• Title/Summary/Keyword: 3D Sensor

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The realization of 3D Display by using 2D sensor

  • Lee, Kyu-Tae;Um, Kee-Tae;Kim, Sang-Jo;Chae, Kyung-Pil
    • 한국정보디스플레이학회:학술대회논문집
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    • 2008.10a
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    • pp.765-768
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    • 2008
  • To make 3D camera system, we check the possibility of advanced range camera module based on measuring the time delay of modulated infrared light, using a single detector chip fabricated on standard CMOS process. To depth information, electronic shutter and interlaced scanning method of 2D sensor is needed. Especially, we design "lens system, illumination unit" and review simulation result.

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Structural Design and Analysis for 3D Ultrasonic Anemometer

  • Kim, Kyung-Won;Choi, Jae-Yeong;Lee, Woo-Jin;Lee, Seon-Gil
    • Journal of Sensor Science and Technology
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    • v.25 no.2
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    • pp.86-90
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    • 2016
  • A 3D ultrasonic anemometer measures the direction and velocity of wind in a 3D space. The 2D ultrasonic anemometers developed by different manufacturers do not differ significantly in terms of their form or structure. The 3D ultrasonic anemometers, on the other hand, have more diverse forms than their 2D counterparts depending on the measurement algorithms and methods. Designing and reviewing the structure at the initial stage and defining its performance objectives are time-consuming processes. The process can be made cost-effective and time-saving if the validity is tested by model design and structural interpretation, and the structure is designed to withstand high wind velocities. This study presents the results of a 3D ultrasonic anemometer on real sample data by using a 3D modeling program, CATIA, for ultrasonic anemometer modeling.

3D-Porous Structured Piezoelectric Strain Sensors Based on PVDF Nanocomposites (PVDF 나노 복합체 기반 3차원 다공성 압전 응력 센서)

  • Kim, Jeong Hyeon;Kim, Hyunseung;Jeong, Chang Kyu;Lee, Han Eol
    • Journal of Sensor Science and Technology
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    • v.31 no.5
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    • pp.307-311
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    • 2022
  • With the development of Internet of Things (IoT) technologies, numerous people worldwide connect with various electronic devices via Human-Machine Interfaces (HMIs). Considering that HMIs are a new concept of dynamic interactions, wearable electronics have been highlighted owing to their lightweight, flexibility, stretchability, and attachability. In particular, wearable strain sensors have been applied to a multitude of practical applications (e.g., fitness and healthcare) by conformally attaching such devices to the human skin. However, the stretchable elastomer in a wearable sensor has an intrinsic stretching limitation; therefore, structural advances of wearable sensors are required to develop practical applications of wearable sensors. In this study, we demonstrated a 3-dimensional (3D), porous, and piezoelectric strain sensor for sensing body movements. More specifically, the device was fabricated by mixing polydimethylsiloxane (PDMS) and polyvinylidene fluoride nanoparticles (PVDF NPs) as the matrix and piezoelectric materials of the strain sensor. The porous structure of the strain sensor was formed by a sugar cube-based 3D template. Additionally, mixing methods of PVDF piezoelectric NPs were optimized to enhance the device sensitivity. Finally, it is verified that the developed strain sensor could be directly attached onto the finger joint to sense its movements.

Compact LTCC LPF Chip for Microwave Radar Sensor Applications

  • Lee, Young Chul
    • Journal of Sensor Science and Technology
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    • v.26 no.6
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    • pp.386-390
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    • 2017
  • A $5^{th}$-order low-pass filter (LPF) chip implemented in a six-layer low-temperature co-fired ceramic (LTCC) dielectric substrate has been presented. Lumped elements constituting the LPF are designed three-dimensionally in multilayers. In order to improve the parasitic and mutual coupling effects between them, the LPF is designed by sequentially integrating the three-dimensional (3D) lumped elements, by comparing it to the results of the schematic circuit and 3D electromagnetic (EM) analysis. The designed 3D LPF chip was fabricated in a six-layer LTCC substrate as small as $4.0{\times}3.22{\times}0.68mm^3$. The measured return and insertion losses are less than -11 dB and -0.61 dB, respectively, below 1.5 GHz.

