• Title/Summary/Keyword: 2,4-D and GA$_3$

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A Ku-band 3 Watt PHEMT MMIC Power Amplifier for satellite communication applications (위성 통신 응용을 위한 Ku-대역 3 Watt PHEMT MMIC 전력 증폭기)

  • Uhm, Won-Young;Lim, Byeong-Ok;Kim, Sung-Chan
    • Journal of IKEEE
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    • v.24 no.4
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    • pp.1093-1097
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    • 2020
  • This work describes the design and characterization of a Ku-band monolithic microwave integrated circuit (MMIC) power amplifier (PA) for satellite communication applications. The device technology used relies on 0.25 ㎛ gate length gallium arsenide (GaAs) pseudomorphic high electron mobility transistor (PHEMT) of wireless information networking (WIN) semiconductor foundry. The developed Ku-band PHEMT MMIC power amplifier has a small-signal gain of 22.2~23.1 dB and saturated output power of 34.8~35.4 dBm over the entire band of 13.75 to 14.5 GHz. Maximum saturated output power is a 35.4 dBm (3.47 W) at 13.75 GHz. Its power added efficiency (PAE) is 30.6~37.83% and the chip dimensions are 4.4 mm×1.9 mm. The developed 3 W PHEMT MMIC power amplifier is expected to be applied in a variety of Ku-band satellite communication applications.

Spatial variation in quality of Ga2O3 single crystal grown by edge-defined film-fed growth method (EFG 방법으로 성장한 β-Ga2O3 단결정의 영역별 품질 분석)

  • Park, Su-Bin;Je, Tae-Wan;Jang, Hui-Yeon;Choi, Su-Min;Park, Mi-Seon;Jang, Yeon-Suk;Moon, Yoon-Gon;Kang, Jin-Ki;Lee, Won-Jae
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.32 no.4
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    • pp.121-127
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    • 2022
  • β-Gallium oxide (Ga2O3), an ultra-wide bandgap semiconductor, has attracted great attention due to its promising applications for high voltage power devices. The most stable phase among five different polytypes, β-Ga2O3 has the wider bandgap of 4.9 eV and higher breakdown electric field of 8 MV/cm. Furthermore, it can be grown from melt source, implying higher growth rate and lower fabrication cost than other wide bandgap semiconductors such as SiC, GaN and diamond for the power device applications. In this study, β-Ga2O3 bulk crystals were grown by the edge-defined film-fed growth (EFG) process. The growth direction and the principal surface were set to be the [010] direction and the (100) plane of the β-Ga2O3 crystal, respectively. The spectra measured by Raman an alysis could exhibit the crystal phase an d impurity dopin g in the β-Ga2O3 ingot, and the crystallinity quality and crystal direction were analyzed using high-resolution X-ray diffraction (HRXRD). The crystal quality and various properties of as-grown β-Ga2O3 ribbon was systematically analyzed in order to investigate the spatial variation in entire crystal grown by EFG method.

Effect of GA3 Treatment on the Flowering in Tuber of Zantedeschia 'Black Magic' (GA3 처리가 유색칼라 괴경의 개화에 미치는 영향)

  • Park, Nou-Bog;Lim, Hoe-Chun
    • Journal of Practical Agriculture & Fisheries Research
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    • v.7 no.1
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    • pp.90-96
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    • 2005
  • Tubers(4-5cm diameter) of Zantedeschia 'Black Magic' were used to study the induction of flowering in GA3 soaking times and concentration. The GA3 soaking were 10 seconds and 30 minutes at the GA3 concentrations of 50, 100, 250, and 500 mg·L1. The time to emergence in GA3 treatment were 1.1~4.0 days shorter than control Growth characteristics were good in GA3 treatment but that was no significance in GA3 soaking time and concentration. When GA3 soaking time and concentration were increased, days to flowering was shorter, but flower stalk length, flower stalk width, flower length, flower width were no difference. The number of flower per tuber was most as 4.0~4.3 in 250~500 mg·L1 GA3 concentration and that was about 2 times compared to control. The normal flower ratio and bulb enlargement were similar compared with GA3 soaking time and concentration. GA3 250~500 mg·L1 treatment is necessary for improvement of number of flowers per bulb.

