• Journal of the Microelectronics and Packaging Society
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• 제4권2호
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• pp.1-16
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• 1997

Modern electronic components require its sophistication to meet the stringent requirements which are demanded for high tech industry. In an attempt to meet to such demand miniaturization of the components has been considrably progressed to increase its circuit density. High density of the components can be achieved by an innovative technology of design and manufacturing with functionally improved or new materials such as small bulk devices thick films and thin films circuits (2D). Recently many efforts have been extensively made in the community of the Hybrid Microelectronics through out world. In this paper an approach is introduced in realizing a sophisticated passive circuit for the microelectronics applications by use of hybrid thick/thin films technology. The merit of this technology is discussed and the future trend is speculated.

• Proceedings of the KIEE Conference
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• 대한전기학회 2005년도 제36회 하계학술대회 논문집 C
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• pp.2395-2397
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• 2005

A low voltage operated piezoelectric RF MEMS in-line switch has been realized by using silicon bulk micromachining technologies for advanced mobile/wireless applications. The developed RF MEMS in-line switches were comprised of four piezoelectric cantilever actuators with an Au contact metal electrode and a suspended Au signal transmission line above the silicon substrate. The measured operation dc bias voltages were ranged from 2.5 to 4 volts by varying the thickness and the length of the piezoelectric cantilever actuators, which are well agreed with the simulation results. The measured isolation and insertion loss of the switch with series configuration were -43dB and -0.21dB (including parasitic effects of the silicon substrate) at a frequency of 2GHz and an actuation voltage of 3 volts.

• Proceedings of the KIEE Conference
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• 대한전기학회 2007년도 제38회 하계학술대회
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• pp.1502-1503
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• 2007

In this paper, inductive coupled LC balun has been desi gned and simulated for embedding into an organic packaging substrate. Inductive coupling method was applied to obtain wide band characteristics, and high dielectric film was utilized to reduce a size of the balun. The proposed balun has a novel scheme which consists of three embedded LC resonators with inductive coupling. This proposed balun has relatively small inductance and capacitance values which can be easily embedded into the organic packaging substrate. Furthermore, it has a good phase imbalance characteristic. The simulated results of proposed balun are an insertion loss of 1.2 dB, a return loss of 10 dB, a phase imbalance of 1 degree at frequency bandwidth of 750 MHz ranged from 1.8 GHz to 2.55 GHz, respectively. This balun has an area of $2mm{\tims}3.5mm{\times}0.66mm$ (height).

• Journal of the Microelectronics and Packaging Society
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• 제23권3호
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• pp.37-41
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• 2016

In this paper, we introduced a near infrared fluorescence imaging system that has long working distance and analyzed on the effects of measurement variables such as gain, exposure time, working distance, magnification. Fluorescence signal intensity is growing up according to exposure time and magnification increasing, and it is getting stronger according to increase of gain, but the background signal intensity is getting stronger together. It causes low SBR. Due to a laser irradiation method, laser intensity distribution of the introduced system is not uniform and it makes fluorescence signal weak. So, we proposed a solution.

• Journal of the Microelectronics and Packaging Society
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• 제29권4호
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• pp.41-47
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• 2022

Ag sintering technologies have received great attention as it was applied to the inverter of Tesla's electric vehicle Model III. Ag sinter bonding technology has advantages in heat dissipation design as well as high-temperature stability due to the intrinsic properties of the material, so it is useful for practical use of SiC and GaN devices. This study was carried out to understand the sinter joining temperature effect on the robust Ag sintered joints in air without pressure within 10 min. Electroplated Ag finished Cu dies (3 mm × 3 mm × 2 mm) and substrates (10 mm × 10 mm × 2 mm) were introduced, respectively, and nano Ag paste was applied as a bonding material. The sinter joining process was performed without pressure in air with the bonding temperature as a variable of 175 ℃, 200 ℃, 225 ℃, and 250 ℃. As results, the bonding temperature of 175 ℃ caused 13.21 MPa of die shear strength, and when the bonding temperature was raised to 200 ℃, the bonding strength increased by 157% to 33.99 MPa. When the bonding temperature was increased to 225 ℃, the bonding strength of 46.54 MPa increased by about 37% compared to that of 200 ℃, and even at a bonding temperature of 250 ℃, the bonding strength exceeded 50 MPa. The bonding strength of Ag sinter joints was directly influenced by changes in the necking thickness and interfacial connection ratio. In addition, developments in the morphologies of the joint interface and porous structure have a significant effect on displacement. This study is systematically discussed on the relationship between processing temperatures and bonding strength of Ag sinter joints.

