• Design & Manufacturing
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• 제15권4호
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• pp.65-71
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• 2021

In the early days of laser invention, it was simply used as a measuring tool, but as lasers became more common, they became an indispensable processing tool in the industry. Short-wavelength lasers are used to make patterns on wafers used in semiconductors depending on the wavelength, such as CO2 laser, YAG laser, green laser, and UV laser. At first, the hole of the PCB board mainly used for electronic parts was not thin and the hole size was large, so a mechanical drill was used. However, in order to realize product miniaturization and high integration, small hole processing lasers have become essential, and pattern exposure for small hole sizes has become essential. This paper intends to analyze the characteristics through patterns by exposing the PCB substrate through DMD and polygon scanner, which are different optical systems. Since the optical systems are different, the size of the patterns was made the same, and exposure was performed under the optimal conditions for each system. Pattern characteristics were analyzed through a 3D profiler. As a result of the analysis, there was no significant difference in line width between the two systems. However, it was confirmed that dmd had better pattern precision and polygon scanner had better productivity.

• Safety and Health at Work
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• 제11권4호
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• pp.537-542
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• 2020

Background: Personal protective equipment (PPE) has been designed in such a way to reduce accident rates. Unfortunately, existing PPE is rather ineffective as it is not able to provide warning signals when hazard is around. The integration of intelligent systems is envisaged to increase the efficiency of existing PPE. Methods: This project designed a safety vest incorporated with metal detectors which can provide immediate warning to the field workers when there is metal hazard around. This product has greater freedom of design via smart manufacturing as it involves the assembly of few commercially available parts into a single entity. Briefly, the metal detector is a do it yourself (DIY) kit, and the safety vest is purchasable from any local market. The DIY kit was connected to a copper coil and being sewed into the safety vest. Results: The metal detector induces beeping sound when there is metal hazard around. A total of 121 engineering students were introduced to the prototype before being requested to answer a survey associated with the design. Respondents have rated >3.00/5.00 for the design simplicity, ease of usage, and light weight. Meanwhile, respondents suggested that the design should be further improved by increasing the metal detection range. Conclusion: It is envisaged that the introduction of this smart safety vest will allow the workers to carry out their duties securely by reducing the accident rates. Particularly, such design is expected to reduce workplace accident especially during night time at construction sites where the visibility is low.

• 국제학술발표논문집
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• The 3th International Conference on Construction Engineering and Project Management
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• pp.276-284
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• 2009

As an on-going research project, Zero Net Energy Test Home (ZNETH) project investigates effective approaches to achieve whole-house environmental and energy goals. The main research objectives are (1) to identify energy saving solutions for designs, materials, and construction methods for the ZNETH house and (2) to verify whether ZNETH house can produce more energy than the house uses by utilizing Building Information Modeling (BIM) and energy analysis tools. The initial project analysis is conducted using building information modeling (BIM) and energy analysis tools. The BIM-driven research approach incorporates architectural and construction engineering methods for improving whole-building performance while minimizing increases in overall building cost. This paper discusses about advantages/disadvantages of using BIM integrated energy analysis, related interoperability issues between BIM software and energy analysis software, and results of energy analysis for ZNETH. Although this investigation is in its early stage, several dramatic outcomes have already been observed. Utilizing BIM for energy analysis is an obvious benefit because of the ease by which the 3D model is transferred, and the speed that an energy model can be analyzed and interpreted to improve design. The research will continue to use the ZNETH project as a testing bed for the integration of sustainable design into the BIM process.

• 전자통신동향분석
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• 제38권6호
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• pp.41-51
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• 2023