MMIC Cascade VCO with Low Phase Noise in InGaP/GaAs HBT Process for Ku-Band Application

  • Shrestha Bhanu;Lee Jae-Young;Lee Jeiyoung;Cheon Sang-Hoon;Kim Nam-Young
    • Journal of electromagnetic engineering and science
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    • v.4 no.4
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    • pp.156-161
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    • 2004
  • The MMIC cascode VCO is designed, fabricated, and measured for Ku-band Low Noise Blcok(LNB) system using InGaP/GaAs HBT technology. The phase noise of -116.4 dBc/Hz at 1 MHz offset with output power of 1.3 dBm is obtained at 11.526 GHz by applying 3 V and 11 mA, which is comparatively better characteristics than compared with the different configuration VCOs fabricated with other technologies. The simulated results of oscillation frequency and second harmonic suppression agree with the measured results. The phase noise is improved due to the use of the smallest value of inductor in frequency determining network and the InGaP ledge function of the technology. The chip size of $830\time781\;{\mu}m^2$ is also achieved.

DRY ETCHING CHARACTERISTICS OF INGAN USING INDUCTIVELY COUPLED $Cl_2/CHF_3,{\;}Cl_2/CH_4$ AND Cl_2/Ar PLASMAS.

  • Lee, D.H.;Kim, H.S.;G.Y. Yeom;Lee, J.W.;Kim, T.I.
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 1999.10a
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    • pp.59-59
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    • 1999
  • In this study, planer inductively coupled $Cl_2$ based plasmas were used to etch InGaN and the effects of plasma conditions on the InGaN etch properties have been characterized using quadrupole mass spectrometry(QMS) and optical emission spectroscopy(OES). As process conditions used to study the effects of plasma characteristics on the InGaN etch properties, $Cl_2$ was used as the main etch gas and $CHF_3,{\;}CH_4$, and Ar were used as additive gases. Operational pressure was varied from SmTorr to 3OmTorr, inductive power and bias voltage were varied from 400W to 800W and -50V to -250V, respectively while the substrate temperature was fixed at 50 centigrade. For the $Cl_2$ plasmas, selective etching of GaN to InGaN was obtained regardless of plasma conditions. The small addition of $CHF_3$ or Ar to $Cl_2$ and the decrease of pressure generally increased InGaN etch rates. The selective etching of InGaN to GaN could be obtained by the reduction of pressure to l5mTorr in $CI_2/IO%CHF_3{\;}or{\;}CI_2/IO%Ar$ plasma. The enhancement of InGaN etch rates was related to the ion bombardment for $CI_2/Ar$ plasmas and the formation of $CH_x$ radicals for $CI_2/CHF_3(CH_4)$ plasmas.

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Electrical Characterization of Lateral NiO/Ga2O3 FETs with Heterojunction Gate Structure (이종접합 Gate 구조를 갖는 수평형 NiO/Ga2O3 FET의 전기적 특성 연구)

  • Geon-Hee Lee;Soo-Young Moon;Hyung-Jin Lee;Myeong-Cheol Shin;Ye-Jin Kim;Ga-Yeon Jeon;Jong-Min Oh;Weon-Ho Shin;Min-Kyung Kim;Cheol-Hwan Park;Sang-Mo Koo
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.36 no.4
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    • pp.413-417
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    • 2023
  • Gallium Oxide (Ga2O3) is preferred as a material for next generation power semiconductors. The Ga2O3 should solve the disadvantages of low thermal resistance characteristics and difficulty in forming an inversion layer through p-type ion implantation. However, Ga2O3 is difficult to inject p-type ions, so it is being studied in a heterojunction structure using p-type oxides, such as NiO, SnO, and Cu2O. Research the lateral-type FET structure of NiO/Ga2O3 heterojunction under the Gate contact using the Sentaurus TCAD simulation. At this time, the VG-ID and VD-ID curves were identified by the thickness of the Epi-region (channel) and the doping concentration of NiO of 1×1017 to 1×1019 cm-3. The increase in Epi region thickness has a lower threshold voltage from -4.4 V to -9.3 V at ID = 1×10-8 mA/mm, as current does not flow only when the depletion of the PN junction extends to the Epi/Sub interface. As an increase of NiO doping concentration, increases the depletion area in Ga2O3 region and a high electric field distribution on PN junction, and thus the breakdown voltage increases from 512 V to 636 V at ID =1×10-3 A/mm.

Fabrication and Measurement of Optical Waveguide using Multi Quantum Well Intermixing (다중양자우물구조의 상호섞임을 이용한 광도파로의 제작 및 측정)

  • Yeo, Deok-Ho;Yoon, Kyung-Hun;Kim, Sung-June
    • Journal of the Korean Institute of Telematics and Electronics D
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    • v.36D no.7
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    • pp.50-55
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    • 1999
  • We have fabricated optical waveguide which utilizes intermixing of InGaAs/InGaAsP multi quantum well separate confinement heterostructure. The waveguide was fabricated by reactive ion etching technique using $CH_4/H_2$ gas mixture, and the width and depth of the waveguide ware $5{\mu}m$ and $1.2{\mu}m$, respectively. The propagation loss of the waveguide was measured by Fabry-Perot interference phenomena using tunable laser. For the waveguide after $800^{\circ}C$, 30s heat treatment, the measured loss was 3.76dB/cm and 3.95dB/cm for TE and TM mode, respectively. This value is very small compared to other waveguide made by IFVD technique. Hence, this technique can applied to integration of waveguide and electronic devices.