• Journal of the Korean Institute of Telematics and Electronics A
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• 제33A권7호
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• pp.92-98
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• 1996

parallel bonding wires separaated with a screeing bonding wire are proposed and characterized in order to redue mutual coupling and parasitics of high-speed and high-density device packaging. The mehtod of moments (MoM) with the incorporation of the ohmic loss has been used in a wide range of frequencies. From the calculated results, we have found that the screening bonding wire effectively reduces inductive and capacitive crostalk levels more than 3dB. the parasitic self inductance is also reduced more than 12% by the screening effect. Therefore, for a general VLSi package, the packaging density can be increased more than 30% using the screening bonding wire. This screeing bonding wire and the analysis can be effectively used to reduce crosstalk and increase packaging density of high density devices.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• 제29권3호
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• pp.69-81
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• 1997

Up to now 5 Voith Sulzer paper machines with multi-layer headbox and Gapfor-mer are sucessfully running on papckaging papers. Linerboard, testliner and corugating medium is produced in the basis weight range from 105 to 275 $g/m^2$ at machine speeds up to 900 m/min. The nest one, starting up in Oct. ｀96 in Germany, will be the world＇s fastest paper machine for packaging papers. The 5.6 m wide machine is designed for a maximum operating speed of 1200 m/min. Approx. 220.000 tons of corrugating medium and testliner based on 100% waste paper in the basis weight range from 90 to 160 $g/m^2$ will be produced each year. An expansion stage planned for the future is intended to increase annual output to 280.000 tons. This machine will not only be the fastest one for packaging papers, it also comprises all described innovative key components which are available today in order to fulfill growing demands of the future with regard to quality and productivity. The concept of this advanced machine is shown in Fig. 9.

• Journal of the Microelectronics and Packaging Society
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• 제18권3호
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• pp.39-43
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• 2011

Effects of cavity material on the Q-factor measurement of microwave dielectric materials were studied by HFSS simulation and the measurements using metal cavity. $TE_{01\delta}$ mode resonant frequency was determined from the electric and magnetic field patterns and the loaded Q-factor was calculated from 3dB bandwidth of $S_{21}$ spectrum. When the cavity metal materials were Cu, SUS and Au cavity, the level of Q-factor was similar. However, Q-factor was significantly decreased when the cavity metal material was CuO. The Q-factor measurements of dielectric resonator by network analyzer using various metal cavity exhibits consistent behavior.

• Journal of the Microelectronics and Packaging Society
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• 제11권3호
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• pp.71-76
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• 2004

The power consumption of TEC for Laser diode cooling was predicted by 3-D FEM simulation and verified by experiment. The operating conditions such as power consumption of Laser diode, set temperature, ambient temperature, resistance of thermal path was considered to estimate the TEC power consumption. Using 3-D FEM simulation, the relation between TEC configuration defined by the pellet dimension and the number and power consumption was investigated for low power consumption scheme. As a result, as the thermal resistance of the pellet increased, the power consumption decreased.

• Proceedings of the KIEE Conference
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• 대한전기학회 2009년도 제40회 하계학술대회
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• pp.1929_1930
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• 2009

Fully embedded tunable bandpass filter (BPF) with inductive coupling circuits is newly designed and demonstrated for UHF TV tuner ranged from 500MHz to 900MHz receivers. Conventional RF tuning circuit with an electromagnetic coupled tunable filter has several problems such as large size, high volume, and high cost, since the electromagnetic coupled filter is comprised of several passive components and air core inductors to be assembled and controlled manually. To address these obstacles, compact tunable filter with inductive coupling circuit was embedded into low cost organic package substrate. The embedded filter was optimally designed to have high performance by using high Q spiral stacked inductors, high dielectric $BaTiO_3$ composite MIM capacitors, varactor diodes. It exhibited low insertion loss of approximately -2dB, high return loss of below -10dB, and large tuning range of 56.3%. It has an extremely compact size of $3.4{\times}4.4{\times}0.5mm^3$.