• Title/Summary/Keyword: 3-D Integration

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Prediction of energy expenditure from a tri-axial accelerometer during treadmill walking (트레드밀 보행 시 단일 3축 가속도센서를 사용한 대사에너지 소모량 예측)

  • Lee, H.Y.;Park, S.W.;Kim, S.H.;Lee, D.Y.;Kim, Y.H.
    • Journal of Biomedical Engineering Research
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    • v.32 no.2
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    • pp.79-84
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    • 2011
  • The purpose of this study was to investigate the relevance of the prediction equations derived from the relationship between metabolic energy expenditure and kinetic energy, for different speeds of walking and running over the treadmill. Seven male subjects participated in this study. A tri-axial accelerometer was attached on between the left and right posterior superior iliac spines. Kinetic energy was calculated by the integration of acceleration data and compared with the metabolic energy measured by a gas analyzer. Correlation coefficients were determined to find a relationship between the kinetic energy and the metabolic energy expenditure. Also, the difference between measured and predicted values was used to find the relevance for individual and group equations. Results showed a relatively good correlation between the measured metabolic energy and the calculated kinetic energy. In addition, a dramatic increase in kinetic energy was observed at the transition speed of walking and running (6 km/h). There was no difference in how to predict the kinetic energy expenditure for individual and group even though people have different physical characteristics. This study would be useful to predict metabolic energy expenditures by the regression analysis with acceleration data.

Study on the Acoustic Behaviour Pattern of Fish Shool and Species Identification 1. Shoal Behaviour pattern of anchovy (Engraulis japonicus) in Korean waters and Species Identification Test. (어군의 음향학적 형태 및 분포특성과 어종식별에 관한 연구 1.한국 연근해 멸치어군의 형태 및 분포특성과 종식별 실험)

  • 김장근
    • Journal of the Korean Society of Fisheries and Ocean Technology
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    • v.34 no.1
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    • pp.52-61
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    • 1998
  • We studied behaviour pattern of anchovy (Engraulis japonicus) shoal by a method of shoal echo integration and tested species identification by a method of artificial neural network using the acoustic data collected in the East China Sea in March 1994 and in the southern coastal waters of the East Sea of Korea in March 1995. Between areas, frequency distribution of 10 shoal descriptors was different, which showed characteristics of shoal behaviour in size, bathymetric position and acoustic strength. The range and mean of shoal size distribution in length and height was wider and bigger in the southern coastal waters of the East Sea than in the East China Sea. Relative shoal size of China Sea. Fractal dimension of shoal was almost same in both areas. Mean volume reverbration index of shoal was 3 dB higher in the southern coastal waters of the East Sea than in the East China Sea. The depth layer of shoal distribution was related to bottom depth in the southern coastal waters of the East Sea, while it was between near surface and central layer in the East China Sea. Principal component analysis of shoal descriptors showed the correlation between shoal size and acoustic strength which was higher in the southern coastal waters of the East Sea, than in the East China Sea. Correlation was also found among the bathymetric positions of shoal to some degree higher in the southern coastal waters of the East Sea than in the East China Sea. The anchovy shoal of two areas was identified by artificial neural network. The contribution factor index (Cio) of the shoal descriptors between two areas were almost identical feature. The shoal volume reverberation index (Rv) was showed the highest contribution to the species identification, while shoal length and shoal height showed relatively high negative contribution to the species identification.

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Nonlinear Dynamic Analysis of Steel Lazy Wave Riser using Lumped Mass Line Model (집중질량 라인모델을 이용한 Steel Lazy Wave Riser의 비선형 동적 해석)

  • Oh, Seunghoon;Jung, Jae-Hwan;Park, Byeongwon;Kwon, Yong-Ju;Jung, Dongho
    • Journal of Ocean Engineering and Technology
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    • v.33 no.5
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    • pp.400-410
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    • 2019
  • In this study, the numerical code for the 3D nonlinear dynamic analysis of an SLWR (Steel Lazy Wave Riser) was developed using the lumped mass line model in a FORTRAN environment. Because the lumped mass line model is an explicit method, there is no matrix operation. Thus, the numerical algorithm is simple and fast. In the lumped mass line model, the equations of motion for the riser were derived by applying the various forces acting on each node of the line. The applied forces at the node of the riser consisted of the tension, shear force due to the bending moment, gravitational force, buoyancy force, riser/ground contact force, and hydrodynamic force based on the Morison equation. Time integration was carried out using a Runge-Kutta fourth-order method, which is known to be stable and accurate. To validate the accuracy of the developed numerical code, simulations using the commercial software OrcaFlex were carried out simultaneously and compared with the results of the developed numerical code. To understand the nonlinear dynamic characteristics of an SLWR, dynamic simulations of SLWRs excited at the hang-off point and of SLWRs in regular waves were carried out. From the results of these dynamic simulations, the displacements at the maximum bending moments at important points of the design, like the hang-off point, sagging point, hogging points, and touch-down point, were observed and analyzed.

