• 제목/요약/키워드: 3D FEM (Finite Element Method)

검색결과 412건 처리시간 0.023초

경사지반에 인접하여 설치된 무리말뚝의 거동연구 (Behaviors of Pile Croup Installed Near Inclined Ground)

  • Chae, Kwang-Seok;Ugai, Keizo;Yoon, Gil-Lim
    • 한국지반공학회논문집
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    • 제19권3호
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    • pp.53-64
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    • 2003
  • 사면을 포함한 경사지에 설치된 송전탑, 교각, 고층빌딩 등을 지지하는 말뚝은 풍하중, 지진, 차량 등에 의한 수평하중을 고려하여 설계되어야 한다. 이러한 사면이나 경사지에 설치된 수평하중을 받는 말뚝은 편평한 지반에 비하여, 수평지지력이 감소하기 때문이다. 그러므로 이러한 구조물은 일반적으로 강성이 높고, 대구경의 기초인 피어기초가 사용된다. 수평하중을 받는 피어기초는 일반적으로 장대말뚝과 다른 거동을 한다. 즉, 수평하중에 의하여 말뚝 자체의 회전이 발생하고, 그 회전의 중심점 상부의 사면측의 수동토압에 의존하여 지반파괴가 발생한다는 측면에서 짧은 강성 말뚝과 유사한 거동을 한다. 본 논문은 모래사면의 언덕 근처에 설치된 짧은 말뚝의 수평하중의 영향에 대한 실험 및 수치해석 결과를 포함한다. 대부분을 모형실험과 3차원 탄소성 유한요소해석의 비교, 결과를 기술하였다. 먼저, 사면 언덕에서 모형말뚝까지의 거리를 3종류로 구분하여 단항의 모형실험과 군항말뚝의 수평하중 특성을 파악하기 위하여 수평지반과 사면지반(경사 30$^{\circ}$)에 대하여 말뚝중심간의 거리를 각2종류로 모형실험을 실시하였다. 동시에 3차원 탄소성 유한요소법에 의한 수치해석을 통하여 모형실험의 결과와의 비교를 시도하였다. 사용된 모래지반은 배수조건하에서 삼축압축실험으로 재현하였다. 3차원 탄소성 유한요소해석에서 완전탄소성모델의 파괴기준은 Mohr-Coulomb식, 소성 포텐셜은 Drucker-Prage식을 이용한 MC-DP모델을 적용하였다. 연구결과, 3차원탄소성 유한요소법이 사질토 지반에 설치된 짧은 말뚝의 수평거동을 파악하는데 유효하다는 것을 확인하였다.

SPH 코드를 사용한 TBM 디스크커터의 암석 절삭에 대한 수치해석적 연구 (A numerical study on rock cutting by a TBM disc cutter using SPH code)

  • 정호영;전석원;조정우
    • 한국터널지하공간학회 논문집
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    • 제15권3호
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    • pp.345-356
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    • 2013
  • 본 연구에서는 SPH(Smoothed Particle Hydrodynamics) 코드를 사용하여 TBM에 장착되는 디스크커터에 의한 암석의 절삭과정을 모사하였다. 이를 위하여 본 연구에서는 3차원 FEM 해석 상용프로그램인 AUTODYN3D를 사용하였으며 이를 통해 국내 황등화강암을 대상으로 총 25개의 절삭조건에 대한 수치적인 절삭시험을 수행하였다. 암석과 디스크커터를 각각 라그란지안 솔버와 SPH 솔버를 사용하여 3차원 형상으로 모델링 하고 두 개의 디스크커터가 순차적으로 암석을 절삭하도록 모델링 하였다. 수치해석과 LCM시험에서 측정한 디스크커터의 작용력은 오차 10%이내의 값을 보여 대체로 일치하는 것으로 나타났고 균열의 전파양상과 암석의 파쇄양상 또한 유사한 것으로 나타났다. 또한 절삭된 최적 커터간격을 측정한 결과 LCM시험 결과와 일치하였다. 이를 통해 SPH코드를 사용한 수치해석기법의 적용성을 확인할 수 있었으나 해석시간을 단축하기 위한 Lagrange-SPH코드의 커플링에 관한 후속연구가 필요할 것으로 판단되었다.

