• 대한치과보철학회지
• /
• 제37권5호
• /
• pp.607-619
• /
• 1999

Cortical support is an important factor, as the engagement of the fixture in strong compact bone offers an increased load-carrying capacity and initial stability. Because of the poor bone quality in the posterior mandible and other anatomic considerations, it has been suggested that implant fixtures be placed in these locations with apical engagement of the lingual cortical plate for so-called bicortication. The purpose of this investigation was to determine the effect of cortical engagements and in addition polyoxymethylene(POM) intramobile connector(IMC) of IMZ implant on implant load transfer in edentulous posterior segment of mandible, using three-dimensional (3D) finite element analysis models composed of cortical and trabecular bone involving single implant. Variables such as (1) the crestal peri-implant defect, (2) the apical engagement of lingual cortical plate, (3) the occlusal contact position (a vertical load at central fossa or buccal cusp tip), and (4) POM IMC were investigated. Stress patterns were compared and interfacial stresses along the bone-implant interface were monitored specially. Within the scope of this study, the following observations were made. 1) Offset load and angulation of fixture led to increase the local interfacial stresses. 2) Stresses were concentrated toward the cortical bones, but the crestal peri-implant defect increased the interfacial stresses in trabecular bone. 3) For the model with bicortication, it was noticed that the crestal cortical bone provided more resistance to the bending moment and the lingual cortical plate provided more support for the vertical load. But Angulation problem of the fixture from the lingual cortical engagement caused the local interfacial stress concentrations. 4) It was not clear that POM IMC had the effect on stress distribution under the present experimental conditions, especially for the cases of crestal peri-implant defect.

• Composites Research
• /
• 제34권1호
• /
• pp.70-75
• /
• 2021

본 논문은 단섬유 칩으로 구성된 Sheet Molding Compound(SMC) 복합재료를 실험적으로 관찰된 특징들을 바탕으로 메소스케일(meso-scale) 대표체적요소(RVE: Representative Volume Element)를 재구성하는 새로운 알고리즘을 제시한다. 전산해석을 이용하여 SMC 복합재료의 비등방성 거동의 정확한 예측은 어려운 문제이다. 이를 극복하기 위해, SMC 복합재료를 위한 일련의 이미지 프로세싱 기술과 재구성 알고리즘 및 유한요소(FE: Finite Element) 생성기로 구성된 SMC RVE 모델을 개발하였다. 첫째, micro-CT 이미지 프로세싱은 SMC 물성에 직접적인 상관관계를 가지는 섬유칩의 배향 및 분산의 확률적 분포를 평가한다. 둘째, 해당 통계적 분포를 바탕으로 섬유칩 간의 겹침효과를 고려한 섬유칩 팩킹 재구성 알고리즘을 개발한다. 마지막으로, SMC 복합재료 멀티스케일 해석을 이용하여 매크로스케일(macro-scale)에서의 거동을 파악하고 실험데이터를 통해 검증을 수행한다.

• 대한기계학회:학술대회논문집
• /
• 대한기계학회 2001년도 추계학술대회논문집A
• /
• pp.330-335
• /
• 2001

While contacting directly with ground, the tire tread part is in shape of complex patterns of variable ASDs(anti-skid depth) for various tire performances. However, owing to the painstaking mesh generation job and the extremely long CPU-time, conventional 3-D tire analyses have been performed by either neglecting tread pattern or modeling circumferential grooves only. As a result, such simplified analysis models lead to considerably poor numerical expectations. This paper addresses the development of a systematic 3-D mesh generation of tires considering the detailed tread pattern. Basically, tire body and tread meshes are separately generated, and then both are to be combined. For the systematic mesh generation, which consists of a series of meshing steps, we develop in-house subroutines which utilize the useful functions of I-DEAS solid modeler. The detailed pattern mesh can be imparted partially or completely.

• 대한전기학회:학술대회논문집
• /
• 대한전기학회 2008년도 Techno-Fair 및 합동춘계학술대회 논문집 전기물성,응용부문
• /
• pp.147-148
• /
• 2008

In this paper, we calculated the axial magnetic field at mid-gap plane between upper and lower electrode in vacuum interrupter by means of commercial finite element method Maxwell 3D and compared on the basis of "effective area" criterion. The models used in this paper are coil type(axial magnetic field) vacuum interrupter electrodes which have different numbers of coil segment. We used Dr. Schulmann's experimental equation which indicates minimum critical value of axial magnetic field to diffuse arc.

