• Journal of the Microelectronics and Packaging Society
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• v.31 no.3
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• pp.62-66
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• 2024

A statistical approach to inspection of the 3-D shape of micro solder balls is proposed, where an optical method with spatially arranged LED and specular reflection is used. The reflected image captured by a vision system was analyzed to calculate the relative displacements of LED's in the image. Also, the statistics of displacements for the micro solder balls contained in a captured image are used to detect existing defects, and the usefulness of the proposed method is shown via experiments.

• Journal of Institute of Control, Robotics and Systems
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• v.22 no.1
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• pp.59-65
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• 2016

As modern electronic devices get smaller and smaller, high-resolution, large Field-Of-View (FOV), fast, and cost-effective 3-dimensional (3-D) measurement is requested more and more. In particular, defect inspection machines using machine-vision technology nowadays require 3-D inspection as well as the conventional 2-D inspection. Phase Measuring Profilometry (PMP) is one of the fast non-contact 3-D shape measuring methods currently being extensively investigated in the electronic component manufacturing industry. The PMP system is well known and is successfully applied to measuring complex surface profiles with varying reflectance properties. However, for highly reflective surfaces, such as Ball Grid Arrays (BGAs), it has difficulty accurately measuring 3-D shapes. In this paper, we propose a new fast optical system that can eliminate the highly reflective saturated regions in BGA ball images. This is achieved by utilizing four Low Intensity Grating (LIG) images together with the conventional High Intensity Grating (HIG) images. Extensive experiments using BGA samples show a repeatability of under ${\pm}20um$ in standard deviation, which is suitable for most 3-D shape measurements of BGAs.

• Journal of Computational Design and Engineering
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• v.1 no.3
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• pp.194-201
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• 2014

Optimization of design is an important step in obtaining tissue engineering scaffolds with appropriate shapes and inner micro-structures. Different shapes and sizes of scaffolds are modeled using UGS NX 6.0 software with variable pore sizes. The quality issue we are concerned is the scaffold porosity, which is mainly caused by the fabrication inaccuracies. Bone scaffolds are usually characterized using a scanning electron microscope, but this study presents a new automated inspection and classification technique. Due to many numbers and size variations for the pores, the manual inspection of the fabricated scaffolds tends to be error-prone and costly. Manual inspection also raises the chance of contamination. Thus, non-contact, precise inspection is preferred. In this study, the critical dimensions are automatically measured by the vision camera. The measured data are analyzed to classify the quality characteristics. The automated inspection and classification techniques developed in this study are expected to improve the quality of the fabricated scaffolds and reduce the overall cost of manufacturing.

• Current Optics and Photonics
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• v.6 no.2
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• pp.161-170
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• 2022

Three-dimensional (3D) geometric models are introduced to correct vignetting, and a downhill simplex search is applied to determine the coefficients of a 3D model used in digital microscopy. Vignetting is nonuniform illuminance with a geometric regularity on a two-dimensional (2D) image plane, which allows the illuminance distribution to be estimated using 3D models. The 3D models are defined using generalized polynomials and arbitrary coefficients. Because the 3D models are nonlinear, their coefficients are determined using a simplex search. The cost function of the simplex search is defined to minimize the error between the 3D model and the reference image of a standard white board. The conventional and proposed methods for correcting the vignetting are used in experiments on four inspection systems based on machine vision and microscopy. The methods are investigated using various performance indices, including the coefficient of determination, the mean absolute error, and the uniformity after correction. The proposed method is intuitive and shows performance similar to the conventional approach, using a smaller number of coefficients.