Developing a clothing and textiles studio course for future home economics teachers using principles of PBL and maker education (PBL과 메이커 교육을 적용한 가정과 예비교사를 위한 의류학 실습 수업 개발)

  • Lee, Yhe-Young
    • The Research Journal of the Costume Culture
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    • v.29 no.1
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    • pp.134-151
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    • 2021
  • The aim of this research is to develop a clothing and textiles studio course for preservice home economics teachers applying principles of Project-Based Learning (PBL) and maker education to equip future teachers with the ability to nurture creativity among adolescents. The studio course was developed in the following stages: analysis, design, development, implementation, and evaluation. We concluded that the resulting course met the following objectives extracted from the 2015 revised curriculum of home economics subjects: to promote creative and environmentally-friendly fashion design and styling abilities, gain the ability to use makerspace tools, understand flat pattern making and sewing processes, and develop creative thinking, aesthetic sense, and communication skills. Furthermore, the educational effects of PBL and maker education were confirmed through student comments on the course. Students mentioned the practicality of the material in their actual lives along with their enhanced integration of the subject material, self-directedness, aesthetic sense, ability to learn through trial and error, collaboration and communication, and sharing. Based on results from the implementation and evaluation stages, a clothing and textiles studio course should include the following modules: introduction of terms and tools, submission and sharing of clothing reformation and upcycling techniques, introduction to hand sewing, pouch making, heat-transfer printing, 3D printing, mask making, hat making, vest making, and the final team project on fashion styling. It is important for instructors to provide detailed guidelines on selecting personas for styling, looking for available materials, and selecting materials online.

Industrial analysis according to lithography characteristics of digital micromirror device and polygon scanner (Digital Micromirror Device와 Polygon scanner의 Lithography 특성에 따른 산업적 분석)

  • Kim, Ji-Hun;Park, Kyu-Bag;Park, Jung-Rae;Ko, Kang-Ho;Lee, Jeong-woo;Lim, Dong-Wook
    • Design & Manufacturing
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    • v.15 no.4
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    • pp.65-71
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    • 2021
  • In the early days of laser invention, it was simply used as a measuring tool, but as lasers became more common, they became an indispensable processing tool in the industry. Short-wavelength lasers are used to make patterns on wafers used in semiconductors depending on the wavelength, such as CO2 laser, YAG laser, green laser, and UV laser. At first, the hole of the PCB board mainly used for electronic parts was not thin and the hole size was large, so a mechanical drill was used. However, in order to realize product miniaturization and high integration, small hole processing lasers have become essential, and pattern exposure for small hole sizes has become essential. This paper intends to analyze the characteristics through patterns by exposing the PCB substrate through DMD and polygon scanner, which are different optical systems. Since the optical systems are different, the size of the patterns was made the same, and exposure was performed under the optimal conditions for each system. Pattern characteristics were analyzed through a 3D profiler. As a result of the analysis, there was no significant difference in line width between the two systems. However, it was confirmed that dmd had better pattern precision and polygon scanner had better productivity.

Design of a Smart Safety Vest Incorporated With Metal Detector Kits for Enhanced Personal Protection

  • Rajendran, Salini D.;Wahab, Siti N.;Yeap, Swee P.
    • Safety and Health at Work
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    • v.11 no.4
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    • pp.537-542
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    • 2020
  • Background: Personal protective equipment (PPE) has been designed in such a way to reduce accident rates. Unfortunately, existing PPE is rather ineffective as it is not able to provide warning signals when hazard is around. The integration of intelligent systems is envisaged to increase the efficiency of existing PPE. Methods: This project designed a safety vest incorporated with metal detectors which can provide immediate warning to the field workers when there is metal hazard around. This product has greater freedom of design via smart manufacturing as it involves the assembly of few commercially available parts into a single entity. Briefly, the metal detector is a do it yourself (DIY) kit, and the safety vest is purchasable from any local market. The DIY kit was connected to a copper coil and being sewed into the safety vest. Results: The metal detector induces beeping sound when there is metal hazard around. A total of 121 engineering students were introduced to the prototype before being requested to answer a survey associated with the design. Respondents have rated >3.00/5.00 for the design simplicity, ease of usage, and light weight. Meanwhile, respondents suggested that the design should be further improved by increasing the metal detection range. Conclusion: It is envisaged that the introduction of this smart safety vest will allow the workers to carry out their duties securely by reducing the accident rates. Particularly, such design is expected to reduce workplace accident especially during night time at construction sites where the visibility is low.

BIM-DRIVEN ENERGY ANALYSIS FOR ZERO NET ENERGY TEST HOME (ZNETH)

  • Yong K. Cho;Thaddaeus A. Bode;Sultan Alaskar
    • International conference on construction engineering and project management
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    • 2009.05a
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    • pp.276-284
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    • 2009
  • As an on-going research project, Zero Net Energy Test Home (ZNETH) project investigates effective approaches to achieve whole-house environmental and energy goals. The main research objectives are (1) to identify energy saving solutions for designs, materials, and construction methods for the ZNETH house and (2) to verify whether ZNETH house can produce more energy than the house uses by utilizing Building Information Modeling (BIM) and energy analysis tools. The initial project analysis is conducted using building information modeling (BIM) and energy analysis tools. The BIM-driven research approach incorporates architectural and construction engineering methods for improving whole-building performance while minimizing increases in overall building cost. This paper discusses about advantages/disadvantages of using BIM integrated energy analysis, related interoperability issues between BIM software and energy analysis software, and results of energy analysis for ZNETH. Although this investigation is in its early stage, several dramatic outcomes have already been observed. Utilizing BIM for energy analysis is an obvious benefit because of the ease by which the 3D model is transferred, and the speed that an energy model can be analyzed and interpreted to improve design. The research will continue to use the ZNETH project as a testing bed for the integration of sustainable design into the BIM process.

