Proceedings of the International Microelectronics And Packaging Society Conference
    • /
    • 2003.09a
    • /
    • pp.261-278
    • /
    • 2003
  • Concepts.Wafer-Level Chip-Scale Concept with Handling Substrate.Low Accuracy Placement Layout with Isolation Trench.Possible Pitch of Interconnections down to $10{\mu}{\textrm}{m}$ (Sn-Grains).Wafer-to-Wafer Equipment Adjustment Accuracy meets this Request of Alignment Accuracy (+/-1.5 ${\mu}{\textrm}{m}$).Adjustment Accuracy of High-Speed Chip-to-Wafer Placement Equipment starts to meet this request.Face-to-Face Modular / SLID with Flipped Device Orientation.interchip Via / SLID with Non-Flipped Orientation SLID Technology Features.Demonstration with Copper / Tin-Alloy (SLID) and W-InterChip Vias (ICV).Combination of reliable processes for advanced concept - Filling of vias with W as standard wafer process sequence.No plug filling on stack level necessary.Simultanious formation of electrical and mechanical connection.No need for underfiller: large area contacts replace underfiller.Cu / Sn SLID layers $\leq$ $10{\mu}{\textrm}{m}$ in total are possible Electrical Results.Measurements of Three Layer Stacks on Daisy Chains with 240 Elements.2.5 Ohms per Chain Element.Contribution of Soldering Metal only in the Range of Milliohms.Soldering Contact Resistance ($0.43\Omega$) dominated by Contact Resistance of Barrier and Seed Layer.Tungsten Pin Contribution in the Range of 1 Ohm

  • PDF

A Study on the Correlation among Historic Remains of the Preah Pithu through the Floor Plan Restoration -A Study of Preah Pithu Monument in Angkor (1)- (프레아피투 사원 평면도 복원을 통한 유구 간 상관관계 고찰 -앙코르 유적 "프레아피투 사원" 연구 (1)-)

  • Park, Dong-Hee;Kim, Jiseo;Kim, Chul-Min
    • Journal of architectural history
    • /
    • v.26 no.1
    • /
    • pp.61-70
    • /
    • 2017
  • We surveyed Preah Pithu monument group site in Angkor. We made the map of present condition throughout the actual measurement and 3D scan. And we restored the floor plan, and completed the map of site placement. During this processing, we confirmed the middle axis of temples and studied the relation of temples and made clear the order of sites. Throughout this studying, we verified the middle axis of sites is not matched in Preah Pithu monument group. It is different aspect comparing with general Khmer religion architectures which were built with the planification belonging to strong royal authority and shared main axis through whole sites. In other words, we can estimate that Preah Pithu monument group was not built with planification rather than expanded as occasional demand during the process of actual use.

Dual Polarized Array Antenna for S/X Band Active Phased Array Radar Application

  • Han, Min-Seok;Kim, Ju-Man;Park, Dae-Sung;Kim, Hyoung-Joo;Choi, Jae-Hoon
    • Journal of electromagnetic engineering and science
    • /
    • v.10 no.4
    • /
    • pp.309-315
    • /
    • 2010
  • A dual-band dual-polarized microstrip antenna array for an advanced multi-function radio function concept (AMRFC) radar application operating at S and X-bands is proposed. Two stacked planar arrays with three different thin substrates (RT/Duroid 5880 substrates with $\varepsilon_r$=2.2 and three different thicknesses of 0.253 mm, 0.508 mm and 0.762 mm) are integrated to provide simultaneous operation at S band (3~3.3 GHz) and X band (9~11 GHz). To allow similar scan ranges for both bands, the S-band elements are selected as perforated patches to enable the placement of the X-band elements within them. Square patches are used as the radiating elements for the X-band. Good agreement exists between the simulated and the measured results. The measured impedance bandwidth (VSWR$\leq$2) of the prototype array reaches 9.5 % and 25 % for the S- and X-bands, respectively. The measured isolation between the two orthogonal polarizations for both bands is better than 15 dB. The measured cross-polarization level is ${\leq}-21$ dB for the S-band and ${\leq}-20$ dB for the X-band.

Clock Mesh Network Design with Through-Silicon Vias in 3D Integrated Circuits

  • Cho, Kyungin;Jang, Cheoljon;Chong, Jong-Wha
    • ETRI Journal
    • /
    • v.36 no.6
    • /
    • pp.931-941
    • /
    • 2014
  • Many methodologies for clock mesh networks have been introduced for two-dimensional integrated circuit clock distribution networks, such as methods to reduce the total wirelength for power consumption and to reduce the clock skew variation through consideration of buffer placement and sizing. In this paper, we present a methodology for clock mesh to reduce both the clock skew and the total wirelength in three-dimensional integrated circuits. To reduce the total wirelength, we construct a smaller mesh size on a die where the clock source is not directly connected. We also insert through-silicon vias (TSVs) to distribute the clock signal using an effective clock TSV insertion algorithm, which can reduce the total wirelength on each die. The results of our proposed methods show that the total wirelength was reduced by 12.2%, the clock skew by 16.11%, and the clock skew variation by 11.74%, on average. These advantages are possible through increasing the buffer area by 2.49% on the benchmark circuits.

