• Transactions of the Korean Society of Mechanical Engineers B
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• v.40 no.5
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• pp.339-345
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• 2016

In this study, we numerically investigate the thermal performance of an enhanced radial heat sink with a perforation and chimney structure. We estimate the thermal performance of the enhanced radial heat sink, and compared it with that of a conventional radial heat sink. The results show that the radial heat sink with perforation has a higher thermal performance when either of the diameter and the number of perforations is high. With regards to the radial heat sink with a chimney structure, we investigate primarily the effect of the fin number, and the spacing between the chimney and the base plate on the thermal performance. The results show that there are optimal values for the fin number and the spacing between chimney and base plate. In addition, the enhanced radial heat sinks have maximum thermal performance when facing upward ($0^{\circ}$), while it has worst performance when facing sideward ($90^{\circ}$). The perforation and chimney are shown to cause thermal performance enhancements of 17% and 20%, respectively, compared with a conventional radial heat sink. The proposed method is useful for starting business, and is useful in terms of venture and entrepreneurship.

• Proceedings of the KAIS Fall Conference
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• 2012.05b
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• pp.680-684
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• 2012

본 연구는 히트싱크의 효율적인 설계를 위하여 히트싱크 휜의 형상을 변화시켜 냉각성능에 대한 연구를 수행하였다. 휜의 형상을 Vertical, Round, S-Curve, Triangle의 네 가지와 휜의 개수를 16개와 64개로 설계해, 총 8가지로 설계 및 해석 하였다. 이와 같이 설계된 히트싱크는 Fluent 6.3.26 으로 수치해석 하였고, 해석 결과 약간의 형상을 변경하는 것 보다는 휜의 개수를 늘리는 것이 냉각성능을 높이는데 더 효과적인 것으로 드러났다. 히트싱크의 온도분포와 열전달계수에 대한 수치해석을 통해 휜의 개수가 64개이고 S-Curve의 형태에서 냉각성능이 가장 우수한 것으로 나타났다.

• Proceedings of the KIEE Conference
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• 2005.07c
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• pp.1980-1982
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• 2005

Power MOSFET의 구동시에는 많은 열이 발생하게 된다. 이때 발생하는 열은 소자의 특성이나 수명에 영향을 주어 오동작을 하게되는 원인이 되기도 한다. 일반적으로 열이 많이 발생하는 chip이나 개별소자의 경우 히트싱크를 부착하여 사용하게 된다. 본 논문에서는 열을 방출시키기 위해 사용되는 히트싱크에 의한 열 전달(Thermal Transient) 특성의 변화 및 히트싱크의 부착에 이용되는 히트싱크 컴파운드(heat sink compound)에 의한 열 전달 특성에 미치는 영향 등을 실험을 통하여 분석하였고, 이를 기술하였다.

• Korean Journal of Optics and Photonics
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• v.25 no.6
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• pp.311-314
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• 2014

In this paper, we design a helical fin structure for the heat sink for a high-power LED lighting module, and analyze its thermal properties. By means of the helical fin structure, we can obtain about 14% larger surface area for the limited volume and it can decrease the LED chip temperature by about 12%. Because this helical fin heat sink has 15% less total volume than a conventional one, we can also expect to reduce the production cost due to these structural properties.

• Journal of Advanced Marine Engineering and Technology
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• v.39 no.6
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• pp.586-591
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• 2015

This study discusses numerically-explored thermal performances of hybrid fin heat sinks (HF HSs) for lightweight thermal management of LED modules under natural convection. A hollow hybrid fin heat sink (HHF HS) and a solid hybrid fin heat sink (SHF HS) are proposed as HF HSs. A 3-D CFD analysis has been carefully conducted to obtain reliable numerical results. The 3-D CFD study investigates the effects of both fin spacing and an internal channel diameter on performances of the HHF HS and the SHF HS. The study results show that the mass-based thermal resistance of the HHF HS is 20~32% smaller compared with the pin fin heat sink (PF HS). The results also show that the mass-based thermal resistance of the HHF HS decreases with the increase of the channel diameter. These results are mainly due to coupled effects of the mass reduction and heat pumping through an internal channel. Considerably superior mass-based thermal performances of the HHF HS to the conventional PF HS suggest the feasible application for the lightweight thermal management of the LED modules under natural convection.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.13 no.5
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• pp.2002-2008
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• 2012

