• Proceedings of the Korean Society For Composite Materials Conference
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• 2002.05a
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• pp.181-183
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• 2002

The accurate permeability for preform is critical to model and design the impregnation of fluid resin in the composite manufacturing process. In this study, the in-plane and transverse permeability for a woven fabric are predicted numerically through the coupled flow model which combines microscopic with macroscopic flow. The microscopic and macroscopic flow which are flows within the micro-unit and macro-unit cell, respectively, are calculated by using 3-D CVFEM(control volume finite element method). To avoid checker-board pressure field and improve the efficiency on numerical computation, A new interpolation function for velocity is proposed on the basis of analytic solutions. The permeability of plain woven fabric is measured through unidirectional flow experiment and compared with the permeability calculated numerically. Based on the good agreement of the results, the relationships between the permeability and the structures of preform such as the fiber volume fraction and stacking effect can be understood. The reverse and the simple stacking are taken in account. Unlike past literatures, this study is based on more realistic unit cell and the improved prediction of permeability can be achieved. It is observed that in-plane flow is more dominant than transverse flow in the real flow through preform and the stacking effect of multi-layered preform is negligible. Consequently, the proposed coupled flow model can be applied to modeling of real composite materials processing.

• Composites Research
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• v.35 no.5
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• pp.317-321
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• 2022

In this study, the PIC design method with machine learning that automatically assigning different stacking sequences according to loading types was applied bumper beam. The input value and labels of the training data for applying machine learning were defined as coordinates and loading types of reference elements that are part of the total elements, respectively. In order to compare the 2D and 3D implementation method, which are methods of representing coordinate value, training data were generated, and machine learning models were trained with each method. The 2D implementation method is divided FE model into each face and generating learning data and training machine learning models accordingly. The 3D implementation method is training one machine learning model by generating training data from the entire finite element model. The hyperparameter were tuned to optimal values through the Bayesian algorithm, and the k-NN classification method showed the highest prediction rate and AUC-ROC among the tuned models. The 3D implementation method revealed higher performance than the 2D implementation method. The loading type data predicted through the machine learning model were mapped to the finite element model and comparatively verified through FE analysis. It was found that 3D implementation PIC bumper beam was superior to 2D implementation and uni-stacking sequence composite bumper.

• Bulletin of the Korean Chemical Society
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• v.26 no.11
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• pp.1728-1734
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• 2005

The interactions of Cu(II)-meso-Tetrakis(n-N-methylpyridiniumyl)porphyrin (n = 2,3,4), respectively referred to as o-, m- and p-CuTMPyP, and DNA, poly$[d(A-T)_2]$ and poly$[d(G-C)_2]$ were investigated by circular and linear dichroism (CD and LD). In the o-CuTMPyP case, in which the rotation of the pyridinium ring is prevented, the shape of the CD spectrum when associated to DNA and poly$[d(A-T)_2]$ resembles and is characterized by a positive band at a low drug to DNA concentration ratio (R ratio) and is bisignate at a high R ratio. The former CD spectrum shape has been attributed to porphyrin that is bound monomerically outside of DNA while the latter can be attributed to those that are stacked. When o-CuTMPyP is bound to poly$[d(G-C)_2]$, the excitonic CD appeared at a relatively high R ratio. In contrast, a characteristic negative CD band in the Soret region was apparent for both m- and p-CuTMPyP when bound to DNA and poly$[d(G-C)_2]$ at the low R ratios, indicating that the porphyrin molecule intercalates. However, the DNA is bent near the intercalation site and the plane of the porphyrin molecule tilts relative to the DNA helix axis, as judged by the magnitude of the reduced LD. Various stacking patterns were identified by the shape of the CD spectrum for m- and p-CuTMPyP when bound to poly$[d(A-T)_2]$. Three species for the former complex and two for the latter complex were found which may reflect the extent of the stacking.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2004.10a
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• pp.171-174
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• 2004

In order to improve the damage tolerance of the conventional laminated composites, three­dimensional fiber structures incorporated with stitching yams have been utilized in this study. From the newly developed process termed as TAPIS(TApe Placement Incorporated with Stitching), carbon/epoxy composites have been fabricated. Two-dimensional composites with the same stacking sequence as 3D counterparts have also been fabricated for the property comparison. To examine the damage resistance performance the low speed drop weight impact test has been adopted. For the assessment of damage after the impact loading, specimens were subjected to C-scan nondestructive inspection compression after impact(CAI) were also conducted to evaluate residual compressive strength. Although the damage area of 3D composites was greatly reduced$(30-40\%)$ compared with that of 2D composites, the CAI strength did not show drastic improvement.

