• 제목/요약/키워드: 3D applications

검색결과 2,717건 처리시간 0.028초

Accelerating the Sweep3D for a Graphic Processor Unit

  • Gong, Chunye;Liu, Jie;Chen, Haitao;Xie, Jing;Gong, Zhenghu
    • Journal of Information Processing Systems
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    • 제7권1호
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    • pp.63-74
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    • 2011
  • As a powerful and flexible processor, the Graphic Processing Unit (GPU) can offer a great faculty in solving many high-performance computing applications. Sweep3D, which simulates a single group time-independent discrete ordinates (Sn) neutron transport deterministically on 3D Cartesian geometry space, represents the key part of a real ASCI application. The wavefront process for parallel computation in Sweep3D limits the concurrent threads on the GPU. In this paper, we present multi-dimensional optimization methods for Sweep3D, which can be efficiently implemented on the finegrained parallel architecture of the GPU. Our results show that the overall performance of Sweep3D on the CPU-GPU hybrid platform can be improved up to 4.38 times as compared to the CPU-based implementation.

PCS 대역 송신용 CMOS RF/IF 단일 칩 설계 (Design of a CMOS Tx RF/IF Single Chip for PCS Band Applications)

  • 문요섭;권덕기;금거성;박종태;유종근
    • 전기전자학회논문지
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    • 제7권2호
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    • pp.236-244
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    • 2003
  • 본 논문에서는 기존에 값비싼 BiCMOS 공정으로 주로 구현되던 이동통신 단말기용 RF단 및 IF단 회로들을 CMOS 회로로 설계하고, 최종적으로 PCS 대역 송신용 CMOS RF/IF 단일 칩을 설계하였다. 설계된 회로는 IF PLL 주파수합성기, IF Mixer, VGA등을 포함하는 IF 단과, SSB RF Mixer 블록과 구동 증폭기를 포함하는 RF 단으로 구성되며, 디지털 베이스밴드와 전력증폭기 사이에 필요한 모든 신호처리를 수행한다. 설계된 IF PLL 주파수합성기는 100kHz의 옵셋 주파수에서 -114dBc/Hz의 위상잡음 특성을 보이며, lock time은 $300{\mu}s$보다 작고, 3V 전원에서 약 5.3mA의 전류를 소모한다. IF Mixer 블록은 3.6dB의 변환이득과 -11.3dBm의 OIP3 특성을 보이며, 3V 전원에서 약 5.3mA의 전류를 소모한다. VGA는 모든 이득 설정시 3dB 주파수가 250MHz 보다 크며, 약 10mA의 전류를 소모한다. 설계된 RF단 회로는 14.93dB의 이득, 6.97dBm의 OIP3, 35dBc의 image 억압, 31dBc의 carrier 억압 등의 특성을 보이며, 약 63.4mA의 전류를 소모한다. 설계된 회로는 현재 $0.35{\mu}m$ CMOS 공정으로 IC 제작 중에 있다. 전체 칩의 면적은 $1.6㎜{\times}3.5㎜$이고 전류소모는 84mA이다.

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Implications of 3-Dimensional Printed Spinal Implants on the Outcomes in Spine Surgery

  • Fiani, Brian;Newhouse, Alexander;Cathel, Alessandra;Sarhadi, Kasra;Soula, Marisol
    • Journal of Korean Neurosurgical Society
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    • 제64권4호
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    • pp.495-504
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    • 2021
  • Three-dimensional printing (3DP) applications possess substantial versatility within surgical applications, such as complex reconstructive surgeries and for the use of surgical resection guides. The capability of constructing an implant from a series of radiographic images to provide personalized anatomical fit is what makes 3D printed implants most appealing to surgeons. Our objective is to describe the process of integration of 3DP implants into the operating room for spinal surgery, summarize the outcomes of using 3DP implants in spinal surgery, and discuss the limitations and safety concerns during pre-operative consideration. 3DP allows for customized, light weight, and geometrically complex functional implants in spinal surgery in cases of decompression, tumor, and fusion. However, there are limitations such as the cost of the technology which is prohibitive to many hospitals. The novelty of this approach implies that the quantity of longitudinal studies is limited and our understanding of how the human body responds long term to these implants is still unclear. Although it has given surgeons the ability to improve outcomes, surgical strategies, and patient recovery, there is a need for prospective studies to follow the safety and efficacy of the usage of 3D printed implants in spine surgery.

