• Journal of the Microelectronics and Packaging Society
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• v.22 no.2
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• pp.11-19
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• 2015

Since CMOS device scaling has stalled, three-dimensional (3-D) integration allows extending Moore's law to ever high density, higher functionality, higher performance, and more diversed materials and devices to be integrated with lower cost. 3-D integration has many benefits such as increased multi-functionality, increased performance, increased data bandwidth, reduced power, small form factor, reduced packaging volume, because it vertically stacks multiple materials, technologies, and functional components such as processor, memory, sensors, logic, analog, and power ICs into one stacked chip. Anticipated applications start with memory, handheld devices, and high-performance computers and especially extend to multifunctional convengence systems such as cloud networking for internet of things, exascale computing for big data server, electrical vehicle system for future automotive, radioactivity safety system, energy harvesting system and, wireless implantable medical system by flexible heterogeneous integrations involving CMOS, MEMS, sensors and photonic circuits. However, heterogeneous integration of different functional devices has many technical challenges owing to various types of size, thickness, and substrate of different functional devices, because they were fabricated by different technologies. This paper describes new 3-D heterogeneous integration technologies of chip self-assembling stacking and 3-D heterogeneous opto-electronics integration, backside TSV fabrication developed by Tohoku University for multifunctional convergence systems. The paper introduce a high speed sensing, highly parallel processing image sensor system comprising a 3-D stacked image sensor with extremely fast signal sensing and processing speed and a 3-D stacked microprocessor with a self-test and self-repair function for autonomous driving assist fabricated by 3-D heterogeneous integration technologies.

• Journal of Institute of Control, Robotics and Systems
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• v.19 no.3
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• pp.219-226
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• 2013

A distortion correction technique is presented to enhance the 3D scanning performance of a micro-size camera-projector system. Recently, several types of micro-size digital projectors and cameras are available. However, there have been few effort to develop a micro-size 3D scanning system. We develop a micro-sized 3D scanning system which is based on the structured light technique. Three images of phase-shifted sinusoidal patterns are projected, captured, and analyzed by the system to reconstruct 3D shapes of very small objects. To overcome inherent optical imperfection of the micro 3D sensor, we correct the vignetting and blooming effects which cause distortions in the phase image. Error analysis and 3D scanning results on small real objects are presented to show the performance of the developed 3D scanning system.

• JSTS:Journal of Semiconductor Technology and Science
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• v.17 no.1
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• pp.110-119
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• 2017

This paper describes a CMOS image sensor (CIS) with dual correlated double sampling (CDS) and column-parallel analog-to-digital converter (ADC) and its measurement method using a field-programmable gate array (FPGA) integrated module. The CIS is composed of a $320{\times}240$ pixel array with $3.2{\mu}m{\times}3.2{\mu}m$ pixels and column-parallel 10-bit single-slope ADCs. It is fabricated in a $0.11-{\mu}m$ CIS process, and consumes 49.2 mW from 1.5 V and 3.3 V power supplies while operating at 6.25 MHz. The measured dynamic range is 53.72 dB, and the total and column fixed pattern noise in a dark condition are 0.10% and 0.029%. The maximum integral nonlinearity and the differential nonlinearity of the ADC are +1.15 / -1.74 LSB and +0.63 / -0.56 LSB, respectively.

• Physical Therapy Rehabilitation Science
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• v.11 no.2
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• pp.215-223
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• 2022

Objective: This study was to resolve the limitations of the experimental environment and to solve the shortcomings of the method of measuring human gait characteristics using optical measuring instruments. Design: A cross-sectional study. Methods: Fifteen healthy adults without a history of orthopedic surgery on the lower extremities for the past 6 months were participated. They were analyzed gait variables using the smart guide and the 3D image analysis at the same time, and their results were compared. Visual-3D was used to calculate the analysis variables. Results: The reliability and validity of the data according to the two measuring instruments were found to be very high; gait speed(0.85), cycle time(0.99), stride time of both feet(0.98, 0.97) stride legnth of both feet(0.86, 0.88) stride per minute of both feet(0.99, 0.96), foot speed of both feet(0.90, 0.91), step time of both feet(0.77, 0.71), step per minute(0.72, 0.74), stance time of both feet(0.96, 0.97), swing time of both feet(0.93, 0.79), double step time(0.81), initial double step time(0.84) and terminal step time(0.76). Conclusions: In the case of the smart insole, which measures human gait variables using the pressure sensor and inertial sensor inserted in the insole, the reliability and validity of the measured data were found to be very high. It can be used as a device to replace 3D image analysis when measuring pathological gait.

