• Conservation Science in Museum
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• v.31
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• pp.39-54
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• 2024

We wanted to check The feasibility of substituting the manual ceramic packaging technology with 3D digital technology using cotton pad packaging material was examined. To examine the shock absorption, vibration resistance and compression resistance of 3D packaging material printed out by using TPU material, composite vibration, and packaging compression and drop tests were conducted. As the results of the tests, the 3D packaging material displayed vibration resistance that has been improved by approximately 10~20% based on the damping ratio of the composite vibration test, compression resistance performances that are more than 5 times higher, and shock absorption performance was also improved as the packaged object was not broken in the six-sided drop test. Based on these results, it is determined that it would be possible to secure the reusability of the ceramic packaging materials and simplify packaging techniques, and to present diversity in the packaging materials and packaging technologies.

• KSII Transactions on Internet and Information Systems (TIIS)
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• v.16 no.3
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• pp.894-907
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• 2022

The features extracted by convolutional neural networks are more descriptive of images than traditional features, and their convolutional layers are more suitable for retrieving images than are fully connected layers. The convolutional layer features will consume considerable time and memory if used directly to match an image. Therefore, this paper proposes a feature weighting and region integration method for convolutional layer features to form global feature vectors and subsequently use them for image matching. First, the 3D feature of the last convolutional layer is extracted, and the convolutional feature is subsequently weighted again to highlight the edge information and position information of the image. Next, we integrate several regional eigenvectors that are processed by sliding windows into a global eigenvector. Finally, the initial ranking of the retrieval is obtained by measuring the similarity of the query image and the test image using the cosine distance, and the final mean Average Precision (mAP) is obtained by using the extended query method for rearrangement. We conduct experiments using the Oxford5k and Paris6k datasets and their extended datasets, Paris106k and Oxford105k. These experimental results indicate that the global feature extracted by the new method can better describe an image.

• Electronics and Telecommunications Trends
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• v.39 no.3
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• pp.98-106
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• 2024

Advanced packaging is emerging as a core technology owing to the increasing demand for multifunctional and highly integrated semiconductors to achieve low power and high performance following digital transformation. It may allow to overcome current limitations of semiconductor process miniaturization and enables single packaging of individual devices. The introduction of advanced packaging facilitates the integration of various chips into one device, and it is emerging as a competitive edge in the industry with high added value, possibly replacing traditional packaging that focuses on electrical connections and the protection of semiconductor devices.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.3
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• pp.31-36
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• 2000

We developed embedded inductors in MCM-D substrate for RF applications. The increasing demand for high density packaging was the driving forces to the development of MCM-D technology. Most of these development efforts have been focused on high performance digital circuits. However, recently there is a great need fur mixed mode circuits with a combination of digital, analog and microwave devices. Mixed mode modules often have a large number of passive components that are connected to a small number of active devices. Integration of passive components into the high density MCM substrate becomes desirable to further reduce cost, size, and weight of electronic systems while improving their performance and reliability. The proposed MCM-D substrate was based on Cu/photosensitive BCB multilayer and Ti/Cu is used to form the interconnect layer. Seed metal was formed with 1000 $\AA$ Ti/3000 $\AA$ Cu by sputtering method and main metal was formed with 3 $\mu\textrm{m}$ Cu by electrical plating method. The multi-turn sprial inductors were designed in coplanar fashion. This paper describe the manufacturing process of integrated inductors in MCM-D substrate and the results of electrical performance test.

• Journal of Korea Multimedia Society
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• v.25 no.8
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• pp.1085-1096
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• 2022

The manufacturing industry is continuously pursuing advanced technology and smartization as it converges with innovative technology. Improvement of manufacturing productivity is achieved by monitoring, analyzing, and controlling the facilities and processes of the manufacturing site in real time through a network. In this paper, we proposed a new OPC-UA based digital twin model for smart factory facilities. A testbed system for USB flash drive packaging facility was implemented based on the proposed digital twin model and OPC-UA data communication scheme. Through OPC-UA based digital twin model, equipment and process status information is transmitted and received from PLC to monitoring and control 3D digital models and physical models in real time. The usefulness of the developed digital twin testbed system was evaluated through usability test.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.3
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• pp.89-93
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• 2020

Complex warpage behavior of the electronic packages causes internal stress so many kinds of mechanical failure occur such as delamination or crack. Efforts to predict the warpage behavior accurately in order to prevent the decrease in yield have been approached from various aspects. For warpage prediction, silicon is generally treated as a homogeneous material, therefore it is described as showing no warpage behavior due to thermal loading. However, it was reported that warpage is actually caused by residual stress accumulated during grinding and polishing in order to make silicon wafer thinner, which make silicon wafer inhomogeneous through thickness direction. In this paper, warpage behavior of the single-side polished wafer at solder reflow temperature, the highest temperature in packaging processes, was measured using 3D digital image correlation (DIC) method. Mechanism was verified by measuring coefficient of thermal expansion (CTE) of both mirror-polished surface and rough surface.

