• Food Engineering Progress
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• v.14 no.4
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• pp.354-358
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• 2010

The methods for determining the diffusion parameters for the diffusion of d-limonene, a major volatile compound of orange juice, through a multi-layered food packaging material and predicting its absorption into the packaging material have been investigated. The packaging material used was the 1.5-mm thick multi-layered packaging material composed of high impact polystyrene (HIPS), polyvinylidene chloride (PVDC), and low density polyethylene (LDPE). Orange juice was placed in a cell where volatiles were absorbed in the sample package and kept at $23{\pm}2^{\circ}C$ for 72 hr. The d-limonene absorbed in a 1.5-mm thick multi-layered food packaging material was analyzed by a solid phase micro-extraction (SPME). The absorption parameters for the absorption of d-limonene in the packaging material were determined and absorption of d-limonene into the packaging material was predicted using absorption storage data. The SPME desorption at $60^{\circ}C$ for 1 hr resulted in the most sensitive and reproducible results. The diffusion coefficients of d-limonene in the packaging material and the partition coefficient at $23{\pm}2^{\circ}C$ were approximately $1-2{\times}10^{12}m^2$/s and 0.03, respectively. The absorption profile no earlier than 30 hr was fit well by a model derived from the Fick's law.

• Journal of the Microelectronics and Packaging Society
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• v.31 no.2
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• pp.16-22
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• 2024

With advances of artificial intelligence (AI) technology, the demand is increasing for high-end semiconductors in various places such as data centers. In order to improve the performance of semiconductors, reducing the pitch of patterns and increasing density of I/Os are required. For this issue, 2.5dimension(D) packaging is gaining attention as a promising solution. The core technologies used in 2.5D packaging include microbump, interposer, and bridge die. These technologies enable the implementation of a larger number of I/Os than conventional methods, enabling a large amount of information to be transmitted and received simultaneously. This paper proposes the Molded Bridge die on Substrate (MBoS) process technology, which combines molding and Redistribution Layer (RDL) processes. The proposed MBoS technology is expected to contribute to the popularization of next-generation packaging technology due to its easy adaption and wide application areas.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.4
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• pp.1-8
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• 2022

High-density packaging technologies, including Through-Si-Via (TSV) technologies, are considered important in many fields such as IoT (internet of things), 6G/5G (generation) communication, and high-performance computing (HPC). Achieving high integration in two dimensional packaging has confronted with physical limitations, and hence various studies have been performed for the three-dimensional (3D) packaging technologies. In this review, we described about the causes and effects of scallop formation in TSV, the scallop-free etching technique for creating smooth sidewalls, Cu pillar and Cu-SiO₂ hybrid bonding in TSV. These technologies are expected to have effects on the formation of high-quality TSVs and the development of 3D packaging technologies.

• Journal of the Semiconductor & Display Technology
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• v.22 no.4
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• pp.38-47
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• 2023

Three dimensional (3D) packaging is a next-generation packaging technology that vertically stacks chips such as memory devices. The necessity of 3D packaging is driven by the increasing demand for smaller, high-performance electronic devices (HPC, AI, HBM). Also, it facilitates innovative applications across another fields. With growing demand for high-performance devices, companies of semiconductor fields are trying advanced packaging techniques, including 2.5D and 3D packaging, MR-MUF, and hybrid bonding. These techniques are essential for achieving higher chip integration, but challenges in mass production and fine-pitch bump connectivity persist. Advanced bonding technologies are important for advancing the semiconductor industry. In this review, it was described 3D packaging technologies for chip integration including mass reflow, thermal compression bonding, laser assisted bonding, hybrid bonding.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.1
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• pp.39-44
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• 2008

In this paper, fully embedded 2.4GHz WLAN band pass filter (BPF) was investigated into a multi-layered organic packaging substrate using high Q spiral stacked inductors and high Dk MIM capacitors for low cost RF System on Package (SOP) applications. The proposed 2.4GHz WLAN BPF was designed by modifying chebyshev second order filter circuit topology. It was comprised of two parallel LC resonators for obtaining two transmission zeros. It was designed by using 2D circuit and 3D EM simulators for finding out optimal geometries and verifying their applicability. It exhibited an insertion loss of max -1.7dB and return loss of min -l7dB. The two transmission zeros were observed at 1.85 and 6.7GHz, respectively. In the low frequency band of $1.8GHz{\sim}1.9GHz$, the stop band suppression of min -23dB was achieved. In the high frequency band of $4.1GHz{\sim}5.4GHz$, the stop band suppression of min -l8dB was obtained. It was the first embedded and the smallest one of the filters formed into the organic packaging substrate. It has a size of $2.2{\times}1.8{\times}0.77mm^3$.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.2
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• pp.53-57
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• 2014

Thin glass (< 100 microns) is a promising material from which advanced interposers for high density electrical interconnects for 2.5D chip packaging can be produced. But thin glass is extremely brittle, so mechanical micromachining to create through glass vias (TGVs) is particularly challenging. In this article we show how laser processing using deep UV excimer lasers at a wavelength of 193 nm provides a viable solution capable of drilling dense patterns of TGVs with high hole counts. Based on mask illumination, this method supports parallel drilling of up over 1,000 through vias in 30 to $100{\mu}m$ thin glass sheets. (We also briefly discuss that ultrafast lasers are an excellent alternative for laser drilling of TGVs at lower pattern densities.) We present data showing that this process can deliver the requisite hole quality and can readily achieve future-proof TGV diameters as small $10{\mu}m$ together with a corresponding reduction in pitch size.