Heat dissipation technology for semiconductors and electronic packaging has a substantial impact on performance and lifespan, but efficient heat dissipation is currently facing limited improvement. Owing to the high integration density in electronic packaging, heat dissipation components must become thinner and increase their performance. Therefore, heat dissipation materials are being devised considering conductive heat transfer, carbon-based directional thermal conductivity improvements, functional heat dissipation composite materials with added fillers, and liquid-metal thermal interface materials. Additionally, in heat dissipation structure design, 3D printing-based complex heat dissipation fins, packages that expand the heat dissipation area, chip embedded structures that minimize contact thermal resistance, differential scanning calorimetry structures, and through-silicon-via technologies and their replacement technologies are being actively developed. Regarding dry cooling using single-phase and phase-change heat transfer, technologies for improving the vapor chamber performance and structural diversification are being investigated along with the miniaturization of heat pipes and high-performance capillary wicks. Meanwhile, in wet cooling with high heat flux, technologies for designing and manufacturing miniaturized flow paths, heat dissipating materials within flow paths, increasing heat dissipation area, and reducing pressure drops are being developed. We also analyze the development of direct cooling and immersion cooling technologies, which are gradually expanding to achieve near-junction cooling.

• 한국안광학회지
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• 제6권1호
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• pp.149-153
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• 2001

LiF:Mg, Cu, Na, Si TL 물질의 열자극발광을 온도대 파장대 발광강도의 3차원으로 측정하여 분석하였다. 온도대 발광강도곡선(glow curve)은 각 온도에서 파장별 발광강도데이터를 적분하여 구성하였고, 이를 분석하여 트랩에 관계되는 여러가지 파라미터들을 결정하였다. 발광곡선의 분석은 일반차 모델의 TL 강도 표현식을 기본함수로 하여 컴퓨터화된 발광곡선 분해(Computerized Glow Curve Deconvolution: CGCD)기법을 이용하였고, 그 결과 LiF:Mg, Cu, Na, Si TL 물질의 열자극발광곡선은 정점온도 333 K, 374 K 426 K, 466 K, 483 K 그리고 516 K를 갖는 6개의 개별적인 발광곡선들로 구성되어 있음을 확인하였다. 주 피크(main peak)인 456 K 발광곡선에 대하여 활성화에너지는 2.06 eV, 발광차수는 1.05로 밝혀졌다. 발광스펙트럼 분석결과 LiF:Mg, Cu, Na, Si TL 물질은 3개의 재결합준위 1.80 eV, 2.88 eV 그리고 3.27 eV를 가지는 것으로 판명되었다. 이 중 약 2.88 eV 준위가 지배적이고 다음으로 3.27eV 준위에서 발광이 일어나며 1.80 eV 준위는 극히 미약하나 분명한 존재를 확인하였다.

• 마이크로전자및패키징학회지
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• 제17권1호
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• pp.69-73
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• 2010

Through-silicon-via (TSV)를 포함하고 있는 3차원 적층 반도체 패키지에서 구조적 변수에 따른 열응력의 변화를 살펴보기 위하여 유한요소해석을 수행하였다. 이를 통하여 TSV를 포함하고 있는 3차원 적층 반도체 패키지에서 웨이퍼 간 접합부의 지름, TSV 지름, TSV 높이, pitch 변화에 따른 열응력의 변화를 예측하였다. 최대 von Mises 응력은 TSV의 가장 위 부분과 Cu 접합부, Si, underfill 계면에서 나타났다. TSV 지름이 증가할 때, TSV의 가장 위 부분에서의 von Mises 응력은 증가하였다. Cu 접합부 지름이 증가할 때, Si과 Si 사이의 Cu 접합부가 Si, underfill과 만나는 부분에서 von Mises 응력이 증가하였다. Pitch가 증가할 때에도, Si과 Si 사이의 Cu 접합부가 Si, underfill과 만나는 부분에서 von Mises 응력이 증가하였다. 한편, TSV 높이는 von Mises 응력에 크게 영향을 미치지 못하였다. 따라서 TSV 지름이 작을수록, 그리고 pitch가 작을수록 기계적 신뢰성은 향상되는 것으로 판단된다.