수직형 Feed-through 갖는 RF-MEMS 소자의 웨이퍼 레벨 패키징 (Wafer Level Packaging of RF-MEMS Devices with Vertical Feed-through)

  • 박윤권;이덕중;박흥우;김훈;이윤희;김철주;주병권
    • 한국전기전자재료학회논문지
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    • 제15권10호
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    • pp.889-895
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    • 2002
  • Wafer level packaging is gain mote momentum as a low cost, high performance solution for RF-MEMS devices. In this work, the flip-chip method was used for the wafer level packaging of RF-MEMS devices on the quartz substrate with low losses. For analyzing the EM (electromagnetic) characteristic of proposed packaging structure, we got the 3D structure simulation using FEM (finite element method). The electric field distribution of CPW and hole feed-through at 3 GHz were concentrated on the hole and the CPW. The reflection loss of the package was totally below 23 dB and the insertion loss that presents the signal transmission characteristic is above 0.06 dB. The 4-inch Pyrex glass was used as a package substrate and it was punched with air-blast with 250${\mu}{\textrm}{m}$ diameter holes. We made the vortical feed-throughs to reduce the electric path length and parasitic parameters. The vias were filled with plating gold. The package substrate was bonded with the silicon substrate with the B-stage epoxy. The loss of the overall package structure was tested with a network analyzer and was within 0.05 dB. This structure can be used for wafer level packaging of not only the RF-MEMS devices but also the MEMS devices.

Numerical finite element study of a new perforated steel plate shear wall under cyclic loading

  • Farrokhi, Ali-Akbar;Rahimi, Sepideh;Beygi, Morteza Hosseinali;Hoseinzadeh, Mohamad
    • Earthquakes and Structures
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    • 제22권6호
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    • pp.539-548
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    • 2022
  • Steel plate shear walls (SPSWs) are one of the most important and widely used lateral load-bearing systems. The reason for this is easier execution than reinforced concrete (RC) shear walls, faster construction time, and lower final weight of the structure. However, the main drawback of SPSWs is premature buckling in low drift ratios, which affects the energy absorption capacity and global performance of the system. To address this problem, two groups of SPSWs under cyclic loading were investigated using the finite element method (FEM). In the first group, several series of circular rings have been used and in the second group, a new type of SPSW with concentric circular rings (CCRs) has been introduced. Numerous parameters include in yield stress of steel plate wall materials, steel panel thickness, and ring width were considered in nonlinear static analysis. At first, a three-dimensional (3D) numerical model was validated using three sets of laboratory SPSWs and the difference in results between numerical models and experimental specimens was less than 5% in all cases. The results of numerical models revealed that the full SPSW undergoes shear buckling at a drift ratio of 0.2% and its hysteresis behavior has a pinching in the middle part of load-drift ratio curve. Whereas, in the two categories of proposed SPSWs, the hysteresis behavior is complete and stable, and in most cases no capacity degradation of up to 6% drift ratio has been observed. Also, in most numerical models, the tangential stiffness remains almost constant in each cycle. Finally, for the innovative SPSW, a relationship was suggested to determine the shear capacity of the proposed steel wall relative to the wall slenderness coefficient.