Development of Digital Surface Model and Feature Extraction by Integrating Laser Scanner and CCD sensor

  • Nagai, Masahiko;Shibasaki, Ryosuke;Zhao, Huijing;Manandhar, Dinesh
    • Proceedings of the KSRS Conference
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    • 2003.11a
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    • pp.859-861
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    • 2003
  • In order to present a space in details, it is indispensable to acquire 3D shape and texture simultaneously from the same platform. 3D shape is acquired by Laser Scanner as point cloud data, and texture is acquired by CCD sensor. Positioning data is acquired by IMU (Inertial Measurement Unit). All the sensors and equipments are assembled on a hand-trolley. In this research, a method of integrating the 3D shape and texture for automated construction of Digital Surface Model is developed. This Digital Surface Model is applied for efficient feature extraction. More detailed extraction is possible , because 3D Digital Surface Model has both 3D shape and texture information.

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A CMOS Digital Image Sensor with a Feature-Driven Attention Module (특징기반 주의 모듈을 사용하는 CMOS 디지털 이미지 센서)

  • Park, Min-Chul;Cheoi, Kyung-Joo;Hamamoto, Takayuki
    • The KIPS Transactions:PartB
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    • v.15B no.3
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    • pp.189-196
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    • 2008
  • In this paper, a CMOS digital image sensor, which consists of A/D conversion, motion estimation circuits, and an attention module for ROI (Region of Interest) detection is presented. The functions of A/D conversion and motion estimation are implemented by $0.6{\mu}m$ CMOS processing circuit as hardware, and the attention module is implemented outside the circuit as software currently. Attention modules are taken to improve limited applications of the smart image sensor. The current smart image sensor responses to the changes of intensity, and uses the integration time to estimate motion. Therefore it is limited in its applications. To make up for inherent property of the sensor from circuit design and extend its applications we decide to introduce perception solutions to the image sensor. Attention modules for still and moving images are employed to achieve such purposes. The suggested approach makes the smart image sensor available with additional functions for such cases that motion estimation or intensity changes are not observed. Experimental result shows the usefulness and extension of the image sensor.

Design of Clustering based Smart Platform for 3D Position (클러스터링 기반의 3D 위치표시용 스마트 플랫폼설계)

  • Kang, Min-Goo
    • Journal of Satellite, Information and Communications
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    • v.10 no.1
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    • pp.56-61
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    • 2015
  • In this paper, the 3D positioning of IoT sensors with the Unity engine of android platform based home-hub was proposde for IoT(Internet of Things) users. Especially, the monitoring of IoT sensor and battery status was designed with the clustering of IoT sensor's position. The 3D positioning of RSSI(received signal strength indicator) and angle for new IoT sensor according to clustering method was described with the cooperation of beacon and received arrival signal time. This unity engine based smart hub platform can monitor the working situation of IoT sensors, and apply 3D video with texture for the life-cycling of many IoT sensors simultaneously. rs was described with RSSI(received signal strength indicator) and received angle.

Development of Straightness Measurement System for Improving Manufacturing Process Precision (ODN제조 공정 정밀도 향상을 위한 진직도 측정시스템 개발)

  • Kim, Eung Soo
    • Journal of the Microelectronics and Packaging Society
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    • v.26 no.1
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    • pp.17-21
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    • 2019
  • In this paper, a high precision straightness measurement system has been developed at low cost using a visible laser and CMOS image sensor. CMOS image sensor detected optical image and the variation of straightness was calculated by image processing. We have observed that the error of the developed straightness measurement system was 0.9% when a distance of 3m between laser and image sensor. And it can be applied to 3D printer and any other areas.

3-Dimensional Sensor Array Shape Calibration in Near Field Environment (근거리 환경에서의 3차원 배열센서 형상 보정 기법)

  • Ryu, Chang-Soo;Eoh, Soo-Hae;Kang, Hyun-Koo;Rhyoo, Sang-Wook
    • Journal of the Korean Society of Industry Convergence
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    • v.6 no.4
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    • pp.361-366
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    • 2003
  • Most sensor array signal processing methods for multiple source localization require knowledge of the correct shape of array(the correct positions of sensors that consist array), because sensor position uncertainty can severely degrade the performance of array signal processing. In particular, it is assumed that the correct positions of the sensors are known, but the known positions may not represent the true sensor positions. Various algorithms have been proposed for 2-D sensor array shape calibration in far field environment. However, they are not available in near field. In this paper, 3-D sensor array shape calibration algorithm is proposed, which is available in near field.

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