• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2003년도 International Symposium
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• pp.65-89
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• 2003

Next Highly sophisticated communication generation of the Advanced Electronics and Imaging processing society will require a vast information volume and super high speed signal transport and information instruction. This means that super high technology should be created for satisfying the demand. It's also required the high reliability of the communication system itself, It will be supported the new advanced packaging technology of the 3 Dimensional structured system and system integration technology. Here is introduced the new 3 Dimensional technology for IC nnd LSI packaging and Opt-electronics Packaging of ASET activity in Japan.

• 한국전자통신학회논문지
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• 제8권6호
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• pp.923-931
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• 2013

RFID(Radio Frequency Identification)는 버스카드, 출입문 카드, 물류유통, 건축자재 관리 등 일상생활에서 다양하게 사용되는 태그의 일종으로 ID정보를 무선 주파수(RF, Radio Frequency)를 사용하여 인식하는 무선인식장치이다. RFID는 투과성과 인식률, 메모리 크기, 다중태그 인식률, 외부 오염 먼지, 외부 충격 등에 따라 크기와 성능이 달라지고, 이와 같은 요소들을 고려한 RFID 보호를 위한 패키징이 필요하다. 현재 RFID는 건축자재의 효과적인 관리를 위해서도 다양하게 사용되고 있는데, 건축자재에 RFID를 부착하기 위해서는 외부로 부터의 충격에 강건한 건축자재용 RFID 패키징 제작이 요구되고 있다. 본 논문에서는 외부 충격에 강하고, 고장 시 RFID의 교체가 가능하도록 패키징 틀과 본체를 분리하여 설계된 건축자재용 RFID 패키징을 제안한다. 제안된 RFID 패키징을 위한 상세한 설계도를 제시하였으며, 3D 프린터를 사용하여 설계된 패키징을 직접 제작하여 성능 평가를 실시하였다.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2006년도 하계종합학술대회
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• pp.169-170
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• 2006

A band pass filter for the V-band application with unique circuit and structure was designed and implemented using 2-metals, 3-BCB layers. In the mean while the effective electrical conductivity of metal layer was extracted and its value was $4{\times}10^7S/m$. The insertion loss of band pass filter at 60 GHz was 3.0 dB and group delay was below 0.1 ns.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2003년도 International Symposium
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• pp.3-17
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• 2003

.Package Trend -> Memory : Lighter, Thinner, Smaller & High Density => SiP, 3D Stack -> MPU : High Pin Counts & Multi-functional => FCBGA .Interposer Trend -> Via - Unfilled Via => Filled Via - Staggered Via => Stacked Via -> Emergence of All-layer Build-up Processes -> Interposer Material Requirement => Low CTE, Low $D_{k}$, Low $D_{f}$, Halogen-free .New Technology Concept -> Embedded Passives, Imprint, MLTS, BBUL etc.

• 한국축산식품학회지
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• 제35권2호
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• pp.248-257
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• 2015

Effects of double packaging (combinational use of aerobic and vacuum conditions) and antioxidants on physicochemical properties in irradiated restructured chicken rolls were determined. Chicken breast treated with antioxidants (none, sesamol+a-tocopherol) was used to process restructured chicken breast rolls. The sliced rolls were vacuum, aerobic, or double packaged (vacuum for 7 d then aerobic for 3 d) and electron beam irradiated at 2.5 kGy. Color, 2-thiobarbituric acid reactive substances (TBARS), oxidation reduction potentials (ORP), and volatile profiles of the samples were determined at 0 and 10 d. Irradiation made restructured chicken rolls redder (p<0.05), and the increased redness was more distinct in irradiated vacuum-packaged than irradiated aerobic or double packaged meats. TBARS values of antioxidant-treated double packaged rolls were lower than even nonirradiated vacuum-packaged meat, and those were distinct at 10 d (p<0.05). ORP and lipid oxidation values were lower in irradiated vacuum and double packaged samples than those in irradiated aerobic packaged ones at 0 d (p<0.05). Irradiation of restructured chicken rolls increased the amount of total volatiles. Considerable amounts of off-odor volatiles were reduced or not detected by double packaging and antioxidant treatment at 10 d. Therefore, the combined use of antioxidants and double packaging would be useful to reduce redness and control the oxidative quality changes of irradiated restructured chicken rolls

• 마이크로전자및패키징학회지
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• 제21권2호
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• pp.53-57
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• 2014

Thin glass (< 100 microns) is a promising material from which advanced interposers for high density electrical interconnects for 2.5D chip packaging can be produced. But thin glass is extremely brittle, so mechanical micromachining to create through glass vias (TGVs) is particularly challenging. In this article we show how laser processing using deep UV excimer lasers at a wavelength of 193 nm provides a viable solution capable of drilling dense patterns of TGVs with high hole counts. Based on mask illumination, this method supports parallel drilling of up over 1,000 through vias in 30 to $100{\mu}m$ thin glass sheets. (We also briefly discuss that ultrafast lasers are an excellent alternative for laser drilling of TGVs at lower pattern densities.) We present data showing that this process can deliver the requisite hole quality and can readily achieve future-proof TGV diameters as small $10{\mu}m$ together with a corresponding reduction in pitch size.

• 골판지포장물류
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• 제9권43호
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• pp.64-66
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• 2002

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2006년도 ISMP 2006
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• pp.47-66
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• 2006

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2005년도 ISMP
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• pp.35-49
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• 2005

• 월간포장계
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• 통권262호
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• pp.42-44
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• 2015