• Title/Summary/Keyword: 3-dimensional analysis

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Model-Ship Correlation Study on the Powering Performance for a Large Container Carrier

  • Hwangbo, S.M.;Go, S.C.
    • Journal of Ship and Ocean Technology
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    • v.5 no.4
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    • pp.44-50
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    • 2001
  • Large container carriers are suffering from lack of knowledge on reliable correlation allowances between model tests and full-scale trials, especially at fully loaded condition, Careful full-scale sea trial with a full loading of containers both in holds and on decks was carried out to clarify it. Model test results were analyzed by different methods but with the same measuring data to figure out appropriated correlations factors for each analysis methods, Even if it is no doubt that model test technique is one of the most reliable tool to predict full scale powering performance, its assumptions and simplifications which have been applied on the course of data manipulation and analysis need a feedback from sea trial data for a fine tuning, so called correlation factor. It can be stated that the best correlation allowances at fully loaded condition for both 2-dimensional and 3-dimensional analysis methods are fecund through the careful sea trial results and relevant study on the large size container carriers.

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Vibration Analysis of Three-Dimensional Piping System by Transfer Matrix Method (전달행렬법을 이용한 3차원 파이프 계의 진동해석)

  • 이동명
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.7 no.6
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    • pp.110-116
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    • 1998
  • For the vibration analysis of 3-dimensional piping system containing fluid flow, a transfer matrix method is presented. The fluid velocity and pressure were considered, that coupled to longitudinal and flexural vibrations. Transfer matrices and point matrices were derived from direct solutions of the differential equations of motion of pipe conveying fluids, and the variations of natural frequency with flow velocity for 3-dimensional piping system were investigated.

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Three-dimensional crack analysis by fractional linear mapping (선형분수사상을 이용한 3차원 균열해석)

  • 안득만
    • Transactions of the Korean Society of Mechanical Engineers
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    • v.19 no.1
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    • pp.61-78
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    • 1995
  • In this study the method of analysis for three-dimensional plane crack problem by fractional linear mapping is given. Using this method we can obtain the exact solutions of significantly different configurations of the crack. In the example image crack configurations by mapping of elliptic crack are illustrated. And the stress intensity factors along the image crack tips are calculated.

Analysis of Composite Sabot Structure using Equivalent Properties (등가물성을 이용한 복합재 이탈피의 구조해석)

  • 이성호;이강우;우경식;박관진
    • Journal of the Korea Institute of Military Science and Technology
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    • v.6 no.4
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    • pp.63-72
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    • 2003
  • This paper deals with the analysis of composite sabot of APFSDS projectile. Unlike conventional composite parts, the sabot is composed of thick-sectioned lamination, and thus requires 3-dimensional properties in the analysis. In this study, a model was formulated to calculate the equivalent composites properties. The equivalent properties were then used in the finite element analysis and the results were compared with those by the full 3-dimensional analysis with ply-by-ply modeling. The results generally agreed with each other in the bound of 20% error, indicating that the formulated model produced the equivalent properties with reasonable accuracy. It was thought to be an efficient approach to use the model in global analysis and then perform the full 3-dimensional analysis in regions of interest for detailed evaluation in designing the composite sabot structure.

A Comparative Study between the Accuracy of Three-Dimensional MorphometIy and That of PA CephalometIy in Asymmetry Analysis (비대칭 분석시 3차원영상의 정확성에 관한 정보 두부방사선사진과의 비교연구)

  • Cho, Hong-Kyu
    • Journal of Technologic Dentistry
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    • v.23 no.1
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    • pp.95-106
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    • 2001
  • The purpose of this study was to show the method of three-dimensional morphometry developed recently and to compare the accuracy of three-dimensional morphometry with those of PA cephalometry, The three-dimensional morphometry analysis program and device were developed. Steel balls (1.2mm in diameter) were attached in twenty five landmarks of artificial human skull. This artificial human skull was used as experimental materials. From three-dimensional morphometry and PA cephalometry of artificial human skull. eleven linear measurements were acquired and made into asymmetry index. Right-left differences of measurements were used as asymmetry index. These measurements and asymmetry index were compared respectively with those of actual. The results were as follows: 1. Mean difference between three-dimensional morphometry and actual artificial human skull in linear measurements was $1.99{\pm}0.37mm$, and mean difference between PA cephalometry and actual was $21.12{\pm}0.45mm$. Both of all were reduced more than those of actual. 2. Mean difference between three-dimensional morphometry and actual artificial human skull in asymmetry index was $0.07{\pm}0.42$, and mean difference between PA cephalometry and actual was $3.63{\pm}0.60$. Three-dimensional morphometry was reduced while PA cephalometry was magnified more than that of actual. 3. Each eleven asymmetry index of three-dimensional morphometry was the same negative sign as those of actuals while only N-Z, ANS-J, Tr-Go, Tr-ANS asymmetry index were the same in PA cephalometry. These results suggest that the method of three-dimensional morphometry is more accurate than those of PA cephalometry in asymmetry analysis.

