• Journal of Advanced Marine Engineering and Technology
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• v.40 no.4
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• pp.314-319
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• 2016

Flange bolt has a circular flange under the head that acts like a washer to distribute the clamping load over a large area. Flange bolt has usually been manufactured by cold forging. Flower shape defect occurs in the flange forging stage. This defect causes lack of dimensional accuracy and low quality. So it is needed to improve these forging defects. In this study, die design method for flower shape defect of flange bolt was suggested. In order to improve flower shape defect, inner diameter of the addition die in conventional forging process was modified. The forging process with applied modified die was simulated by commercial FEM code DEFORM-3D. The simulated results for modified die were confirmed by experimental trials with the same condition.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 1999.05a
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• pp.5-8
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• 1999

The present work is concerned with three-dimensional finite element analysis of the hollow section extrusion process using a porthole die. For economic computation, mismatching refinement, an efficient domain decomposition method with different mesh density for each subdomain, is implemented. The proposed method improves the computational efficiency significantly, especially fur the three-dimensional analysis of extrusion problems. As a numerical example, extrusion of the underframe part of a railroad vehicle are analyzed. For three-dimensional mesh generation of a complicated shape with hexahedral elements, a modified grid-based approach with the surface element layer is utilized. The analysis results are then successfully reflected on the industrial porthole die design.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2007.10a
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• pp.285-288
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• 2007

In the recent years the using of low-density material such as high-strength Al alloy on the various industries is becoming light-weight. High strength and hollow Al alloy is good material for stiffness and recycling. Therefore the advanced manufacturing technology with Al alloy is continuously required in many industrial fields. In this study simplified hallow rectangular section of Al alloy is analyzed by FE analysis. Bending stress is affected punching and rotating of wing-die. The analysis of press bending is preformed at first. The elastic recovery value of component and stress distribution acting from the result of the bending angle of three types were obtained. The designed precesses were analyzed by the commercial FE code, Deform-3D. Forming dies for each process were designed and prototypes were manufactured by the verified forming process. Some of the important features of design parameters in the press bending were reviewed.

• Design & Manufacturing
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• v.10 no.2
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• pp.24-28
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• 2016

In this study, relevant to impact extrusion process of the rectangular batter case for electric vehicles, numerical and experimental analyses were conducted to reduce the earring defects induced in the unevenness of metal flow. Since the earring is caused by the non-uniform metal flow induced in the friction and aspect ratio in the bottom section. As a way to reduce the earring, variable land die concept was applied. In order to analyze numerically the complex metal flow by using commercial finite element package, DEFORM 3D, impact extrusion process was simplified in upsetting mode at bottom section and extrusion mode at land section. The impact extrusion experiments were conducted to verify the assessment of process parameter for impact extrusion. As results, variable land die which has longer longitudinal section makes reduce earring defects. In addition, it was confirmed that the effect that slug shape like dog-bone also can reduce the earring. This study is expected to be able to present the useful design guidelines for manufacturing the battery case.

• Proceedings of the KIEE Conference
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• 1995.07c
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• pp.1152-1155
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• 1995

An analytic model for the optimum design of the power MOSFET considering the degradation of the breakdown voltage by the three dimensional effect is proposed. The proposed method gives the optimum design parameters such as the lateral radius of window curvature and the doping concentration of the epi-layer, which does not minimize the on-resistance but also maintains the required breakdown voltage. The analytical results are verified by the quasi 3D simulation tools, MEDICI, and it is found that the proposed method may be a good guideline for the design of power MOSFET.

• Transactions of Materials Processing
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• v.24 no.4
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• pp.234-240
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• 2015

Multi-pass shape drawing is very important to produce steel profiles in round samples. In the current study, a process design system is developed for a multi-pass shape drawing. In general, the number of passes for a multi-pass shape drawing is 2 to 3 when the reduction ratio, drawing stress, and productivity are considered. Therefore, calculating the drawing stress and designing the intermediated die shapes are very important. In order to calculate the drawing stress, a shape drawing load prediction method is proposed using a general axisymmetric drawing load prediction model. An intermediate die shape design method is proposed using the initial and the final product shapes. Based on this analysis, a process design system is developed for multi-pass shape drawing for steel profiles. The system works with AutoCAD. The system was applied to design a shape drawing of a spline.