Wind Turbine Placement Optimization at the Catholic University of Pusan Using 3-D Drone Mapping

  • Ambrosia, Matthew Stanley
    • Journal of Environmental Science International
    • /
    • v.30 no.1
    • /
    • pp.19-28
    • /
    • 2021
  • To reduce pollution, decrease the production of carbon dioxide, and to maintain a secure supply of energy, interest continues to grow in the area of renewable energy especially since there is a finite supply of cheap oil. Wind energy is one of the most viable options to consider and supply part of the energy needed to reduce dependence on foreign oil. However, it is difficult to predict the wind speed in an environment with many obstacles such as buildings and trees and getting accurate dimensions of those obstacles is difficult particularly on sloped mountainous terrain. In this study a drone was used to create a 3-D map of the campus of the Catholic University of Pusan. The dimensions and elevations for the 3-D map were used to make a model of the school campus in the CFD program Envi-met. Simulations were run for five different wind directions and 4 different elevations to find the location that would give the highest electrical output for a wind turbine. When considering all of these variables it was found that the optimal location was above the Student Union which had a 40% higher wind speed and could produce 274% more electrical power than the original wind speed.

A study on Optimal Sensor Placement using 3D information of LiDAR (LiDAR자료의 3차원 정보를 이용한 최적 Sensor 위치 선정 가능성 분석)

  • Yu, Han-Seo;Lee, Woo-Kyun;Choi, Sung-Ho;Kang, Byoung-Jin
    • Proceedings of the Korean Association of Geographic Inforamtion Studies Conference
    • /
    • 2009.04a
    • /
    • pp.244-245
    • /
    • 2009
  • 일반적으로 LiDAR(Light Detection And Ranging)의 자료로부터 3차원 위치정보와 속성 정보를 취득하여 활용 하는 연구가 많이 진행되고 있다. 본 연구에서는 Grid($100m{\times}100m$) 기반인 2차원적 Grid Point를 통해 Sensor Field를 정하고 LiDAR의 3차원적 좌표정보를 이용하여 최적 센서 위치를 선정하고 중간에 장애물(Obstacle)이 존재하는 경우 또한 알고리즘을 통해 최적위치인 Grid point를 선정하였다. 알고리즘은 3가지 측면을 고려하여 분류하였다. 첫째 장애물이 없는(Non Obstacle) 2차원적인 경우, 둘째 장애물이 존재(Obstacle)하는 2차원적인 경우, 셋째 장애물이 존재(Obstacle)하며 3차원적인 알고리즘을 고려하였다. 향후 연구에서는 LiDAR를 직접 적용하여 최적 선정 지역을 도출하여 알고리즘을 적용할 것이다.

  • PDF

Improving Through-thickness Thermal Conductivity Characteristic of Hybrid Composite with Quantum Annealing (Quantum annealing을 통한 hybrid composite의 두께 방향 열전도 특성 개선)

  • Sung wook Cho;Seong S. Cheon
    • Composites Research
    • /
    • v.37 no.3
    • /
    • pp.170-178
    • /
    • 2024
  • This study proposes a hybrid composite where a thin copper film (Cu film) is embedded in carbon fiber reinforced plastic (CFRP), and quantum annealing is applied to derive the combination of Cu film placement that maximizes the through-thickness thermal conductivity. The correlation between each ply of CFRP and the Cu film is analyzed through finite element analysis, and based on the results, a combination optimization problem is formulated. A formalization process is conducted to embed the defined problem into quantum annealing, resulting in the formulation of objective functions and constraints regarding the quantity of Cu films that can be inserted into each ply of CFRP. The formulated equations are programmed using Ocean SDK (Software Development Kit) and Leap to be embedded into D-Wave quantum annealer. Through the quantum annealing process, the optimal arrangement of Cu films that satisfies the maximum through-thickness thermal conductivity is determined. The resulting arrangements exhibit simpler patterns as the quantity of insertable Cu films decreases, while more intricate arrangements are observed as the quantity increases. The optimal combinations generated according to the quantity of Cu film placement illustrate the inherent thermal conductivity pathways in the thickness direction, indicating that the transverse placement freedom of the Cu film can significantly affect the results of through-thickness thermal conductivity.