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An Analytical Study on the Determination of the Lowest Improvement Depth of Deep Mixing Method (심층혼합공법의 최저 개량 심도 결정에 관한 해석적 연구)

  • Park, Choon-Sik;Song, Ji-Won
    • Journal of the Korean Geosynthetics Society
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    • v.19 no.1
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    • pp.35-44
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    • 2020
  • Design techniques for the deep mixing method, one of the soft ground improvement methods, include two ways to interpret the ground as composite ground and pile ground. However, since comparative studies on these two approaches are insufficient, it is difficult to clearly define the analysis criteria in the design. In this study, two-dimensional and three-dimensional analyses have been performed with different conditions. The three conditions, the embankment height, depth of soft ground, and replacement ratio of reinforcement zones were varied and the analysis was performed on the basis of the assumption of composite ground and pile ground for each condition. As a result, the minimum depth of improvement in the two-dimensional analysis was deeper by 6.85~9.08% than in the three-dimensional analysis. The pile ground analysis showed that the depth of improvement was deeper by 12.22~14.45% than the composite ground analysis. Based on these results, it is concluded that for more accurate design, three-dimensional analysis should be performed rather than two-dimensional analysis. also, it is judged that necessary to analyze the ground as composite ground for economical design, and as the pile ground analysis for stable design.

Three Dimensional Reconstruction of Structural Defect of Thin Film Transistor Device by using Dual-Beam Focused Ion Beam and Scanning Electron Microscopy (집속이온빔장치와 주사전자현미경을 이용한 박막 트랜지스터 구조불량의 3차원 해석)

  • Kim, Ji-Soo;Lee, Seok-Ryoul;Lee, Lim-Soo;Kim, Jae-Yeal
    • Applied Microscopy
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    • v.39 no.4
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    • pp.349-354
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    • 2009
  • In this paper we have constructed three dimensional images and examined structural failure on thin film transistor (TFT) liquid crystal display (LCD) by using dual-beam focused ion beam (FIB) and IMOD software. Specimen was sectioned with dual-beam focused ion beam. Series of two dimensional images were obtained by scanning electron microscopy. Three dimensional reconstruction was constructed from them by using IMOD software. The short defect between Gate layer and Data layer was found from the result of three dimensional reconstruction. That phenomena made the function of the gate lost and data signal supplied to the electrode though the Drain continuously. That signal made continuous line defect. The result of the three dimensional reconstruction, serial section, SEM imaging by using the FIB will be the foundation of the next advanced study.

Three-dimensional Effects of an Axi-symmetric Pintle Nozzle (축대칭 핀틀노즐의 3차원 효과 분석)

  • Lee, Gang-Min;Sung, Hong-Gye
    • Journal of the Korean Society of Propulsion Engineers
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    • v.22 no.6
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    • pp.47-55
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    • 2018
  • In order to determine whether three-dimensional effects exist in a pintle nozzle of axisymmetric shape, a three-dimensional numerical analysis was performed. The compressibility correction was implemented with the k-${\omega}$ SST turbulence model to predict the complex flow separation transition in acceptable accuracy. Recirculation zones were observed at both the front end and rear faces of the pintle, and the flow through the pintle nozzle conveyed complex shock wave structures. Three-dimensional effects that resulted from the reasonable flow separation location were noted, and a trace of the transient pressure increase was observed, mismatched by a two-dimensional axi-symmetric analysis.

A study on Calculating the Resistance characteristics analysis on Three-Dimensional Structure Using Computer Simulation Method. (컴퓨터 시뮬레이션을 이용한 3차원적 구조에서의 저항 특성 분석에 관한 연구)

  • Jang, U-Sun
    • Proceedings of the IEEK Conference
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    • 2005.11a
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    • pp.683-686
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    • 2005
  • By now, we have been analysing the resistance values on 3 dimensional structure using experimental statical method or theoretical modeling, while devices miniaturizing reveals the limitation of the traditional methods to calculate 3 dimensional resistance. In addition, 2 dimensional analysing can not produce 3 dimensional characteristic following miniaturizing. To solve the limitations , we must do high level modeling of semi-conductor process. In this thesis, we analyzed the Laplace equation that is the basic and important for 3 dimensional structure resistance with computer simulation method and on the basis of this, analyzed the characteristic of resistance of 3 dimensional structure communication semiconductor device.

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3-Dimensional and Kinematic Analysis of a System for NDE(Nondestructive Examination) (비파괴 검사 응용을 위한 기구부의 3차원 기구학적 해석)

  • Kim, Hyung-Kuk;Lee, Dong-Hwal;Ahn, Hee-Tae;Park, Jae-Whe;Lee, Man-Hyung
    • Proceedings of the KIEE Conference
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    • 2001.07d
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    • pp.2199-2201
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    • 2001
  • The 3-dimensional measuring machine by using an ultrasonic sensor is used one of the NDE(Nondestructive Examination). It is applied to the inspection of pipelines, boreholes, pressure vessel and tank, and so on. In particular when a harsh environment prohibits the use of moving mechanical parts. The 3-dimensional measuring machine by using an ultrasonic sensor, which measure 1-dimensional information and 2-dimensional information simultaneously from a target of inspection, and then reembody 3-dimensional information. So we can find the situation in progress and predict remaining life and corrosion without destructive examination. It's a point of excellence that the 3-dimensional measuring machine is portable.

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