Numerical study on the influence of embedment footing and vertical load on lateral load sharing in piled raft foundations

  • Sommart Swasdi;Tanan Chub-Uppakarn;Thanakorn Chompoorat;Worathep Sae-Long
    • Geomechanics and Engineering
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    • 제36권6호
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    • pp.545-561
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    • 2024
  • Piled raft foundation has become widely used in the recent years because it can increase bearing capacity of foundation with control settlement. The design for a piled raft in terms vertical load and lateral load need to understands contribution load behavior to raft and pile in piled raft foundation system. The load-bearing behavior of the piled raft, especially concerning lateral loads, is highly complex and challenge to analyze. The complex mechanism of piled rafts can be clarified by using three dimensional (3-D) Finite Element Method (FEM). Therefore, this paper focuses on free-standing head pile group, on-ground piled raft, and embedded raft for the piled raft foundation systems. The lateral resistant of piled raft foundation was investigated in terms of relationship between vertical load, lateral load and displacement, as well as the lateral load sharing of the raft. The results show that both vertical load and raft position significantly impact the lateral load capacity of the piled raft, especially when the vertical load increases and the raft embeds into the soil. On the same condition of vertical settlement and lateral displacement, piled raft experiences a substantial demonstrates a higher capacity for lateral load sharing compared to the on-ground raft. Ultimately, regarding design considerations, the piled raft can reliably support lateral loads while exhibiting behavior within the elastic range, in which it is safe to use.

CAD/CAE를 이용한 세선 성형용 필거밀 공정의 최적설계 (Optimum design of a pilger mill process for wire forming using CAD/CAE)

  • 정용수;박훈재;김승수;나경환;이형욱;한창수
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2003년도 추계학술대회논문집
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    • pp.84-88
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    • 2003
  • In this paper, The optimum design of a die shape has been carried out the FEM analysis of a pilger mill process considering various factors. The pilger mill forming process consists of a pair of rotating die which has appropriate surface shape. The important design parameters of the pilger mill are the feed rate and the profile of grooved die. Optimum design procedure was performed in order to investigated effects on the forming load and the deformed shape of material depending on the die radius profile. Profile of the die surface for the optimum design were suggested with the linear, the cosine and the quadratic curve considering a physical forming process. The surface of each die was modeled using the 3DAutoCAD and the analysis of pilger forming process was performed using the LS-DYNA3D. The optimum profile of the die shape for the pilger mill was determined to the quadratic profile. Since the analysis results provide that the model of the quadratic profile gives the lowest forming load and a proper deformed shape.

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등분포하중을 받는 파형강관의 좌굴거동 (Buckling Behavior of Corrugated Steel Pipe under External Uniform Pressure)

  • 안우철;한택희;임남형;강영종
    • 한국강구조학회 논문집
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    • 제15권1호
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    • pp.33-40
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    • 2003
  • 최근 몇 년 동안 파형강관의 사용이 증가하고 있다. 예전의 연구자들은 강관의 파괴모드를 찌그러짐(crushing)이나 변형(deformation)으로 간주하였다. 그러나 강관의 직경이 커지고 두께가 얇아짐에 따라 상대적으로 작은 변형에서 좌굴이 발생하게 된다. 지중 강관의 좌굴해석에서는 두 가지가 있는데, 하나는 지반을 탄성연속체로 보는 것이고, 또 하나는 강관을 탄성스프링으로 지지한다고 가정하는 Winkler 모델이다. 이 두 가지의 해석방법은 파형을 고려하지 않는 평면해석을 기본으로 하고 있다. 본 논문에서는 좌굴해석 수행시 Winkler 모델을 기본으로 하고, 파형의 효과를 고려하는 3차원해석을 수행하여 좌굴하중에 대한 식을 제안하였다.

A High Performance Solenoid-Type MEMS Inductor

  • Seonho Seok;Chul Nam;Park, Wonseo;Kukjin Chun
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제1권3호
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    • pp.182-188
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    • 2001
  • A solenoid-type MEMS inductor with a quality factor over 10 at 2 GHz has been developed using an electroplating technique. The integrated spiral inductor has a low Q factor due to substrate loss and skin effects. It also occupies a large area compared to the solenoid-type inductor. The direction of flux of the solenoid-type inductor is parallel to the substrate, which can lower the substrate loss and other interference with integrated passive components. To estimate the characteristics of the proposed inductor over a high frequency range, the 3D FEM (Finite Element Method) simulation is used by using the HFSS at the Ansoft corporation. The electroplated solenoid-type inductor is fabricated on a glass substrate step by step by using photolithography and copper electroplating. The fabrication process to improve the quality factor of the inductor is also developed. The achieved inductance varies within a range from 0.5 nH to 2.8 nH, and the maximum Q factor is over 10.

