• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.25 no.10
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• pp.966-982
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• 2014

This paper presents recent trends in system-level EMC investigation and countermeasure technology for radio frequency interference (RFI) influenced by noise generated in high-speed digital system. Recently, as the only digital device can perform various roles, there are a variety of EMI/EMC problems between systems. Especially, RFI is now recognized as a major problem, which occurs by EMI caused by the digital system. Therefore, in this paper, recent trends of RFI investigation from component-level to system-level are introduced and analyzed. Furthermore, in order to solve the RFI problem, recent researches are presented and investigated for the occurrences and suppression methods of common-mode noise which is one of the major noise sources in high-speed digital system. Lastly, this paper suggested future research of system-level EMC analysis and countermeasure technology for RFI problems.

• Journal of Korea Water Resources Association
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• v.36 no.4
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• pp.691-703
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• 2003

In this paper, a new and integrated approach easily used to calculate the pollutant loads from agricultural watersheds is suggested. Basic concepts of this empirical tool are based on the hypotheses that variations in event mean concentrations(EMCs) of the pollutants from a given agricultural watershed during rainstorms are only due to the rainfall pattern. This assumption would be feasible to agricultural watersheds whose land uses does not change during the cultivation period overlapped by rainy season and also in which point-sources of the pollutants are rare. Therefore, if EMC data sets through extensive sampling from various rural areas are available, it is possible to establish relationships between EMCs, shapes and land uses of the watersheds, and rainfall events. For this purpose, fifty one sets of EMC values were obtained from nine different watersheds, and those data were used to develop predictive tools for the EMCs of 55, COD, TN and TP in rainfall runoff. The results of the statistical tests for those formulas show that they are not only fairly good in predicting actual EMC values of some parameters, but also useful in terms of calculating pollutant loads on any time-spans such as the day of rainfall event or weekly, monthly, and yearly. Their applicability was briefly demonstrated and discussed. Also, the unit loads calculated from EMCs based on different land uses and real rainfall data over one of the watershed used for this study. were provided, and they are compared with other well-known unit loads.

• Journal of the Korea Society for Simulation
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• v.18 no.3
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• pp.35-45
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• 2009

Emergency medical center(EMC) is the place for patients who need medical treatment immediately due to a disease, childbirth, or all sorts of accidents. Currently, most of EMCs use temporary beds because regular EMC beds cannot afford to serve all incoming patients. However, since it decreases the quality of service(QoS) of EMC patients and their guardians and efficiency of the EMC, some improvements are highly required to diminish the usage of temporary beds. The system duration time is one of the typical QoSs. This thesis proposes the information which is critical to make a better decision for cut down the number of temporary beds without sacrificing QoS of patients. The key point is to control the duration time of medical treatments for the consultation and hospitalization process, since it is the major reason of overcrowding in EMC and the usage of temporary beds. In this paper, we proposed an Arena simulation model reflecting real world substantially. Arena is one of the most widely accepted simulation softwares in the world. Using the developed model, we can obtain the optimal EMC operation parameters through simulation experiments. Optquest, included in the Arena, is used to make the developed simulation model collaborate with an optimization model. The results showed one can determine the set of optimal operation parameters decreasing the required number of temporary beds without deteriorating EMC patient's QoS.

• Proceedings of the Korean Institute of IIIuminating and Electrical Installation Engineers Conference
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• 2003.11a
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• pp.319-323
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• 2003

본 논문은 누전차단기의 충격파 부동작 특성과 전자기적합성(EMC) 특성비교에 관한 것이다 국내 규격에서는 충격파 부동작 성능만 확인하지만 국제규격에서는 많은 EMC 항목이 있다. 누전차단기 17종에 대하여 EMC 4항목을 실시한 결과, IEC 61000-4-5에 따른 조합서지 내성에서 9종이 불량이었다. 다른 항목에서는 불량이 발생하지 않았다. 오동작만 발생한 시료 2종에 대하여 충격파 부동작 성능을 평가한 결과 오동작이 발생하지 않았다. 이것으로 보아 EMC와 충격파 부동작 시험은 상관관계가 적으며 보완이 필요함을 알 수 있다.

• Journal of Biosystems Engineering
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• v.30 no.2 s.109
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• pp.95-101
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• 2005

Adsorption and desorption experiments were carried out on rough rice and brown rice (Nampyung) at 5, 15, 25, 35, $45^{\circ}C$ for moisture contents between 8.7 and $25\%$ (db). The method employed was to measure the equilibrium relative humidity (ERH) of air in contact with the grain under static conditions, using an electronic hygrometer The effects of temperature and moisture contents were investigated, and the measured values were fitted to the modified Henderson, the modified Chung-Pfost, the modified Halsey and the modified Oswin model. The ERHs of rough rice and brown rice decreased with an decrease in moisture content and temperature, and the effects of temperature was no significant at moisture content of $25\%$ (db). Equilibrium moisture content (EMC) of brown rice was higher than rough rice at same temperature and relative humidity. Desorption EMC is higher than the adsorption, but there is no significant difference between desorption and adsorption EMC in moisture content near $25\%$ (db) at rough rice and near 9, 21 and $25\%$ (db) at brown rice. The modified Oswin model was the best in describing the adsorption EMC and the modified Chung-Pfost model was the best in describing the adsorption ERH of rough rice. The modified Oswin model was the best in describing the adsorption EMC/ERH of brown rice. The modified Chung-Pfost model was the best in describing the desorption EMC/ERH of rough rice and brown rice.