• Design & Manufacturing
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• v.12 no.2
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• pp.51-56
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• 2018

Generally, The women was used in the cosmetic cushion fact. It has developed with the consideration of manufacturing. In this study, we designed green-friendly and element parts lower and single cushion fact containers using a single material. Injection mold simulation were performed using on 3D design data. The injection mold simulation used the data (Injection time / Cooling time / Temperature / Pressure) in the injection mold parameters. In addition, the sink mark phenomenon in the simulation results is analyzed as a problem due to the thickness and further research is needed in the future.

• ETRI Journal
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• v.36 no.6
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• pp.931-941
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• 2014

Many methodologies for clock mesh networks have been introduced for two-dimensional integrated circuit clock distribution networks, such as methods to reduce the total wirelength for power consumption and to reduce the clock skew variation through consideration of buffer placement and sizing. In this paper, we present a methodology for clock mesh to reduce both the clock skew and the total wirelength in three-dimensional integrated circuits. To reduce the total wirelength, we construct a smaller mesh size on a die where the clock source is not directly connected. We also insert through-silicon vias (TSVs) to distribute the clock signal using an effective clock TSV insertion algorithm, which can reduce the total wirelength on each die. The results of our proposed methods show that the total wirelength was reduced by 12.2%, the clock skew by 16.11%, and the clock skew variation by 11.74%, on average. These advantages are possible through increasing the buffer area by 2.49% on the benchmark circuits.

• Design & Manufacturing
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• v.13 no.4
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• pp.45-50
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• 2019

The fourth industrial revolution calls for an integrated talent by improving working-level skills within the big framework of creativity and convergence. Therefore, university education focuses on solving the problem of practical ability education by improving employment ability. Based on this improvement in practical skills, this study is based on the field-based design curriculum of Capstone. Currently, the Capstone Design Course is being implemented at most universities, extending its scope to the fields of engineering, humanities, social studies and arts. However, there is a limit to the core concept of Capstone design education and capacity education developed in line with the foreign educational environment and applied directly to our nation's university education. In terms of overseas cases, the core focus is to develop practical, design, and prototype capabilities by forming a team among all grades and multidisciplinary institutions to support the capital and manpower of the industry. However, the nation's industrial linkage and curriculum have difficulties in carrying out multi-disciplinary education. In this study, students were asked to team up and solve the challenges that the industry needs based on the expertise acquired in the lower grade curriculum by applying majors and 3D printing through the first and second semester courses of the fourth grade to address these limitations. In addition, business skills for the process of creativity and leadership experience in our country through a suitable design capstone class to review the efficiency of education by applying a model. In order to achieve the purpose of Capstone design subject, the goal setting, class model composition, class model application, verification and evaluation, and final class model development procedures were carried out. Through this process, it will be used as a basic material for educating design class capstone design.

• ETRI Journal
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• v.36 no.4
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• pp.643-653
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• 2014

To reduce interconnect delay and power consumption while improving chip performance, a three-dimensional integrated circuit (3D IC) has been developed with die-stacking and through-silicon via (TSV) techniques. The power supply problem is one of the essential challenges in 3D IC design because IR-drop caused by insufficient supply voltage in a 3D chip reduces the chip performance. In particular, power bumps and TSVs are placed to minimize IR-drop in a 3D power delivery network. In this paper, we propose a design methodology for 3D power delivery networks to minimize the number of power bumps and TSVs with optimum mesh structure and distribute voltage variation more uniformly by shifting the locations of power bumps and TSVs while satisfying IR-drop constraint. Simulation results show that our method can reduce the voltage variation by 29.7% on average while reducing the number of power bumps and TSVs by 76.2% and 15.4%, respectively.