• Title/Summary/Keyword: 히트싱크

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An Experimental Study on Cooling Characteristic according to Fin Array of Aluminum Heat Sink (히트싱크의 핀 배열에 따른 냉각특성에 관한 실험적 연구)

  • Yoon, Sung-Un;Kim, Jae-Yeol;Gao, Jia-Chen
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.17 no.1
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    • pp.138-143
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    • 2018
  • In general, the operating temperature of electronic equipment is closely related to product life and reliability, and it is recognized that effectively cooling the parts is an important problem. In this paper, an experimental study on the cooling characteristic according to the pin array of the heat sink is conducted. The experiment on the heat sink was based on the natural convection and temperature distribution changes. The experimental results indicate that the pin array of the heat sink has an effect on the thermoelectric module's cooling characteristic.

Thermal Design of PCR Chip for LOC (랩온어칩을 위한 중합효소 연쇄반응 칩의 열설계)

  • Kim, Deok-Jong;Kim, Jae-Yun;Park, Sang-Jin;Heo, Pil-U;Yun, Ui-Su
    • 연구논문집
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    • s.33
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    • pp.17-25
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    • 2003
  • In this work, thermal design of a PCR chip for LOC is systematically conducted. From the numerical simulation of a PCR chip based on the finite volume method, how to control the average temperature of a PCR chip and the temperature difference between the denaturation zone and the annealing zone is presented. The average temperature is shown to be controlled by adjusting heat input and a cooler as well as a heater is shown to be necessary to obtain three individual temperature zones for polymerase chain reaction. To reduce the time required, a heat sink for the cooler is not included in the calculation domain for the PCR chip and heat sink design is conducted separately by using a compact modeling method, the porous medium approach.

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Thermal Distribution Modeling of IGBT with heatsink areas (히트싱크 면적에 따른 IGBT의 열 분포 모델링)

  • Ryu, Se-Hwan;Hong, Jong-Kyoung;Won, Chang-Sub;Ahn, Hyung-Keun;Han, Deuk-Young
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.06a
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    • pp.30-31
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    • 2008
  • As the power density and switching frequency increase, thermal analysis of power electronics system becomes imperative. The analysis provides valuable information on the semiconductor rating, long-term reliability. In this paper, thermal distribution of the Non Punchthroug(NPT) Insulated Gate Bipolar Transistor with heatsink areas has been studied. For analysis of thermal distribution, we obtained results by using finite element simulator, ANSYS and compared with experimental data by thermocam.

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Numerical analysis study of an optimal cooling system for desktop PC CPUs (데스크탑 PC용 CPU 냉각 시스템 최적화를 위한 수치해석 연구)

  • Choi, Jee-Hoon;Yoo, Jung-Hyun;Seo, Min-Whan;Kang, Shin-Jae;Kim, Chul-Ju
    • Proceedings of the KSME Conference
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    • 2008.11b
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    • pp.2298-2303
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    • 2008
  • The increasing demands for the recently released CPU which has had higher heat density, the confined space of desktop PCs, and so on are the main drive for continuously improving PC cooling systems. In order to meet number of demands, this paper describes the flow and thermal behavior of the heat sink combined with heat pipes, and a fan through the numerical analysis by using the computational fluid dynamics(CFD) code and discusses how to extend the cooling capability.

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Thermal Analysis of Heat Sink Models using CFD simulation (CFD를 이용한 히트싱크의 열 해석)

  • Lim, Song-Chul;Lee, Myung-Ho;Kang, Kae-Myung
    • Korean Journal of Materials Research
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    • v.15 no.12
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    • pp.829-832
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    • 2005
  • Thermal analysis of new designed heat-sink models was carried out according to the natural ana the forced convection using computational fluid dynamics(CFD). Heat resistance of wave type, top vented wave type and plate type of heat sink was compared with each other As the direction of fin and air flow are vertical(z-axis), it is shown that radiant heat performance of all of heat sinks was superior than other experimental conditions. Especially, the heat resistance of top vented wave heat sink was $0.17^{\circ}C/W$(forced convection) and $0.48^{\circ}C/W$(natural convection). The radiant heat performance of heat sink was increased with increasing the height of fin and the width of fin pitch.