의료 서비스를 위한 3D 프린팅 기술 적용 사례 (3D Printing Application Cases for Medical Service)

  • 우성희;곽지연;홍성원
    • 한국정보통신학회:학술대회논문집
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    • 한국정보통신학회 2015년도 추계학술대회
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    • pp.988-991
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    • 2015
  • 3D 프린터란 3차원으로 특정 물건을 찍어내는 프린터로, 입체적으로 만들어진 설계도만 있으면 종이에 인쇄하듯 3차원 공간 안에 실제 사물을 만들어 낼 수 있는 기기다. 최근 3D 프린팅 기술은 의학 분야에서 다양하게 활용되고 있으며, 생체 의학적 응용은 지금까지 가장 중요한 연구 주제 중 하나로 주목 받아왔다. 3D 프린팅 기술은 의료 뿐 아니라 자동차, 항공, 선반 등 제조업 전반에 혁신적인 변화를 일으키고 있다. 현재 3D 프린터의 의료산업 적용 분야는 가상 시뮬레이션, 맞춤형의료보형물 제작, 의료 인력 교육 실습 등이다. 따라서 본 연구에서는 의료서비스를 위한 3D 프린팅 기술과 적용사례를 비교 분석하였다.

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X-대역 응용을 위한 GaN 기반 저잡음 증폭기 MMIC (GaN-based Low Noise Amplifier MMIC for X-band Applications)

  • 임병옥;고주석;김성찬
    • 전기전자학회논문지
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    • 제28권1호
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    • pp.33-37
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    • 2024
  • 본 논문에서는 0.25 ㎛ 게이트 길이를 갖는 GaN HEMT 기술을 사용하여 개발한 X-대역 저잡음 증폭기 MMIC의 특성을 기술한다. 개발된 GaN 기반 X-대역 저잡음 증폭기 MMIC는 9 GHz ~ 10 GHz의 동작 주파수 대역에서 22.75 dB ~ 25.14 dB의 소신호 이득과 1.84 dB ~ 1.94 dB의 잡음지수 특성을 나타내었다. 입력 반사 손실 특성과 출력 반사 손실 특성은 각각 -11.36 dB ~ -24.49 dB, -11.11 dB ~ -17.68 dB를 얻었으며 40 dBm (10 W)의 입력 전력에 성능 열화 없이 정상적으로 동작하였다. MMIC의 크기는 3.67 mm × 1.15 mm이다. 개발된 GaN 기반 저잡음 증폭기 MMIC는 X-대역의 다양한 응용에 적용 가능하다.

The Development of 42' 2D/3D Switchable Display

  • Kang, Hoon;Jang, Mi-Kyoung;Kim, Kyeong-Jin;Ahn, Byung-Chul;Chung, In-Jae;Park, Tae-Soo;Chang, Jin-Wook;Lee, Kyoung-Il;Kim, Sung-Tae
    • Journal of Information Display
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    • 제8권1호
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    • pp.22-25
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    • 2007
  • Stereoscopic/autostereoscopic systems have been developed to express 3D images, but have not been successfully use in practise. In order to apply 3D display to promising applications such as advertisements and games, we developed a 42" 2D/3D switchable display. It has characteristics that do not require special glasses for 3D images, uses multi-view technology for improving 3D viewing characteristics, and has a 2D/3D switching function to express dynamic 3D contents as well as conventional 2D contents.

Analysis and Design of a DC-Side Symmetrical Class-D ZCS Rectifier for the PFC of Lighting Applications

  • Ekkaravarodome, Chainarin;Thounthong, Phatiphat;Jirasereeamornkul, Kamon;Higuchi, Kohji
    • Journal of Power Electronics
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    • 제15권3호
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    • pp.621-633
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    • 2015
  • This paper proposes the analysis and design of a DC-side symmetrical zero-current-switching (ZCS) Class-D current-source driven resonant rectifier to improve the low power-factor and high line current harmonic distortion of lighting applications. An analysis of the junction capacitance effect of Class-D ZCS rectifier diodes, which has a significant impact on line current harmonic distortion, is discussed in this paper. The design procedure is based on the principle of the symmetrical Class-D ZCS rectifier, which ensures more accurate results and provides a more systematic and feasible analysis methodology. Improvement in the power quality is achieved by using the output characteristics of the DC-side Class-D ZCS rectifier, which is inserted between the front-end bridge-rectifier and the bulk-filter capacitor. By using this symmetrical topology, the conduction angle of the bridge-rectifier diode current is increased and the low line harmonic distortion and power-factor near unity were naturally achieved. The peak and ripple values of the line current are also reduced, which allows for a reduced filter-inductor volume of the electromagnetic interference (EMI) filter. In addition, low-cost standard-recovery diodes can be employed as a bridge-rectifier. The validity of the theoretical analysis is confirmed by simulation and experimental results.

