• Journal of Industrial Technology
• /
• v.28 no.B
• /
• pp.227-234
• /
• 2008

Reliability predictions for selected electronic parts using 217-Plus have been performed in this study. 217-Plus has recently developed and may be applied for electronics failure prediction as a surrogate of MIL-HDBK-217. We first briefly reviewed 217-Plus component models. Based on three selected components, predictions using both MIL-HDBK-217 and 217-Plus have been made and the results were compared. Even though the comprehensive conclusion may be drawn from extensive component and system level analyses, the results in this study may provide general insights towards reliability through two specifications.

• Journal of Industrial Technology
• /
• v.29 no.A
• /
• pp.27-36
• /
• 2009

Reliability plays a pivotal role in products safety and quality. DoD RIAC recently developed a new reliability prediction methodology, $217Plus^{TM}$, for electronic systems. It officially replaces the well-known MIL-HDBK-217 and is expected to be widely used. Although theoretic study about $217Plus^{TM}$ and its application towards field systems seem to be attractive, it is also desirable to understand the general background of its development. In this paper, we performed a historical review of the arenas related to reliability prediction. Due to the vast of materials, our scope was limited to the development of $217Plus^{TM}$. We first reviewed Rome Laboratory and RIAC. We then explained the development course of reliability methods, MIL-HDBK-217, PRISM, and 217-Plus. This review will form not only a good understanding of the methodology but a basis for future study. We conclude this study with provision of future research areas.

• Journal of Korean Society for Quality Management
• /
• v.39 no.4
• /
• pp.507-515
• /
• 2011

MIL-HDBK-217 has played a pivotal role in reliability prediction of electronic equipments for more than 30 years. Recently, RIAC developed a new methodology $217Plus^{TM}$which officially replaces MIL-HDBK-217. Sensitivity analysis of the 217Plus component models to various parameters has been performed and meaningful observations have been drawn in this study. We first briefly reviewed the $217Plus^{TM}$ methodolog and compared it with the conventional model, MIL-HDBK-217. We then performed sensitivity analysis $217Plus^{TM}$ component models to various parameters. Based on the six parameters and an orthogonal array selected, we have performed indepth analyses concerning parameter effects on the model. Our result indicates that, among various parameters, operating temperature and temperature rise during operation have the most significant impacts on the life of a component, and thus a design robust to high temperature is the most importantly required. Next, year of manufacture, duty cycle, and voltage stress are weaker but may be significant when they are in heavy load conditions. Although our study is restricted to a specific type of diodes, the results are still valid to other cases. The results in this study not only figure out the behavior of the predicted failure rate as a function of parameters but provide meaningful guidelines for practical applications.

• Journal of Applied Reliability
• /
• v.11 no.4
• /
• pp.387-398
• /
• 2011

$217Plus^{TM}$, a newly developed as a surrogate of the MIL-HDBK-217, may be widely applied for reliability predictions of electronic systems. In this study, we performed sensitivity study of the $217Plus^{TM}$ system model to various parameters. Specific attention was put to logistics model and its behavior has been examined in terms of non-component failure causes. We first briefly explained the $217Plus^{TM}$ methodology with system level failure rate evaluation. We then applied experimental designs with several failure causes as factors. We used an orthogonal array with three levels of each parameter. Our results indicate that cannot duplicate, induced, and wear-out causes have dominant effects on the system failures and design, parts, and system management have much less but a little strong effects. The results in this study not only figure out the behavior of the predicted failure rate as functions of failure causes but provide meaningful guidelines for practical applications.

• Journal of Industrial Technology
• /
• v.28 no.B
• /
• pp.215-226
• /
• 2008

MIL-HDBK-217 has widely been used for electronics reliability predictions. Recently, the $217Plus^{TM}$ has been developed by DoD RIAC and may replace MIL-HDBK-217. A overview of the $217Plus^{TM}$ has been performed in this paper. We first reviewed the overall concepts and reliability prediction procedures. We then explained the component models and the system level model with process grading concepts. Bayesian approach incorporating field data into the predicted failure rate is another feature of this methodology.

