• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 1990.11a
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• pp.36-40
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• 1990

세라믹재료는 ductility가 작아 그 강도가 균열의 가혹성, 즉 크기와 모양에 의하여 결정되는 특징을 가지고 있다. 한편 마모는 표면에 균열을 생성시킬 수 있기 때문에 강도에 큰 영향을 미칠 수 있다. 그러나 지금까지 강도에 미치는 마모의 영향은 잘 밝혀져 있지 않다. 따라서 본 연구에서는 세라믹재료중에서도 물리적 성질들이 잘 알려져 있는 알루미나를 택하여 마모기구를 관찰하고 마모가 강도에 미치는 영향을 관찰하였다. 소결후 고온등방가압 처리된 알루미나 소결체를 입수하여 3mmX4mmX40mm크기의 굽힘시험시편으로 가공하였다. 두개의 4mmX40mm면중에서 한명을 diamond paste $1\mu m$까지 사용하여 polishing하였다. 시편의 polishing된 면위에 질화규소 볼을 올려 놓고, 하중을 가한 상태에서 볼을 와복운동시켰다. 시편위에 형성되는 마모흔적의 길이를 16mm이상이 되도록 하였다. 왕복속도는 약 2 헤르쯔도 하였다. 하중은 300, 600, 900N으로 하였다. 윤활유로는 paraffin oil을 사용하였다. 마모시험이 끝난 시편을 광학현미경 및 주사전자현미경으로 관찰한 후, 4-점굽힘시험하여 강도를 구하였다. 4-점굽힘시험시 외부 및 내부 지지점간의 거리는 30mm, 10mm로 하였으며, cross head speed는 분당 0.5mm로 하였다.

• Journal of Digital Convergence
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• v.18 no.4
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• pp.341-346
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• 2020

Polymethyl methacrylate (PMMA), a self-curing resin mainly used in removable orthodontic appliances, is an acrylic resin mainly used in the field of modern dentistry. As an advantage, it has been used for a long time as a material for orthodontic devices in dentistry due to its color and volume, tissue affinity, and stability. The production of PMMA can be divided into self-polymerization method and thermal polymerization method according to activation method. Self-curing resins have long been used as orthodontic devices. The resin injection method is largely divided into a sprinkle-on method and a mixing method. In this study, we intend to test the mechanical properties according to the resin injection method of the orthodontic device, such as strength, modulus of elasticity, and surface roughness. There was no significant difference in strength as a result of three-point bending strength test on rectangular specimens (1.4 × 3.0 × 19.0 mm) of orthodontic PMMA. There was also no significant difference in hardness. There was no significant difference in surface roughness. It was confirmed that the orthodontic PMMA had no significant difference in mechanical properties according to the resin injection method of the orthodontic device.

• Journal of Power System Engineering
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• v.2 no.3
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• pp.41-48
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• 1998

This study was aimed at development of fabrication process of functionally graded materials(FGM), consisting of metal and ceramic by thermal spraying method. NiCrAIY/$Al_2O_3$ FGM were made by using plasma spraying onto the SS400 carbon steel substrate. And mechanical properties such as microhardness, thermal shock resistance and adhesive strength of the coating layer were investigated. Adhesive strength was evaluated by acoustic emission method. It was resulted that NiCrAIY/$Al_2O_3$ FGM made by thermal spraying method showed excellent thermal shock resistance and adhesive strength compared to the other lamellar structures of sprayed coatings and that AE is useful tool to evaluate the defect of thermal sprayed coating layer.

• Korean Journal of Materials Research
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• v.11 no.3
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• pp.221-226
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• 2001

The basal slip (0001)1/3<1120 > dislocation velocity in sapphire ($\alpha$-$Al_2$$O_3$) single crystals was measured by four-point bending test. The bending experiment was carried out in the temperature range from 120$0^{\circ}C$ to $1400^{\circ}C$ at various engineering stresses 90MPa, 120MPa, and 150MPa. The velocity of such dislocations was estimated from the bending displacement rate of the four-point bend sample. The dependence of temperature and stress in dislocation velocity was investigated. The activation energy for dislocation velocity was determined to be about 2.2$\pm$0.4eV. In addition, the stress exponent (m) describing the stress dependence of dislocation velocities was in the range of 2.0$\pm$0.2.

• Korean Journal of Materials Research
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• v.2 no.5
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• pp.366-374
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• 1992

Mechanical and impact properties of stitched S2 glass fiber reinforced polyester woven laminates composites have been studied. Laminates were stitched using Kevlar 49 thread with 1/2, 1, and 2 inch stitch spacing. Tensile and 3-point bending tests haute been performed to evaluate the mechanical properties of stitched and unstitched laminates. Impact tests at applied energy of 234.7J were performed to examine the impact behavior and toughness changes of the specimen. The same specimens were also tested repeatedly at low impact energy level of 110.2J for 3 times to evaluate damage tolerance properties. The tensile and 3-point bending test results showed that one inch spacing specimen had the highest tensile and flexural strength. It also showed the highest energy absorption capability and the best damage tolerance property at the repeated impact test. The half inch spacing specimen showed the lowest tensile strength and energy absorption property at the impact energy level of 234.7J, even though it had the highest frequency of stitching thread.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.4
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• pp.17-24
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• 2008

Thermal annealing and electromigration test were performed at $150^{\circ}C$ and $150^{\circ}C,\;5{\times}10^4\;A/cm^2$ conditions, respectively, in order to compare the growth kinetics of intermetallic compound(IMC) in Cu pillar bump. The quantitative interfacial adhesion energy with annealing was measured by using four-point bending strength test in order to assess the effect of IMC growth on the mechanical reliability of Cu pillar bump. Only $Cu_6Sn_5$ was observed in the Cu pillar/Sn interface after reflow. However, $Cu_3Sn$ formed and grew at Cu pillar/$Cu_6Sn_5$ interface with increasing annealing and stressing time. The growth kinetics of total($Cu_6Sn_5+Cu_3Sn$) IMC changed when all Sn phases in Cu pillar bump were exhausted. The complete consumption time of Sn phase in electromigration condition was faster than that in annealing condition. The quantitative interfacial adhesion energy after 24h at $180^{\circ}C$ was $0.28J/m^2$ while it was $3.37J/m^2$ before annealing. Therefore, the growth of IMC seem to strongly affect the mechanical reliability of Cu pillar bump.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.3
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• pp.31-37
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• 2009

Cu-Cu thermo-compression bonding process was successfully developed as functions of the $N_2+H_2$ forming gas annealing conditions before and after bonding step in order to find the low temperature bonding conditions of 3-D integrated technology where the quantitative interfacial adhesion energy was measured by 4-point bending test. While the pre-annealing with $N_2+H_2$ gas below $200^{\circ}C$ is not effective to improve the interfacial adhesion energy at bonding temperature of $300^{\circ}C$, the interfacial adhesion energy increased over 3 times due to post-annealing over $250^{\circ}C$ after bonding at $300^{\circ}C$, which is ascribed to the effective removal of native surface oxide after post-annealing treatment.