In recent years, while the importance of thermal management has been emphasized due to smaller electronic products, various materials have been used as heat sink. In this study, porous ceramic heat sink was developed with SiC, successfully separated from the slurry of SiC occurring in solar energy materials industry and the thermal performance of porous SiC heat sink has been compared with those of aluminum heat sink and pure SiC heat sink through experiment. From the experimental results, it was verified that porous recycled SiC heat sink has better thermal performance than aluminum heat sink since its micropores increase the heat transfer area. In addition, the effect of the micropores on thermal performance has been quantified by increasing convective heat transfer coefficient with numerical analysis.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.16 no.2
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• pp.947-951
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• 2015

The objective of this study is to numerically investigate the cooling characteristics of the heat sink as a cooling device for the amplifier. In order to analyze the heat transfer performances of the heat sink, the steady-state thermal model of the ANSYS software was used and analyzed with the fin thickness, fin pitch and fin number of the heat sink. As a result, the temperature at the junction of heat sink was decreased with the increase of fin thickness and fin number. In addition, the thermal resistances of the heat sinks were enhanced from $0.764^{\circ}C/W$ to $0.739^{\circ}C/W$ and $1.254^{\circ}C/W$ to $0.610^{\circ}C/W$, respectively, with the increase of the fin thickness from 1 mm to 3 mm and fin number from 9 to 20, respectively.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.10 no.7
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• pp.1459-1464
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• 2009

Recently demand for large-capacity aluminum heat sinks has been increased as market for high power electricity expands and high-performance electronic products develop. While the brazed heat sinks are in particular preferred, it is almost impossible to manufacture them with an atmospheric continuous furnace due to insufficient heating rate and various thickness of the parent metals. Therefore, a new index batch furnace is developed and the process variables are optimized. Then, brazing efficiency and tensile stress are obtained for brazed parts of the heat sinks. Finally experiment as well as numerical analysis has been performed to compare thermal efficiency of the brazed heat sinks with that of the silicone-bonded heat sinks.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.13 no.10
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• pp.4398-4404
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• 2012

This thesis was conducted a numerical analysis on the radiant heat performance according to factors of design of heat sink for cooling of the automotive LED head lamp. The heat sinks were designed with 5 different types to fit the limited internal space by formula based on an existing product (Type 1). Designed heat sinks of five types were analyzed by ANSYS CFD V12.1, and the analysis results were compared with the existing type. The results of simulation were analyzed temperature distribution and average temperature, air flow characteristic, heat flux etc. This thesis was researched on the correlation of the cooling performance according to the heat sink structure and the fin shape. Through numerical analysis, could be confirmed heat sink Type 2 as the best results.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.9
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• pp.5467-5473
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• 2014

This study examined the numerical analysis results with respect to the thermal behavior of a natural convection cooled pin-fin heat sink. The heat sink consisted of pin fins integrated with plate fins. The heat sinks were designed with two different types to fit the limited internal space. The two types of heat sinks designed were analyzed using the ANSYS software package, and the numerical analysis results were compared with the cooling performance of the two types of heat sinks. The results of the simulation were analyzed according to the temperature distribution and air flow characteristics, heat flux etc. This study examined the correlation of the cooling performance with the heat sink internal structure and fin shape. FEM (Finite Element Method) confirmed the cooling performance of heat sink type A under natural convection conditions as the best results. The results of the numerical simulation showed that the heat sink type A shape showed an approximately 70 percent better heat transfer rate with natural convection than that of type B.