• Journal of the korean academy of Pediatric Dentistry
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• v.28 no.1
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• pp.54-66
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• 2001

The aim of this study was to investigate the fluoride release and some mechanical properties including 3-point bending strength, amount of abrasion, surface hardness, water sorption/solubility and cytotoxicity of the newly developed composite resins containing 8, 16, 24 wt% $SrF_2$ glass filler (VF8, VF16, VF24) and four commercially available composite resins, Heliomolar(HE), Verdonfil(VE), Z100(ZH) and Aelitefil(AE). To investigate cytotoxic effect, agar overlay assay was done. Amount of fluoride released into distilled water was measured over a 62-days period from VF8, VF16, VF24 and HE. Results were as follows: 1. Experimental composite resins showed similar mechanical properties to commercial composite resins, but 3-point bending strength and surface hardness of experimental composite resins were inferior to ZH. 2. Over a 62-day Period, the amount of fluoride released was ordered: VF24>VF16>VF8>HE. In experimental composite resins, the amount of fluoride released was 9-23 times greater than HE and seemed to be proportional to the content of $SrF_2$ glass filler. 3. Experimental composite resins and all control composite resins showed mild cytotoxicity. This study showed significantly greater fluoride release from newly developed composite resins than control(HE) and addition of $SrF_2$ glass filler did not decrease mechanical properties or increase cytotoxicity of composite resin. The results from this study imply that newly developed composite resin have adequate mechanical properites, mild cytotoxicity and some potential for secondary caries prevention.

• Korean Chemical Engineering Research
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• v.45 no.5
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• pp.479-486
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• 2007

Four point bending is used to study the dependences of bond strength of benzocyclobutene(BCB) bonded wafers and BCB thickness, the use of an adhesion promoter, and the materials being bonded. The bond strength depends linearly on BCB thickness, due to the thickness-dependent contribution of the plastic dissipation energy of the BCB and thickness independence of BCB yield strength. The bond strength increases by about a factor of two with an adhesion promoter for both $2.6{\mu}m$ and $0.4{\mu}m$ thick BCB, because of the formation of covalent bonds between adhesion promoter and the surface of the bonded materials. The bond strength at the interface between a silicon wafer with deposited oxide and BCB is about a factor of three higher than that at the interface between a glass wafer and BCB. This difference in bond strength is attributed to the difference in Si-O bond density at the interfaces. At the interfaces between plasma enhanced chemical vapor deposited (PECVD) oxide coated silicon wafers and BCB, and between thermally grown oxide on silicon wafers and BCB, 12~13 and $15{\sim}16bonds/nm^2$ need to be broken. This corresponds to the observed bond energies, $G_0s$, of 18 and $22J/m^2$, respectively. Maximum 7~8 Si-O $bonds/nm^2$ are needed to explain the $5J/m^2$ at the interfaces between glass wafers and BCB.