• 토지주택연구
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• 제6권2호
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• pp.49-60
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• 2015

북한이 2013년 5월 29일 경제개발구법을 제정하고, 같은 해 11월 21일 13개 지방급 경제개발구를 대외에 개방하였다. 이어 2014년 7월 23일 6개의 경제개발구를 추가로 개방하였는데, 이것은 북한이 1950년대 말부터 추진한 경제개발계획의 근간인 자급자족적이고 폐쇄적인 계획경제 운용노선으로부터의 커다란 전환이다. 북한은 사회주의 시장경제를 지향하는 중국과 달리 완전한 사회주의 건설을 목표로 하고 있으며, 계획경제의 안정적 관리를 위하여 자본주의 시장경제 요소를 일부 도입하여 시험하고 있다. 북한의 경제개발구를 통한 경제 활성화 추진전략은 북한 자체는 물론 인접한 한국과 중국의 정치 및 경제에 미치는 영향이 지대하다. 정부의 대북정책은 남북 간 경제적 상생관계 형성을 통해 정치적 통합을 목표로 하고 있다. 정부의 통일정책 비전은 한반도의 경제통합을 넘어 한반도를 대륙과 연결하는 유라시아 이니셔티브 실현을 통해 동북아시대에 주도권을 확보하는 것이다. 유라시아 이니셔티브 실현을 위해서는 남한과 아시아 대륙, 유럽을 잇는 연결고리인 북한의 협력이 필수적이다. 북한은 2013년 3월 31일 경제 건설과 핵무력 건설 병진노선을 채택하고 경제개발구 개발을 통한 경제 활성화 전략을 최우선 과제로 추진하고 있다. 본 논문은 남북 간 개발협력을 통한 북한지역 경제개발사업 추진을 목표로 남한 투자자의 시각에서 북한이 2013년에 개방한 13개 지방급 경제개발구를 대상으로 입지적, 경제적, 법률적 측면의 투자 잠재력을 평가하고 경제개발구에 대한 개발방향을 제시한다. 투자 잠재력 평가 결과 송림, 현동, 흥남, 청진, 와우도 경제개발구의 투자 잠재력이 높게 나왔다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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• pp.176-177
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• 2013

Surface plasmon polaritons (SPPs) have attracted the attention of scientists and engineers involved in a wide area of research, microscopy, diagnostics and sensing. SPPs are waves that propagate along the surface of a conductor, usually metals. These are essentially light waves that are trapped on the surface because of their interaction with the free electrons of conductor. In this interaction, the free electrons respond collectively by oscillating in resonance with the light wave. The resonant interaction between the surface charge oscillation and the electromagnetic field of the light constitutes the SPPs and gives rise to its unique properties. In this papers, we studied theoretical and experimental extraordinary transmittance (T) and reflectance (R) of 2 dimensional metal hole array (2D-MHA) on GaAs in consideration of the diffraction orders. The 2d-MHAs was fabricated using ultra-violet photolithography, electron-beam evaporation and standard lift-off process with pitches ranging from 1.8 to $3.2{\mu}m$ and diameter of half of pitch, and was deposited 5-nm thick layer of titanium (Ti) as an adhesion layer and 50-nm thick layer of gold (Au) on the semiinsulating GaAs substrate. We employed both the commercial software (CST Microwave Studio: Computer Simulation Technology GmbH, Darmstadt, Germany) based on a finite integration technique (FIT) and a rigorous coupled wave analysis (RCWA) to calculate transmittance and reflectance. The transmittance was measured at a normal incident, and the reflectance was measured at variable incident angle of range between $30^{\circ}{\sim}80^{\circ}$ with a Nicolet Fourier transmission infrared (FTIR) spectrometer with a KBr beam splitter and a MCT detector. For MHAs of pitch (P), the peaks ${\lambda}$ max in the normal incidence transmittance spectra can be indentified approximately from SP dispersion relation, that is frequency-dependent SP wave vector (ksp). Shown in Fig. 1 is the transmission of P=2.2 um sample at normal incidence. We attribute the observation to be a result of FTIR system may be able to collect the transmitted light with higher diffraction order than 0th order. This is confirmed by calculations: for the MHAs, diffraction efficiency in (0, 0) diffracted orders is lower than in the (${\pm}x$, ${\pm}y$) diffracted orders. To further investigate the result, we calculated the angular dependent transmission of P=2.2 um sample (Fig. 2). The incident angle varies from 30o to 70o with a 10o increment. We also found the splitting character on reflectance measurement. The splitting effect is considered a results of SPPs assisted diffraction process by oblique incidence.