• The Transactions of the Korean Institute of Electrical Engineers D
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• v.54 no.10
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• pp.595-603
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• 2005

This Paper proposes the tire mold number identification method which reads the letters on a tire surface with 3D. It is very difficult to separate the letters from the background of an image since the letters on a tire surface is an embossed data. There was many studies to read the letters on a tire surface for the factory automation, however, it was very difficult to separate the letters from the background of an image since the letters on a tire surface is embossed black characters on the black ground. In this study, we first developed the method to find the location of tire mold number, which is used to classify the tire size, from the embossed letters on a tire surface using 3-dimensional laser profile camera which is not affected by the lighting condition, then developed the method to separate the mold number from that location. As a result, we were able to contribute to automate the tire size classification which has been manually performed by operators previously.

• Journal of the Korean Association of Geographic Information Studies
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• v.3 no.4
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• pp.1-10
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• 2000

Satellite remote sensing images have much more information compared to a paper map. But these images are generally handled as particular image format gained from optical sensor, and must be processed and analyzed by computer with high priced digital image processing system. For the extraction of digital elevation model(DEM) from satellite image, we used the overlay image by SPOT-3 of Chuncheon area at the Kangwon province. According to the image condition, the precious geometric correction, the bundle adjustment for ortho-image generation and the stereo image mapping by several technical approaches were processed. So that we developed the methods of automatic DEM extraction and efficient stereo image map generation which can improve the digital image processing steps. Also, we applied the multiple direction birdeye view image for modeling and analysis using the remotely sensed overlay images with high resolution.

• 제어로봇시스템학회:학술대회논문집
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• 2005.06a
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• pp.729-734
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• 2005

One of the important research issues in mobile robot is how to detect the 3D environment fast and accurately, and recognize it. Sensing methods of utilizing laser structured light and/or stereo vision are representatively used among a number of methodologies developed to date. However, the methods are still in need of achieving high accuracy and reliability to be used for real world environments. In this paper to implement a new robotic environmental sensing algorithm is presented by combining the information between intensity image and that of laser structured light image. To see how effectively the algorithm applied to real environments, we developed a sensor system that can be mounted on a mobile robot and tested performance for a series of environments.

• Korean Journal of Remote Sensing
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• v.34 no.6_1
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• pp.941-951
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• 2018

Utilization and demand of UAV (unmanned aerial vehicle) for the generation of 3D city model are increasing. In this study, we performed an experiment to adjustment position/orientation of UAV with incomplete attitude information and to extract point cloud data. In order to correct the attitude of the UAV, the rotation angle was calculated by using the continuous position information of UAV movements. Based on this, the corrected position/orientation information was obtained by applying IBA (Incremental Bundle Adjustment) based on photogrammetry. Each pair was transformed into an epipolar image, and the MDR (Multi-Dimensional Relaxation) technique was applied to obtain high precision DSM. Each extracted pair is aggregated and output in the form of a single point cloud or DSM. Using the DJI inspire1 and Phantom4 images, we can confirm that the point cloud can be extracted which expresses the railing of the building clearly. In the future, research will be conducted on improving the matching performance and establishing sensor models of oblique images. After that, we will continue the image processing technology for the generation of the 3D city model through the study of the extraction of 3D cloud It should be developed.

• Journal of the Institute of Electronics Engineers of Korea SC
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• v.45 no.2
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• pp.1-7
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• 2008

In this paper, we have designed a millimeter-wave passive imaging sensor that is able to use remote sensing and security applications. The brightness temperature distribution of a scene is measured with a antenna at an angular resolution of $3^{\circ}$. The sensor is controlled by a PC, achieving a fast performance by using a pan/tilter. The pan/tilter should be able to scan a 2-D image of the scene, with a linear raster scan pattern. The mechanical scans in azimuth and elevation whereby an image of $20{\times}20$ pixels is acquired within less than 400s. Raw images are immediately displayed and stored for postprocessing.

• JSTS:Journal of Semiconductor Technology and Science
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• v.11 no.2
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• pp.104-110
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• 2011

A CMOS Image Sensor (CIS) mounted on mobile appliances requires low power consumption due to limitations of the battery life cycle. In order to reduce the power consumption of CIS, we propose novel power reduction techniques such as a data flip-flop circuit with leakage current elimination and a low power single slope analog-to-digital (A/D) converter with a sleep-mode comparator. Based on 0.13 ${\mu}m$ CMOS process, the chip satisfies QVGA resolution (320 ${\times}$ 240 pixels) that the cell pitch is 2.25 um and the structure is a 4-Tr active pixel sensor. From the experimental results, the performance of the CIS has a 10-b resolution, the operating speed of the CIS is 16 frame/s, and the power dissipation is 25 mW at a 3.3 V(analog)/1.8 V(digital) power supply. When we compare the proposed CIS with conventional ones, the power consumption was reduced by approximately 22% in the sleep mode, and 20% in the active mode.