• Journal of the Microelectronics and Packaging Society
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• v.9 no.1
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• pp.1-7
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• 2002

The purpose of this work is to develop High-Frequency Active Filter and super-miniaturation technology(SMD Type) of Filter which are essential for the key R/F Microwave components in the Mobile telecommunication system. The cut-off frequency of high frequency active filter for multimedia is 2.5 MHz, the gain is 0.5dB at 100 kHz, the passband ripple is 1.2 dB max at 100 kHz~2.0 kHz, GDT is 60 nsec at 100 kHz-2.0 MHz, the attenuation is 40 dB min at 3.75 MHz.

• Food Science of Animal Resources
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• v.35 no.2
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• pp.248-257
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• 2015

Effects of double packaging (combinational use of aerobic and vacuum conditions) and antioxidants on physicochemical properties in irradiated restructured chicken rolls were determined. Chicken breast treated with antioxidants (none, sesamol+a-tocopherol) was used to process restructured chicken breast rolls. The sliced rolls were vacuum, aerobic, or double packaged (vacuum for 7 d then aerobic for 3 d) and electron beam irradiated at 2.5 kGy. Color, 2-thiobarbituric acid reactive substances (TBARS), oxidation reduction potentials (ORP), and volatile profiles of the samples were determined at 0 and 10 d. Irradiation made restructured chicken rolls redder (p<0.05), and the increased redness was more distinct in irradiated vacuum-packaged than irradiated aerobic or double packaged meats. TBARS values of antioxidant-treated double packaged rolls were lower than even nonirradiated vacuum-packaged meat, and those were distinct at 10 d (p<0.05). ORP and lipid oxidation values were lower in irradiated vacuum and double packaged samples than those in irradiated aerobic packaged ones at 0 d (p<0.05). Irradiation of restructured chicken rolls increased the amount of total volatiles. Considerable amounts of off-odor volatiles were reduced or not detected by double packaging and antioxidant treatment at 10 d. Therefore, the combined use of antioxidants and double packaging would be useful to reduce redness and control the oxidative quality changes of irradiated restructured chicken rolls

• Proceedings of the KIEE Conference
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• 2009.07a
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• pp.1587_1588
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• 2009

In this paper, PCB embedded balanced-to-unbalamced duplexer using coupled LC resonator was introduced for low cost dualband WiMax front-end-module application. In order to obtain the function of bandpass filter and balun transformer, proposed duplexer was configured by using magnetically coupled LC resonator. Out-of-band suppression was enhanced by applying two m-Derived transform circuits to obtain transmission zeros at 2GHz and 4.8GHz. In order to reduce the size of embedded duplexer, BaSrTiO3 (BST) composite high Dk RCC film was applied to improve the capacitance density. This high Dk film provided the capacitance density of 12.2 pF/mm2. The simulation results shows that fabricated duplexer had an insertion loss of 2.9dB and 5.5dB and return loss of 15dB and 16dB for 2.5GHz~2.6GHz and 3.5GHz~3.6GHz, respectively. The maximum magnitude and phase imbalance were 0.01dB and 0.17dB, and 1degree and 2degree in its passband, respectively. The out-of-band suppression was observed approximately 29dB and 40dB below 1.9GHz and over 4.5GHz, respectively. It has a volume of 6 mm $\times$ 7 mm $\times$ 0.7 mm (height).

• Journal of the Korean Institute of Telematics and Electronics D
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• v.34D no.2
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• pp.1-9
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• 1997

For the reduction of parasitic inductance and matching of bonding wire in the package of microwave devices, we propose multiple bonding wires buried in a dielectric material of FR-4 composite. This structure is analyzed using the method of moments (MoM) and compared with the common bondwires and ribbon interconnections. The FR-4 composite is modelled by the cole-cole model which can consider the loss and the variation of the permittivity in a frequency. At 20 GHz, the parasitic reactance is reduced by 90%, 80%, 60% compared to those of a single bonding wire in air, double bonding wires in air and ribbon interconnection in air, respectively. Also, the new bondwire shows very good matching of 60.ohm characteristic impedance and has 15dB, 10dB, 5dB improvement of the return loss and 2.5dB, 0.7dB, 0.2dB improvement of the insertion loss compared to the common interconnections. This technique can minimize the parasitic effect of bondwires in microwave device packaging.