• ETRI Journal
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• v.33 no.6
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• pp.904-913
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• 2011

Three-dimensional (3D) memories using through-silicon vias (TSVs) as vertical buses across memory layers will likely be the first commercial application of 3D integrated circuit technology. The memory dies to stack together in a 3D memory are selected by a die-selection method. The conventional die-selection methods do not result in a high-enough yields of 3D memories because 3D memories are typically composed of known-good-dies (KGDs), which are repaired using self-contained redundancies. In 3D memory, redundancy sharing between neighboring vertical memory dies using TSVs is an effective strategy for yield enhancement. With the redundancy sharing strategy, a known-bad-die (KBD) possibly becomes a KGD after bonding. In this paper, we propose a novel die-selection method using KBDs as well as KGDs for yield enhancement in 3D memory. The proposed die-selection method uses three search-space conditions, which can reduce the search space for selecting memory dies to manufacture 3D memories. Simulation results show that the proposed die-selection method can significantly improve the yield of 3D memories in various fault distributions.

• Bulletin of the Korean Chemical Society
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• v.31 no.2
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• pp.487-490
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• 2010

• The Journal of Engineering Geology
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• v.24 no.2
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• pp.171-178
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• 2014

In seismic reflection data processing, the crossdip correction effectively focuses the stacking energy near the sharp bends of a crooked survey line. Additionally, approximate 3-D information on the reflector (e.g., true crossdip angle and lateral continuity) are locally investigated as a by-product of the crossdip correction procedure. Improvement of the signal-to-noise ratio and estimation of reflector crossdip attitude are tested, in terms of both common midpoint bin direction and processing-line type, using synthetic seismic reflection data. To effectively image the reflection energy near bends in seismic survey lines, straight-line binning is preferred to slalom-line binning.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2005.09a
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• pp.111-129
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• 2005

Pop provides OEMs and EMS with a platform to cost effectively expand options for logic + memory 3D integration - Expands device options by simplifying business logistics of stacking - Integration controlled at the system level to best match stacked combinations with system requirements - Eliminates margin stacking and expands technology reuse - Helps manage the huge cost impacts associated with increasing demand for multi media processing and memory. PoP is well timed to enable and leverage: - Mass customization of systems for different use (form, fit and function) requirements o Bband and apps processor + memory stack platforms - Logic transition to flip chip enables PoP size reduction o Area and height reduction. Industry standardization is progressing. Amkor provides full turn-key support for base package, memory package and full system integration.

• Journal of the Korean Ceramic Society
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• v.40 no.10
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• pp.931-935
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• 2003

A complex-shaped part was successfully fabricated by Laminate Object Manufacturing (LOM) technique using silicon nitride tape with aligned silicon nitride whisker seeds. The ceramic tape was cut using a commercial cutting plotter according to the cross section drafts generated by slicing a 3-D model, and then the tapes were stacked sequentially. In order to improve adhesion between the tapes, stacking was performed under vacuum. After binder burnout, the part was encapsulated using latex emulsion and was cold isostaically pressed under 250 ㎫. It was sintered to 98.5% TD at 2148 K for 4 h under 2 ㎫ nitrogen pressure.

• Structural Engineering and Mechanics
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• v.25 no.6
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• pp.753-765
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• 2007

The response histories and distribution of dynamic interlaminar stresses in composite laminated plates under free vibration and thermal load is studied based on a thermoelastodynamic differential equations. The stacking sequence of the laminated plates may be arbitrary. The temperature change is considered as a linear function of coordinates in planes of each layer. The dynamic mode of displacements is considered as triangle series. The in-plane stresses are calculated by using geometric equations and generalized Hooke's law. The interlaminar stresses are evaluated by integrating the 3-D equations of equilibrium, and utilizing given boundary conditions and continuity conditions of stresses between layers. The response histories and distribution of interlaminar stress under thermal load are presented for various vibration modes and stacking sequence. The theoretical analyses and results are of certain significance in practical engineering application.