• Journal of Applied Reliability
• /
• v.17 no.2
• /
• pp.92-102
• /
• 2017

Purpose: Reliability prediction standards consider environmental conditions, such as temperature, humidity and vibration in order to predict the reliability of the electronics components. There are many types of standards, and each standard has a different failure rate prediction model, and requires different environmental conditions. The purpose of this study is to make a sensitivity analysis by changing the temperature which is one of the environmental conditions. By observing the relation between the temperature and the failure rate, we perform the sensitivity analysis for standards including MIL-HDBK-217F, RiAC-HDBK-217Plus and FIDES. Methods: we establish environmental conditions in accordance with maneuver weapon systems's OMS/MP and mission scenarios then predict the reliability using MIL-HDBK-217F, RiAC-HDBK-217Plus and FIDES through the case of DC-DC Converter. Conclusion: Reliability prediction standards show different sensitivities of their failure rates with respect to the changing temperatures.

• Proceedings of the Korean Reliability Society Conference
• /
• 2011.06a
• /
• pp.257-264
• /
• 2011

In this study, we performed sensitivity study of the $217Plus^{TM}$ system model to various parameters. Specific attention was put to logistics model and its behavior has been examined in terms of non-component failure causes. We first briefly explained the $217Plus^{TM}$ methodology with system level failure rate evaluation. We then applied experimental designs with several failure causes as factors. We used an orthogonal array with three levels of each parameter. Our results indicate that cannot duplicate, induced, and wear-out causes have dominant effects on the system failures and design, parts, and system management have much less but a little strong effects. The results in this study not only figure out the behavior of the predicted failure rate as functions of failure causes but provide meaningful guidelines for practical applications.

• Journal of Applied Reliability
• /
• v.11 no.4
• /
• pp.399-407
• /
• 2011

Reliability evaluation of One-Shot system which flies at speed of Mach must be evaluated as the result of many firing tests. But many firing tests are impossible because of budget deficit. Consequently the reliability prediction which substitutes firing tests is used. The accuracy of reliability prediction is decided according to a quantity of accumulated test data. If the test data is insufficient, the direction of prediction can not be set. So we propose the reliability prediction method which applies MIL-HDBK-217 Plus. MIL-HDBK-217 Plus is described about reliability prediction method without sufficient test data. So we apply MIL-HDBK-217 Plus to the rocket motor system, and we accomplish a modeling and a reliability prediction about the system.

• Journal of Applied Reliability
• /
• v.11 no.3
• /
• pp.293-303
• /
• 2011

Reliability Prediction using MIL-HDBK-217F has some restrictions due to its one modeling basis. One of the restrictions is caused by selecting one operating environment of a system, which is chosen regardless of its detailed conditions, e.g., external impact and vibration. Especially, an equipment, which is installed on a mobile vehicle though its movement is quasi-static, is controversial to designate its environment as ground mobile($G_M$), rather than ground fixed($G_F$). In this paper, failure rates were compared, which are computed using several moving time rates to total operating time. RiAC-HDBK-217Plus was used as the basic calculation model. In addition, $G_F$ conditioned failure rate was evaluated by comparing with that under $G_M$ environment but fixed state.

• International Journal of Oral Biology
• /
• v.41 no.4
• /
• pp.217-223
• /
• 2016

Porphyromonas gingivalis, a foremost periodontal pathogen, has been known to cause periodontal diseases. Epidemiologic evidences have indicated the involvement of P. gingivalis in the development of cardiovascular diseases. In this study, we show that the P. gingivalis lipopolysaccharide increases the mRNA expression and protein secretion of interleukin-6 in vascular smooth muscle cells. We demonstrate that P. gingivalis LPS activates the extracellular signal-regulated kinase 1/2 (ERK1/2), p38 mitogen-activated protein kinase (MAPK), and Akt, which mediate the IL-6 expression in vascular smooth muscle cells. Also, P. gingivalis LPS stimulates the vascular smooth muscle cell migration, which is a critical step for the progression of atherosclerosis. Moreover, neutralization of the IL-6 function inhibits the migration of vascular smooth muscle cells induced by P. gingivalis LPS. Taken together, these results indicate that P. gingivalis LPS promotes the expression of IL-6, which in turn increases the migration of vascular smooth muscle cells.