• Journal of electromagnetic engineering and science
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• 제9권2호
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• pp.85-97
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• 2009

As operating frequency is raised and as more integration with active and passive elements is required, it becomes difficult to fabricate more than 120 ${\Omega}$ characteristic impedance of a mierostrip line. To solve this problem, an equivalent high impedance transmission-line section is suggested, which consists mainly of a pair of coupled-line sections with two shorts. However, it becomes a transmission-line section only when its electrical length is fixed and its coupling power is more than half. To have transmission-line characteristics(perfect matching), independently of coupling power and electrical length, two identical open stubs are added and conventional design equations of evenand odd-mode impedances are modified, based on the fact that the modified design equations have the linear combinations of conventional ones. The high impedance transmission-line section is a passive component and therefore should be perfectly matched, at least at a design center frequency. For this, two different solutions are derived for the added open stub and two types of high impedance transmission-line sections with 160 ${\Omega}$ characteristic impedance are simulated as the electrical lengths of the coupled-line sections are varied. The simulation results show that the determination of the available bandwidth location depends on which solution is chosen. As an application, branch-line hybrids with very weak coupling power are investigated, depending on where an isolated port is located, and two types of branch-line hybrids are derived for each case. To verify the derived branch-line hybrids, a microstrip branch-line hybrid with -15 dB coupling power, composed of two 90$^{\circ}$ and two 270$^{\circ}$ transmission-line sections, is fabricated on a substrate of ${\varepsilon}_r$= 3.4 and h=0.76 mm and measured. In this case, 276.7 ${\Omega}$ characteristic impedance is fabricated using the suggested high impedance transmission-line sections. The measured coupling power is -14.5 dB, isolation and matching is almost perfect at a design center frequency of 2 GHz, showing good agreement with the prediction.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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• pp.296-296
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• 2014

We investigate experimentally and theoretically the splitting of surface plasmon (SP) resonance peaks under TE- and TM-polarized illumination. The SP structure at infrared wavelength is fabricated with a 2-dimensional square periodic array of circular holes penetrating through Au (gold) film. In brief, the processing steps to fabricate the SP structure are as follows. (i) A standard optical lithography was performed to produce to a periodic array of photoresist (PR) circular cylinders. (ii) After the PR pattern, e-beam evaporation was used to deposit a 50-nm thick layer of Au. (iii) A lift-off processing with acetone to remove the PR layer, leading to final structure (pitch, $p=2.2{\mu}m$; aperture size, $d=1.1{\mu}m$) as shown in Fig. 1(a). The transmission is measured using a Nicolet Fourier-transform infrared spectroscopy (FTIR) at the incident angle from $0^{\circ}$ to $36^{\circ}$ with a step of $4^{\circ}$ both in TE and TM polarization. Measured first and second order SP resonances at interface between Au and GaAs exhibit the splitting into two branches under TM-polarized light as shown in Fig. 1(b). However, as the incidence angle under TE polarization is increased, the $1^{st}$ order SP resonance peak blue-shifts slightly while the splitting of $2^{nd}$ order SP resonance peak tends to be larger (not shown here). For the purpose of understanding our experimental results qualitatively, SP resonance peak wavelengths can be calculated from momentum matching condition (black circle depicted in Fig. 2(b)), $k_{sp}=k_{\parallel}{\pm}iG_x{\pm}jG_y$, where $k_{sp}$ is the SP wavevector, $k_{\parallel}$ is the in-plane component of incident light wavevector, i and j are SP coupling order, and G is the grating momentum wavevector. Moreover, for better understanding we performed 3D full field electromagnetic simulations of SP structure using a finite integration technique (CST Microwave Studio). Fig. 1(b) shows an excellent agreement between the experimental, calculated and CST-simulated splitting of SP resonance peaks with various incidence angles under TM-polarized illumination (TE results are not shown here). The simulated z-component electric field (Ez) distribution at incident angle, $4^{\circ}$ and $16^{\circ}$ under TM polarization and at the corresponding SP resonance wavelength is shown in Fig. 1(c). The analysis and comparison of theoretical results with experiment indicates a good agreement of the splitting behavior of the surface plasmon resonance modes at oblique incidence both in TE and TM polarization.