• Journal of the Microelectronics and Packaging Society
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• v.28 no.2
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• pp.1-12
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• 2021

3D printing, which designs product in three dimensions, draws attention as a technology that will lead the future for it dramatically shortens time for production without assembly, no matter how complex the structure is. The paper studies the latest researches of 3D-printed electronics and introduces papers studied electronics components, power supply, circuit interconnection and 3D-printed PCBs' applications. 3D-printed electronics showed possibility to simplify facilities and personalize electric devices by providing one-stop printing process of electronic components, soldering, stacking, and even encapsulation.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.15 no.2
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• pp.1-8
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• 2016

Generally, electrical circuits are fabricated as Printed Circuit Boards (PCBs) and mounted on the casing of the product. Additionally, this requires many other parts and some labor for assembly. Recently, molding technology has increasingly been applied to embed simple circuits in plastic casing. The technology is called a Molded Interconnected Device (MID). By using this technology, PCB fabrication can be replaced by molding, and much of the corresponding assembly process for PCBs can be eliminated if the circuit is simple enough for molding. Furthermore, as the improvement of conductive materials and printing technologies of simple electric circuits can be printed directly on the casing part, this also reduces the complexity of the product design and production cost. Therefore, this paper introduces a new MID fabrication process using direct 3D printing technology. Additionally, it is applied to an automotive part of a cruise control switch. The methodology and design are shown.

• Proceedings of the Korean Information Science Society Conference
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• 2000.10b
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• pp.323-325
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• 2000

정보통신의 발전에 따라 컴퓨터 및 주변 장치간에 칼라를 정확히 재생할 수 있는 능력이 산업 경쟁력에 중요한 요소로 부상하고 있다. 본 논문에서는 모니터 상의 이미지를 프린터로 인쇄하기 위하여 사용되는 기존의 참조테이블(Look Up Table) 방식을 살펴보고 이 기능을 대체할 수 있는 신경회로망에 의한 칼라보정 매핑 방법을 제안하였다. 참조테이블 방식에서는 3차원으로 구성된 테이블을 구성하기가 쉽지 않고 구간 사이의 칼라값은 보간법을 써서 구해야 한다. 신경회로망에 의한 방법에서는 일단 학습을 완료하면 실시간으로 칼라를 보정해 주는 장점이 있다. 실험에서는 두 가지 방법에 의한 칼라 샘플의 모델을 통한 결과 값을 비교해 보고 상호간의 장단점과 성능 향상을 위한 방법을 토의하였다.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.2
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• pp.1-12
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• 2023

In the current era of the global mobile smart device revolution, electronic devices are required in all spaces that people interact with. The establishment of the internet of things (IoT) among smart devices has been recognized as a crucial objective to advance towards creating a comfortable and sustainable future society. In-mold electronic (IME) processes have gained significant industrial significance due to their ability to utilize conventional high-volume methods, which involve printing functional inks on 2D substrates, thermoforming them into 3D shapes, and injection-molded, manufacturing low-cost, lightweight, and functional components or devices. In this article, we provide an overview of IME and its latest advances in application. We review biomimetic nanomaterials for constructing self-supporting biosensor electronic materials on the body, energy storage devices, self-powered devices, and bio-monitoring technology from the perspective of in-mold electronic devices. We anticipate that IME device technology will play a critical role in establishing a human-machine interface (HMI) by converging with the rapidly growing flexible printed electronics technology, which is an integral component of the fourth industrial revolution.