• Journal of Institute of Control, Robotics and Systems
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• v.3 no.4
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• pp.406-414
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• 1997

A real-time inspection system is developed using line scan cameras. Several improved algorithms are proposed for real-time detection of defects in this automated inspection system. The major improved algorithms include the preprocessing, the threshold decision, and the clustering algorithms. The preprocessing algorithms are for exact binarization and the threshold decision algorithm is for fast detection of defects in 1-D binary images. The clustering algorithm is also developed for fast classifying of the defects. The system is applied to PCBs(Printed Circuit Boards) inspection. The typical defects in PCBs are pits, dent, wrinkle, scratch, and black spots. The results show that most defects are detected and classified successfully.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.2
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• pp.55-59
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• 2017

An optical method to inspect the 3-D shape of surface of Micro BGA is proposed, where spatially arranged LED light sources and specular reflection are considered. The reflected image captured by a vision system was analyzed to calculate the relative displacements of LED's in the image. Also, the statistics for all BGA's contained in a captured image are used together to find out the criteria for the detection of existing defects, and the usefulness of the proposed method is shown via experiments.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.17 no.1
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• pp.684-692
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• 2016

In the manufacturing process of the LQFP/TQFP (Low-profile Quad Flat Package/Thin Quad Flat Package), the requirement of a 3 dimensional inspection is increasing rapidly and a 3D inspection of the shape of a chip has become an important report of quality control. This study developed a 3 dimensional measurement system based on PMP (Phase Measuring Profilometry) for an inspection of the LQFP/TQFP chip and image processing algorithms. The defects of the LQFP/TQFP chip were classified according to the dimensions. The 2 dimensional optical system was designed by the dorm illumination to achieve constant light distribution, In the 3 dimensional optical system, PZT was used for moving 90 degree in phase. The problem of 2 ambiguity was solved from the measured moir? pattern using the ambiguity elimination algorithm that finds the point of ambiguity and refines the phase value. The proposed 3D measurement system was evaluated experimentally.

• 제어로봇시스템학회:학술대회논문집
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• 1996.10b
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• pp.605-608
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• 1996

The aim of this thesis is to develop a SMT-components placement inspection system equipped with a visual sensor. The visual sensor, which consists of a camera and 2-layer LED illuminator, developed to inspect the component placement state such as missing, shift, flipping, polarity and tomb-stone. on PCB in the reflow-process. In practical applications, however, it is too hard to classify component from images mixed pad on PCB, cream solder paste and component. To overcome the problem, this thesis proposes the 2-layer illumination method and the heuristic image processing algorithms according to inspection type. To show the effectiveness of the proposed approach, a series of experiments on the inspection were conducted. The results show that the proposed method is robust to visual noise and variations in component conditions.

• Proceedings of the Korean Geotechical Society Conference
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• 2006.03a
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• pp.931-938
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• 2006

Using high resolution stereoscopic imaging system three digital elevation model of tunnel face is acquired. The images oriented within a given tunnel coordinate system are brought into a stereoscopic vision system enabling three dimensional inspection and evaluation. The possibilities for the prediction ahead and outside of tunnel face have been improved by the digital vision system with 3D model. Interpolated image structures of rock mass between subsequent stereo images will enable to model the rock mass surrounding the opening within a short time at site. The models shall be used as input to numerical simulations on site, comparison of expected and encountered geological conditions, and for the interpretation of geotechnical monitoring results.

• 제어로봇시스템학회:학술대회논문집
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• 2003.10a
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• pp.273-277
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• 2003

A general process of electronic assembly is composed of a series of geometric alignments and bonding/screwing processes. After assembly, the function is tested in a following process of inspection. However, assembly of micro-optic devices requires both processes to be performed in equipment. Coarse geometric alignment is made by using vision and optical function is improved by the following fine motion based on feedback of tunable laser interferometer. The general system is composed of a precision robot system for 3D assembly, a 3D vision guided system for geometric alignment and an optical feedback system with a tunable laser. In this study, we propose a new fast alignment algorithm of micro-optic devices for both of visual and optical alignments. The main goal is to find a fastest alignment process and algorithms with state-of-the-art technology. We propose a new approach with an optimal sequence of processes, a visual alignment algorithm and a search algorithm for an optimal optical alignment. A system is designed to show the effectiveness and efficiency of the proposed method.