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사면보강 뿌리말뚝공법의 준3차원적 안정해석기법 (Method of Quasi-Three Dimensional Stability Analysis of the Root Pile System on Slope Reinforcement)

  • 김홍택;강인규;박사원
    • 한국지반공학회지:지반
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    • 제13권5호
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    • pp.101-124
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    • 1997
  • The root pile system is insitu soil reinforcement technique that uses a series of reticulately installed micropiles. In terms of mechanical improvement by means of grouted reinform ming elements, the root pile system is similar to the soil nailing system. The main difference between root piles and soil nailing are due to the fact that the reinforcing bars in root piles are normally grouted under high pressure and that the alignments of the reinforcing members differ. Recently, the root pile system has been broadly used to stabilize slopes and retain excavations. The accurate design of the root pile system is, however, a very difficult tass owing to geometric variety and statical indetermination, and to the difficulty in the soilfiles interaction analysis. As a result, moat of the current design methods have been heavily dependent on the experiences and approximate approach. This paper proposes a quasi-three dimensional method of analysis for the root pile system applied to the stabilization of slopes. The proposed methods of analysis include i) a technique to estimate the change in borehole radium as a function of the grout pressure as well as a function of the time when the grout pressure is applied, ii) a technique to evaluate quasi -three dimensional limit-equilibrium stability for sliding, iii) a technique to predict the stability with respect to plastic deformation of the soil between adjacent root piles, and iv) a quasi -three dimensional finite element technique to compute stresses and dis placements of the root pile structure barred on the generalized plane strain condition and composite unit cell concept talon형 with considerations of the group effect and knot effect. By using the proposed technique to estimate the change in borehole radius as a function of the grout pressure as well as a function of the time, the estimations are made and compar ed with the Kleyner 8l Krizek's experimental test results. Also by using the proposed quasi-three dimensional analytical method, analyses have been performed with the aim of pointing out the effects of various factors on the interaction behaviors of the root pile system.

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Though-silicon-via를 사용한 3차원 적층 반도체 패키징에서의 열응력에 관한 연구 (Thermo-Mechanical Analysis of Though-silicon-via in 3D Packaging)

  • 황성환;김병준;정성엽;이호영;주영창
    • 마이크로전자및패키징학회지
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    • 제17권1호
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    • pp.69-73
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    • 2010
  • Through-silicon-via (TSV)를 포함하고 있는 3차원 적층 반도체 패키지에서 구조적 변수에 따른 열응력의 변화를 살펴보기 위하여 유한요소해석을 수행하였다. 이를 통하여 TSV를 포함하고 있는 3차원 적층 반도체 패키지에서 웨이퍼 간 접합부의 지름, TSV 지름, TSV 높이, pitch 변화에 따른 열응력의 변화를 예측하였다. 최대 von Mises 응력은 TSV의 가장 위 부분과 Cu 접합부, Si, underfill 계면에서 나타났다. TSV 지름이 증가할 때, TSV의 가장 위 부분에서의 von Mises 응력은 증가하였다. Cu 접합부 지름이 증가할 때, Si과 Si 사이의 Cu 접합부가 Si, underfill과 만나는 부분에서 von Mises 응력이 증가하였다. Pitch가 증가할 때에도, Si과 Si 사이의 Cu 접합부가 Si, underfill과 만나는 부분에서 von Mises 응력이 증가하였다. 한편, TSV 높이는 von Mises 응력에 크게 영향을 미치지 못하였다. 따라서 TSV 지름이 작을수록, 그리고 pitch가 작을수록 기계적 신뢰성은 향상되는 것으로 판단된다.