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Design of MMIC Variable Gain LNA Using Behavioral Model for Wireless LAM Applications (거동모델을 이용한 무선랜용 MMIC 가변이득 저잡음 증폭기 설계)

  • Park, Hun;Yoon, Kyung-Sik;Hwang, In-Gab
    • The Journal of Korean Institute of Communications and Information Sciences
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    • v.29 no.6A
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    • pp.697-704
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    • 2004
  • This paper describes the design and fabrication of an MMIC variable gain LNA for 5GHz wireless LAN applications, using 0.5${\mu}{\textrm}{m}$ gate length GaAs MESFET transistors. The advantages of high gain and low noise performance of E-MESFETS and excellent linear performance of D-MESFETS are combined as a cascode topology in this design. Behavioral model equations are derived from the MESFET nonlinear current voltage characteristics by using Turlington's asymptote method in a cascode configuration. Using the behavioral model equations, a 4${\times}$50${\mu}{\textrm}{m}$ E-MESFET as a common source amplifier and a 2${\times}$50${\mu}{\textrm}{m}$ D-MESFET as a common gate amplifier are determined for the cascode amplifier. The fabricated variable gain LNA shows a noise figure of 2.4dB, variable gain range of more than 17dB, IIP3 of -4.8dBm at 4.9GHz, and power consumption of 12.8mW.

A Low Power GaAs MMIC Multi-Function Chip for an X-Band Active Phased Array Radar System (X-대역 능동 위상 배열 레이더시스템용 저전력 GaAs MMIC 다기능 칩)

  • Jeong, Jin-Cheol;Shin, Dong-Hwan;Ju, In-Kwon;Yom, In-Bok
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.25 no.5
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    • pp.504-514
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    • 2014
  • An MMIC multi-function chip with a low DC power consumption for an X-band active phased array radar system has been designed and fabricated using a 0.5 ${\mu}m$ GaAs p-HEMT commercial process. The multi-function chip provides several functions: 6-bit phase shifting, 6-bit attenuation, transmit/receive switching, and signal amplification. The fabricated multi-function chip with a compact size of $16mm^2(4mm{\times}4mm)$ exhibits a gain of 10 dB and a P1dB of 14 dBm from 7 GHz to 11 GHz with a DC low power consumption of only 0.6 W. The RMS(Root Mean Square) errors for the 64 states of the 6-bit phase shift and attenuation were measured to $3^{\circ}$ and 0.6 dB, respectively over the frequency.

On the Crystal Growth of Gap by Synthesis Solute Diffusion Method and Electroluminescence Properties. (합성용질확산법에 의한 GaP결정의 성장과 전기루미네센스 특성)

  • Kim, Seon-Tae;Mun, Dong-Chan
    • Korean Journal of Materials Research
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    • v.3 no.2
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    • pp.121-130
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    • 1993
  • The GaP crystals were grown by synthesis solute diffusion method and its properties were investigated. High quality single crystals were obtained by pull-down the crystal growing ampoule with velocity of 1.75mm/day. Etch pits density along vertical direction of ingot was increased from 3.8 ${\times}{10^4}$c$m^{-2}$ of the first freeze to 2.3 ${\times}{10^5}$c$m^2$ of the last freeze part. The carrier concentration and mobilities at room temperature were measured to 197.49cc$m^2$/V.sec and 6.75 ${\times}{10^{15}}$c$m^{-3]$, respectively. The temperature dependence of optical energy gap was empirically fitted to $E_g$(T)=[2.3383-(6.082${\times}{10^{-4}}$)$T^2$/(373. 096+TJeV. Photoluminescence spectra measured at low temperature were consist with sharp line-spectra near band-gap energy due to bound-exciton and phonon participation in band edge recombination process. Zn-diffusion depth in GaP was increased with square root of diffusion time and temperature dependence of diffusion coefficient was D(Tl = 3.2 ${\times}{10^3}$exp( - 3.486/$k_{\theta}$T)c$m^2$/sec. Electroluminescence spectra of p-n GaP homojunction diode are consisted with emission at 630nm due to recombination of donor in Zn-O complex center with shallow acceptors and near band edge emission at 550nm. Photon emission at current injection level of lower than 100m A was due to the band-filling mechanism.

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