Design of Continuous-flow Micro-PCR System (연속류형 Micro-PCR 시스템의 설계)

  • Kim, Duck-Jong;Kim, Jae-Yun;Park, Sang-Jin;Heo, Pil-Woo;Yoon, Eui-Soo
    • 유체기계공업학회:학술대회논문집
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    • 2003.12a
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    • pp.115-120
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    • 2003
  • In this work, a continuous-flow micro-PCR system is systematically designed. From the numerical simulation based on the finite volume method, adapting oneself to a new environmental temperature without an external temperature controller is shown to be possible and a cooler as well as a heater is shown to be necessary to obtain three individual temperature zones for polymerase chain reaction. In addition, appropriate geometry of a heat sink for the cooler is determined by using a compact modeling method, the porous medium approach.

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Control Algorithm of Bidirectional-LDC Integral Onborad Battery Changing System for EVs/PHEVs (EVs/PHEVs용 Bidirectional-LDC 일체형 Onboard Battery 충전시스템 제어알고리즘)

  • Kim, Yun-Sung;Oh, Chang-Yeol;Sung, Won-Yong;Lee, Byoung-Kuk
    • Proceedings of the KIPE Conference
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    • 2012.07a
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    • pp.596-597
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    • 2012
  • 본 논문은 EVs/PHEVs에 사용되는 Bidirectional-LDC 일체형 OBC의 회로구조 및 동작특성 분석결과를 보고한다. 설계된 OBC는 한 개의 트랜스포머와 히트싱크를 LDC 회로와 공유하며, OBC의 출력 측 브릿지 방식의 정류회로는 LDC 동작 시 양방향 운용이 가능하다. 논문에서는 배터리 충전 조건에 따른 적합한 동작모드 제어 알고리즘을 분석하고 검증을 위한 프로토타입의 시험결과를 보고한다.

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Analyzing the characteristics of Thermal Transient on MOSFET depending on Heat Sink surface area (히트싱크 크기에 따른 MOSFET의 열전달 특성변화 분석)

  • Kim, Ki-Hyun;Seo, Kil-Soo;Kim, Hyoung-Woo;Kim, Sang-Choel;Bahng, Wook;Kang, In-Ho
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2005.07a
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    • pp.170-171
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    • 2005
  • Generally when Power MOSFET is operated, a heat sink is attached to it to emit heat caused by the operation. As the surface area of a heat sink is smaller, the thermal impedance is larger, which causes a negative influence on the characteristics of the chips and the devices and shortens the lifespan of them. In this experiment, we've compared and analysed different effects of heat sinks with 5 different surface areas on the characteristics of Thermal Transient when they are applied respectively.

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Thermal Characteristics and Heatsink Modeling. for IGBT (IGBT의 열 특성 및 히트싱크 모델링)

  • Ryu, Se-Hwan;Bea, Kyung-Kuk;Shin, Ho-Chul;Ahn, Hyung-Keun;Han, Deuk-Young
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2007.06a
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    • pp.172-173
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    • 2007
  • As the power density and switching frequency increase, thermal analysis of power electronics system becomes imperative. The thermal analysis provides valuable information on the semiconductor rating, long-term reliability. In this paper, thermal distribution of the Non Punchthrough(NPT) Insulated Gate Bipolar Transistor has been studied. For analysis of thermal distribution, we obtained experimental and simulation results by using finite element simulator, Ansys and by using photographic infrared thermometer, we compared experimental date with simulation result. and got good agreement. Also this paper provided thermal distribution of IGBT connected to heat sinks. and this results will be good information to design optimal heat sink for IGBT.

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Investigation of the Optimal Cooling Performance Using Peltier Module and Heat Sink (펠티에 소자 및 히트싱크를 이용한 최적 냉각성능에 관한 연구)

  • Lee, Dong-Ryul
    • Journal of Power System Engineering
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    • v.10 no.4
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    • pp.65-70
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    • 2006
  • This study is to experimentally evaluate the cooling performance of the Bonding type and Injection type of heat sink using three different kinds of industrial Peltier module by digital LabViewTM measurement. Injection type of heat sink could be more efficient for the heat transfer than Bonding type, even with 30% more radiating surface area. In addition, the experimental results revealed that the sufficient power supplied was able to show the better cooling performance of Peltier module. In order to verify the optimal cooling performance of the cooling device, two Peltier module, HMN 6040 and HMN 1550 with Bonding and Injection type of heat sink were used. The cooling performance with injection type of heat sink was 2.11% and 6.24% better than that with bonding type of heat sink under the HMN 6040 and HMN 1550, respectively.

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