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Heat Dissipation Trends in Semiconductors and Electronic Packaging (반도체 및 전자패키지의 방열기술 동향)

  • S.H. Moon;K.S. Choi;Y.S. Eom;H.G. Yun;J.H. Joo;G.M. Choi;J.H. Shin
    • Electronics and Telecommunications Trends
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    • v.38 no.6
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    • pp.41-51
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    • 2023
  • Heat dissipation technology for semiconductors and electronic packaging has a substantial impact on performance and lifespan, but efficient heat dissipation is currently facing limited improvement. Owing to the high integration density in electronic packaging, heat dissipation components must become thinner and increase their performance. Therefore, heat dissipation materials are being devised considering conductive heat transfer, carbon-based directional thermal conductivity improvements, functional heat dissipation composite materials with added fillers, and liquid-metal thermal interface materials. Additionally, in heat dissipation structure design, 3D printing-based complex heat dissipation fins, packages that expand the heat dissipation area, chip embedded structures that minimize contact thermal resistance, differential scanning calorimetry structures, and through-silicon-via technologies and their replacement technologies are being actively developed. Regarding dry cooling using single-phase and phase-change heat transfer, technologies for improving the vapor chamber performance and structural diversification are being investigated along with the miniaturization of heat pipes and high-performance capillary wicks. Meanwhile, in wet cooling with high heat flux, technologies for designing and manufacturing miniaturized flow paths, heat dissipating materials within flow paths, increasing heat dissipation area, and reducing pressure drops are being developed. We also analyze the development of direct cooling and immersion cooling technologies, which are gradually expanding to achieve near-junction cooling.

The Measurement and Analysis of LiF:Mg, Cu, Na, Si TL Material by Thermoluminescence Spectrum (LiF:Mg, Cu, Na, Si TL 물질의 열자극발광스펙트럼 측정 및 분석)

  • Lee, J.I.;Moon, J.H.;Kim, D.H.
    • Journal of Korean Ophthalmic Optics Society
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    • v.6 no.1
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    • pp.149-153
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    • 2001
  • Three-dimensional thermoluminescence(TL) spectra of LiF: Mg, Cu, Na, Si TL material based on temperature, wavelength and intensity were measured and analyzed. The glow curves were obtained by integration of luminescence intensity for wavelength at each temperature, and various trapping parameters related to the trap formation were determined by analyzing these curves. Computerized glow curve deconvolution(CGCD) method which based on general order kinetics(GOK) model were used for the glow curve analysis. The glow curves of LiF:Mg, Cu, Na, Si TL material were deconvoluted to six isolated glow curves which have peak temperature at 333 K, 374 K, 426 K, 466 K, 483 K and 516 K, respectively. The 466 K main glow peak had an activation energy of 2.06 eV and a kinetic order of 1.05. This TL material was also found to have three recombination centers, 1.80 eV, 2.88 eV and 3.27 eV by TL spectra analysis based on Franck-Condon model. It showed that 2.88 eV is the dominant center, followed by 3.27 eV level, and 1.80 eV center is ascertained as emission center of this material even though its very weak emission intensity.

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Thermo-Mechanical Analysis of Though-silicon-via in 3D Packaging (Though-silicon-via를 사용한 3차원 적층 반도체 패키징에서의 열응력에 관한 연구)

  • Hwang, Sung-Hwan;Kim, Byoung-Joon;Jung, Sung-Yup;Lee, Ho-Young;Joo, Young-Chang
    • Journal of the Microelectronics and Packaging Society
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    • v.17 no.1
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    • pp.69-73
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    • 2010
  • Finite-element analyses were conducted to investigate the thermal stress in 3-dimensional stacked wafers package containing through-silicon-via (TSV), which is being widely used for 3-Dimensional integration. With finite element method (FEM), thermal stress was analyzed with the variation of TSV diameter, bonding diameter, pitch and TSV height. It was revealed that the maximum von Mises stresses occurred at the edge of top interface between Cu TSV and Si and the Si to Si bonding site. As TSV diameter increased, the von Mises stress at the edge of TSV increased. As bonding diameter increased, the von Mises stress at Si to Si bonding site increased. As pitch increased, the von Mises stress at Si to Si bonding site increased. The TSV height did not affect the von Mises stress. Therefore, it is expected that smaller Cu TSV diameter and pitch will ensure mechanical reliability because of the smaller chance of plastic deformation and crack initiation.