• Journal of Korea Foundry Society
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• v.40 no.3
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• pp.61-65
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• 2020

Rheo-diecasting with stirring has been used in many material industries. As the 4th Industrial Revolution approaches the world, eco-friendly high-strength and light-weight materials become more important. Casting methods have been studied and used for aluminum-alloy automobile parts. This study carried out the effect analysis of the micro-structure and mechanical properties, such as yield/ultimate tensile strength, elongation, and hardness, of A356 using the 6-pole EMS (electro-magnetic stirring) casting process with a high electromagnetic force. As a result, the hardness and elongation of the A356 after T6 heat-treatment show a significant improvement, respectively, by 20% and 50%.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.18 no.3
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• pp.231-236
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• 2005

To investigate the electrical properties at the single grainboundary of ZnO varistors, micro-electrodes were fabricated on the surface which was polished and thermally etched. Our micro-electrode had 2000 $\AA$ silicon nitride layer between micro-electrode and ZnO surface. This layer was deposited by PECVD and etched by RIE after photoresistor pattering process using by mask 1. The metal patterning of micro-electrodes used lift-off method. We found that the breakdown voltage of single grainboundary is about 3.5∼4.2 V at 0.1 mA on I-V curves. Also, capacitance-voltage measurement at single grainboundary gave several parameters( $N_{d}$, $N_{t}$, $\Phi$$_{b}$, t) which were related with grainboundary.ary.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.287.1-287.1
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• 2016

Three-dimensional (3-D) semiconductor nanoarchitectures, including nano- and micro- rods, pyramids, and disks, are emerging as one of the most promising elements for future optoelectronic devices. Since these 3-D semiconductor nanoarchitectures have many interesting unconventional properties, including the use of large light-emitting surface area and semipolar/nonpolar nano- or micro-facets, numerous studies reported on novel device applications of these 3-D nanoarchitectures. In particular, 3-D nanoarchitecture devices can have noticeably different current spreading characteristics compared with conventional thin film devices, due to their elaborate 3-D geometry. Utilizing this feature in a highly controlled manner, color-tunable light-emitting diodes (LEDs) were demonstrated by controlling the spatial distribution of current density over the multifaceted GaN LEDs. Meanwhile, for the fabrication of high brightness, single color emitting LEDs or laser diodes, uniform and high density of electrical current must be injected into the entire active layers of the nanoarchitecture devices. Here, we report on a new device structure to inject uniform and high density of electrical current through the 3-D semiconductor nanoarchitecture LEDs using metal core inside microtube LEDs. In this work, we report the fabrications and characteristics of metal-cored coaxial $GaN/In_xGa_{1-x}N$ microtube LEDs. For the fabrication of metal-cored microtube LEDs, $GaN/In_xGa_{1-x}N/ZnO$ coaxial microtube LED arrays grown on an n-GaN/c-Al2O3 substrate were lifted-off from the substrate by wet chemical etching of sacrificial ZnO microtubes and $SiO_2$ layer. The chemically lifted-off layer of LEDs were then stamped upside down on another supporting substrates. Subsequently, Ti/Au and indium tin oxide were deposited on the inner shells of microtubes, forming n-type electrodes of the metal-cored LEDs. The device characteristics were investigated measuring electroluminescence and current-voltage characteristic curves and analyzed by computational modeling of current spreading characteristics.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.10a
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• pp.397-400
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• 2004

The direct extrusion with porthole die can produce condenser tube which has the competitive power in costs and qualities compared with the existing conform extrusion. In general, porthole die extrusion has a great advantage in the forming that produces the hollow sections difficult to produce by conventional extrusion with a mandrel on the stem. Especially, condenser tube manufactured by porthole die belongs to sophisticated part and demands tighter dimension tolerance and higher surface finish than any other part. In order to confirm the general of porthole die extrusion, we perform the 3D FE analysis of hot porthole extrusion in non-steady state by using DEFORM 3D and investigate a pattern of elastic deformation for porthole die through the stress analysis using ANSYS 5.5 during extrusion process.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2011.06a
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• pp.675-676
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• 2011

• Transactions on Electrical and Electronic Materials
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• v.1 no.1
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• pp.40-44
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• 2000