Effects of cross-linking methods for polyethylene-based carbon fibers: review

  • Kim, Kwan-Woo;Lee, Hye-Min;An, Jeong-Hun;Kim, Byoung-Suhk;Min, Byung-Gak;Kang, Shin-Jae;An, Kay-Hyeok;Kim, Byung-Joo
    • Carbon letters
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    • 제16권3호
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    • pp.147-170
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    • 2015
  • In recent decades, there has been an increasing interest in the use of carbon fiber reinforced plastic (CFRP) in aerospace, renewable energy and other industries, due to its low weight and relatively good mechanical properties compared with traditional metals. However, due to the high cost of petroleum-based precursors and their associated processing costs, CF remains a specialty product and as such has been limited to use in high-end aerospace, sporting goods, automotive, and specialist industrial applications. The high cost of CF is a problem in various applications and the use of CFRP has been impeded by the high cost of CF in various applications. This paper presents an overview of research related to the fabrication of low cost CF using polyethylene (PE) control technology, and identifies areas requiring additional research and development. It critically reviews the results of cross-linked PE control technology studies, and the development of promising control technologies, including acid, peroxide, radiation and silane cross-linking methods.

특징기반 주의 모듈을 사용하는 CMOS 디지털 이미지 센서 (A CMOS Digital Image Sensor with a Feature-Driven Attention Module)

  • 박민철;최경주
    • 정보처리학회논문지B
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    • 제15B권3호
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    • pp.189-196
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    • 2008
  • 본 논문에서는 A/D 변환기, 모션 예측 회로와 ROI(Region of Interest) 탐지를 위한 주의 모듈로 구성된 CMOS 디지털 이미지 센서를 소개한다. 현재 논문에서 제시하고 있는 이미지 센서의 A/D 변환기와 모션 예측 기능은 하드웨어인 $0.6{\mu}m$의 CMOS 프로세싱 회로(processing circuit)로 구현되어 있으며, ROI 탐지는 주의 모듈로서 소프트웨어로 구현되어 있다. 현재의 이미지 센서는 명암도의 변화에 반응하며, 모션을 예측하기 위해 시간정보를 사용하기 때문에 이미지 센서의 응용분야는 한정되어 있다. 센서라는 본래의 특징을 가지게 하면서 이의 응용분야를 확장하기 위하여 정지영상 및 동영상을 위한 특징기반 주의 모듈을 사용하여 이미지 센서에 인지기능을 부여하고자 한다. 이러한 접근법을 통해 이미지 센서는 모션이 예측되지 않다거나 명암도 변화가 감지되지 않을 경우에도 부가적인 기능을 할 수 있다. 실험결과를 통해 현재 구현된 이미지 센서의 효율성 및 다양한 분야로의 확장가능성을 확인할 수 있었다.

Framework for Reconstructing 2D Data Imported from Mobile Devices into 3D Models

  • Shin, WooSung;Min, JaeEun;Han, WooRi;Kim, YoungSeop
    • 반도체디스플레이기술학회지
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    • 제20권4호
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    • pp.6-9
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    • 2021
  • The 3D industry is drawing attention for its applications in various markets, including architecture, media, VR/AR, metaverse, imperial broadcast, and etc.. The current feature of the architecture we are introducing is to make 3D models more easily created and modified than conventional ones. Existing methods for generating 3D models mainly obtain values using specialized equipment such as RGB-D cameras and Lidar cameras, through which 3D models are constructed and used. This requires the purchase of equipment and allows the generated 3D model to be verified by the computer. However, our framework allows users to collect data in an easier and cheaper manner using cell phone cameras instead of specialized equipment, and uses 2D data to proceed with 3D modeling on the server and output it to cell phone application screens. This gives users a more accessible environment. In addition, in the 3D modeling process, object classification is attempted through deep learning without user intervention, and mesh and texture suitable for the object can be applied to obtain a lively 3D model. It also allows users to modify mesh and texture through requests, allowing them to obtain sophisticated 3D models.