• Transactions of the Korean Society of Automotive Engineers
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• v.18 no.5
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• pp.9-19
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• 2010

Every car manufacturer desires to reduce the new car development time spent in improving the safety, NVH, lightweight, reliability and environment friendly features of the car. Other considerations such as planning, exterior and interior styling, packaging, color, and material selection increase the complexity of the car design process. This paper proposes a personal DDP (Digital Design Process) to utilize the engineering analysis and design/styling software for car design. DDP can be efficiently used by a team of car research center or a studio with small number of engineers, helping ordinary engineers becoming ambidextrous in design as well as engineering applications. The concept model starts from idea sketch, rendering, and 3D surface model with CAS (Computer Aided Styling) to the final safety estimation by using proposed DDP based on engineering technology (CAD, CAE). The concept model proposed a hydrogen fuel cell sports coupe which could be available within next 10 years. The proposed DDP can not only reduce the new car development time but also be adapted into designing of varied products such as aircraft, yacht, electrical equipment and sports gear.

• The Journal of Korea Institute of Information, Electronics, and Communication Technology
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• v.16 no.5
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• pp.230-238
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• 2023

Small and medium-sized food manufacturing enterprises are largely reliant on manual labor, from inputting raw materials to palletizing the final product. Recently, there has been a trend toward smartness and digitization through the implementation of robotics and sensor data technology. In this study, we examined the effectiveness of improvement through 3D simulation on two repetitive work processes within a food manufacturing company. These processes involve workers whose speed cannot match the capacity of the applied equipment. Two manual processes were selected: the weighing and packing process performed by workers after skewer assembly, and the manual batch process of counting randomly delivered frozen foods, packing (both internal and external), and palletizing. The production volume, utilization rate, and number of workers were chosen as verification indicators. As a result of the simulation for improving the 3D process, production increased by 13.5% and 56.8% compared to the existing process, respectively. This was particularly evident in the process of applying palletizing robots. In both processes, as the utilization rate and number of input workers decreased, robots could replace tasks with high worker fatigue, thereby reducing work overload. This study demonstrates the potential to visually compare the process flow improvement using 3D simulations and confirms the possibility of pre-validation for improvement.

• KIEE International Transactions on Electrophysics and Applications
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• v.5C no.4
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• pp.176-179
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• 2005

The increasing demand for high density packaging technologies and the evolution to mixed digital and analogue devices has been the con-set of increasing research in thin film multi-layer technologies such as the passive components integration technology. In this paper, Cu and TaO thin film with RF sputtering was deposited for spiral inductor and MOM capacitor on the $SiO_2$/Si(100) substrate. MOM capacitor and spiral inductor were fabricated for L-C band pass filter by sputtering and lift-off. We are analyzed and designed thin films L-C passive components for band pass filter at 900 MHz and 1.8 GHz, important devices for mobile communication system. Based on the high-Q values of passive components, MOM capacitor and spiral inductors for L-C band pass filter, a low insertion loss of L-C passive components can be realized with a minimized chip area. The insertion loss was 3 dB for a 1.8 GHz filter, and 5 dB for a 900 MHz filter. This paper also discusses a analysis and practical design to thin-film L-C band pass filter.

• Proceedings of the Korea Contents Association Conference
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• 2006.11a
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• pp.218-222
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• 2006

In making 3D animation with digital technology, it is necessary to increase productivity and reusability by managing production pipeline systematically through standardization of animation content. For this purpose, we try to develop the animation content management system that can manage all kind of information on the production pipeline, based on SCORM of e-teaming by considering production, publication and re-editing. A scene as the unit of visual semantics is standardize into an object that contains meta-data of place, cast, weather, season, time and viewpoint about the scene. The meta-data of content includes a lot of information of copyright, publication, description, etc, so that it plays an important role on the management and the publication. If an effective management system of meta-data such as ontology will be implemented, it is possible to search multimedia contents powerfully. Hence, it will bring on production and publication of UCC. Using the meta-data of content object, user and producer can easily search and reuse the contents. Hence, they can choose the contents object according to their preference and reproduce their own creative animation by reorganizing and packaging the selected objects.