• 한국생산제조학회지
• /
• 제19권2호
• /
• pp.157-162
• /
• 2010

This paper describes the thermal fatigue life prediction models for 95.5Sn-4.0Ag-0.5Cu solder joints of Flip chip package considering Under Bump Metallurgy(UBM). A 3D Finite element slice model was used to simulate the viscoplastic behavior of the solder. For two types of solder bump pitches, simulations were analyzed and the effects of underfill packages were studied. Consequently, it was found out that solder joints with underfill had much better fatigue life than solder joints without underfill, and solder joints with $300{\mu}m$ bump pitch had a longer thermal fatigue life than solder joints with $150{\mu}m$ bump pitch. Through the simulations, flip chip with lead-free solder joints should be designed with underfill and a longer bump pitch.

• 지질공학
• /
• 제26권2호
• /
• pp.169-175
• /
• 2016

Estimations of regional stress are demonstrated in this paper. Firstly, regional stress is defined and the characteristics of regional stress are then discussed based on the local stresses measured by the Compact Conical-ended Borehole Overcoring (CCBO) technique and the results from the earthquake focal mechanism. Secondly, the regional stresses are estimated by a back analysis of three-dimensional finite element models, using the local stresses measured by the CCBO and hydraulic fracturing.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2001년도 춘계학술대회 논문집 유기절연재료 전자세라믹 방전플라즈마 연구회
• /
• pp.51-54
• /
• 2001

This Paper is described basic principles of arc quenching in Molded Case Circuit Breaker. We analyzed magnetic blowout forces acting on the arc in contact system when circuit breakers interrupt fault currents in different three models by 3-D FEM(Finite Element Method). The interrupting time simulated is compared with that of short circuit tests. The results of this study derive valid of the simulation method and present the techniques to improve arc quenching performance.

• Nuclear Engineering and Technology
• /
• 제30권5호
• /
• pp.462-469
• /
• 1998

A package to transport high-level radioactive materials is required to withstand normal transport and hypothetical accident conditions pursuant to the IAEA and domestic regulations. The package should maintain the structural safety not to release radioactive material in any condition. The structural safety of the package has been evaluated by tests using proto-type or scaled-down models, however, the method by analysis is gradually utilized due to recent advancement of computers and computer codes. In this paper, to evaluate the structural safety of a radioisotope package of the KAERI, the three dimensional impact analyses under 9m free drop and 1m puncture were performed with an explicit finite-element code, the LS-DYNA3D code. The maximum stress intensity on each part was calculated and the structural safety of the package was evaluated in accordance with the regulations.

• 한국소음진동공학회:학술대회논문집
• /
• 한국소음진동공학회 2000년도 추계학술대회논문집
• /
• pp.737-741
• /
• 2000

Portable communication devices such as laptop computers suffer impact-induced failure in their usage. Drop/impact performance of these products is one of important concerns of product design. Because of the small size of this kind of electronics products, it is very expensive, time-consuming and difficult to conduct drop tests to directly detect the failure mechanism and identify their drop behaviors. Finite element analysis provides a vital, powerful vehicle to solve the problems. The models are created with HYPERMESH, and the analysis is carried out with LS-DYNA3D. The analysis is focused on HDD impact behavior in acceleration peak values.

• 국제강구조저널
• /
• 제18권4호
• /
• pp.1470-1481
• /
• 2018

Building-level response to post-earthquake fire hazards in steel buildings has been assessed using primarily two-dimensional analyses of the lateral force resisting system. This approach may not adequately consider potential vulnerabilities in the gravity framing system. For this reason, three-dimensional (3D) finite element models of a 10-story case study building with perimeter moment resisting frames were developed to analyze post-earthquake fire events and better understand building response. Earthquakes are simulated using ground motion time histories, while Eurocode parametric time-temperature curves are used to represent compartment fires. Incremental dynamic analysis and incremental fire analysis procedures capture a range of hazard intensities. Findings show that the structural response due to earthquake and fire hazards are somewhat decoupled from one another. Regardless of the level of plastic hinging present in the moment framing system due to a seismic event, gravity column failure is the initiating failure mode in a fire event.