Metal-ferroelectric-insulator-semoiconductor field effect transistor (MFISFETs) were fabricated using CMOS processes. The Pt/SBT/NO combined layers were etched for forming a conformal gate by using Ti/Cr metal masks and a two step etching method, By the method, we were able to fabricate a small-sized gate with the dimension of $16/4{\mu}textrm{m}$ in the width/length of gate. It has been chosen the non-self aligned source and drain implantation process, We have deposited inter-layer dielectrics(ILD) by low pressure chemical vapor deposition(LPCVD) at $380^{circ}C$ after etching the gate structure and the threshold voltage of p-channel MFISFETs were about 1.0 and -2.1V, respectively. It was also observed that the current difference between the $I_{ON}$(on current) and $I_{OFF}$(off current) that is very important in sensing margin, is more that 100 times in $I_{D}-V_{G}$ hysteresis curve.

• Transactions of Materials Processing
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• v.20 no.7
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• pp.518-523
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• 2011

The three dimensional geometries of an aluminum open cell foam before and after uniaxial compressive loading were investigated using the X-ray micro CT(computed tomography). Aluminum 6101-T6 open cell foams of 10, 20, 40 ppi (pore per inch) were considered in this work. After the serial sectioning CT images of aluminum foams were obtained from non-destructive X-ray images, the exact 3D structure were reproduced and visualized with commercial image processing program. The relative density ratio was around the 7.0 to 9.0 range, the unit cells showed anisotropic shapes having the different dimensional ratios of 1.1 to 1.3 between the rise and the transverse directions. The yield stress increased with the relative density ratio and the volumetric strain increased proportionally with compressive strain. The plateau stress in the compressive stress-strain curve was caused by the buckling of ligaments.

• Korean Journal of Materials Research
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• v.22 no.9
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• pp.482-488
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• 2012

To fabricate a precise micro metal mold, the electrochemical etching process has been researched. We investigated the electrochemical etching process numerically and experimentally to determine the etching tendency of the process, focusing on the current density, which is a major parameter of the process. The finite element method, a kind of numerical analysis, was used to determine the current density distribution on the workpiece. Stainless steel(SS304) substrate with various sized square and circular array patterns as an anode and copper(Cu) plate as a cathode were used for the electrochemical experiments. A mixture of $H_2SO_4$, $H_3PO_4$, and DIW was used as an electrolyte. In this paper, comparison of the results from the experiment and the numerical simulation is presented, including the current density distribution and line profile from the simulation, and the etching profile and surface morphology from the experiment. Etching profile and surface morphology were characterized using a 3D-profiler and FE-SEM measurement. From a comparison of the data, it was confirmed that the current density distribution and the line profile of the simulation were similar to the surface morphology and the etching profile of the experiment, respectively. The current density is more concentrated at the vertex of the square pattern and circumference of the circular pattern. And, the depth of the etched area is proportional to the current density.

• The Korean Journal of Ceramics
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• v.5 no.1
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• pp.55-72
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• 1999

A cheallenge in the aerospace field is to design new composites satisfying specific and sometimes conflicting properties. The key steps are ⅰ)the understanding and the control of the reaction between the reinforcement and the embedding matrix, ⅱ) the achievement of a coherent and robust matrix. The problems encountered to prepare particulate, 1D, 2D and 3D reinforced composites using polymeric are discussed. Emphasis is given to the control of the micro/nanostructure using Raman microspectrometry and depth-sensing microindentation, in order to get information on the micromechanics and fiber structure simultaneously, within ceramic (CMC's) and metal matrix (MMC's) composites.

• Transactions of Materials Processing
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• v.15 no.4 s.85
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• pp.326-332
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• 2006

Sandwich structures, which are composed of a thick core between two faces, are commonly used in many engineering applications because they combine high stiffness and strength with low weight. Depending on the sheets by a rolling process, which is a more efficient and economical approach compared to other types of processes, has become an increasingly important subject of study. In this paper, we made a roll forming machine which progressive forming possible and force measurement for a roll forming of the sheet metal forming. And we designed a roll molding that arrayed of embossing size 3mm in diameter fabricate micro dimple inner structure plate. We carried out forming experiment such as array change and thickness to sts304 sheet. Ultimately, this research developed inner structure plate of high stiffness.