• Aerospace Engineering and Technology
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• v.5 no.2
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• pp.67-76
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• 2006

This paper describes the analysis method to define the system specification for conducted EMI environment and verification method to evaluate the conducted EMI performance. Conducted EMI environment is characterized by the electrical power subsystem which is mainly issued by the switching circuit noise, common ground impedance coupling. To define and control these EMI problems, EMI assesment through system analysis are preceded at the early design phase and then EMI reduction methods are applied during the unit/system development phase. System EMC should be carefully controlled and designed in the consideration of EMC safety margin and its performance is fully evaluated at the whole development period.

• Macromolecular Research
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• v.12 no.1
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• pp.78-84
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• 2004

Advanced epoxy molding compounds (EMCs) should be considered to alleviate the thermal stress problems caused by low thermal conductivity and high elastic modulus of an EMC and by the mismatch of the coefficient of thermal expansion (CTE) between an EMC and the Si-wafer. Though A1N has some advantages, such as high thermal conductivity and mechanical strength, an A1N-filled EMC could not be applied to commercial products because of its low fluidity and high modules. To solve this problem, we used 2-$\mu\textrm{m}$ fused silica, which has low porosity and spherical shape, as a small size filler in the binary mixture of fillers. When the composition of the silica in the binary filler system reached 0.3, the fluidity of EMC was improved more than twofold and the mechanical strength was improved 1.5 times, relative to the 23-$\mu\textrm{m}$ A1N-filled EMC. In addition, the values of the elastic modules and the dielectric constant were reduced to 90％, although the thermal conductivity of EMC was reduced from 4.3 to 2.5 W/m-K, when compared with the 23-$\mu\textrm{m}$ A1N-filled EMC. Thus, the A1N/silica (7/3)-filled EMC effectively meets the requirements of an advanced electronic packaging material for commercial products, such as high thermal conductivity (more than 2 W/m-K), high fluidity, low elastic modules, low dielectric constant, and low CTE.

• Journal of the Microelectronics and Packaging Society
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• v.6 no.4
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• pp.41-48
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• 1999

Silica is the most popular materials as a filler of EMC for microelectronic packaging. However, because of its low thermal conductivity, the use of silica is restricted to parts requiring high thermal dissipation. The superior fluidity of EMC can be achieved with a combination of filler size distribution. In this study, physical properties of EMC filled with the crystalline silica(13$\mu\textrm{m}$) which have high fluidity and low cost and the AlN(2 $\mu\textrm{m}$) which have high thermal conductivity and low coefficient of thermal expansion were evaluated by changing the AlN/silica ratios. As a result of the evaluation of physical properties of EMC, the optimum mixing ratio of AlN/crystalline silica was 0.3/0.7. In this condition, binary mixture(AlN/crystalline silica) filled EMC showed superior properties, i.e., in the thermal conductivity, CTE, dielectric constant, flexural strength, and thermal shock resistance without reduction of fluidity.

• Composites Research
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• v.34 no.1
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• pp.47-50
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• 2021

In this paper, the Curing process for Epoxy Molding Compound (EMC) Package was developed by comparing the performance of the EMC/Cu Bi-layer package manufactured by the conventional Hot Press process system and Carbon Nanotubes (CNT) Heater process system of the surface heating system. The viscosity of EMC was measured by using a rheometer for the curing cycle of the CNT Heater. In the EMC/Cu Bi-layer Package manufactured through the two process methods by mentioned above, the voids inside the EMC was analyzed using an optical microscope. In addition, the interfacial void and warpage of the EMC/Cu Bi-layer Package were analyzed through C-Scanning Acoustic Microscope and 3D-Digital Image Correlation. According to these experimental results, it was confirmed that there was neither void in the EMC interior nor difference in the warpage at room temperature, the zero-warpage temperature and the change in warpage.

• Journal of IKEEE
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• v.25 no.4
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• pp.591-597
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• 2021

This paper proposes an EMC-aware PCB design method to reduce electromagnetic emission, where trace length and teturn path of critical signal are shortened by changing chip location and trace layout on the PCB, while additional filters or decoupling capacitors are not required. In the proposed method, signal velocity is calculated for various signals on the PCB. Critical signal with the fastest signal velocity is determined and its return path is shortened as much as possible by placing chip location and trace routing first. Return path of critical signal should be carefully designed not to have discontinuity. Power plane and ground plane should be carefully designed not to be divided, since these planes are the reference of return path. The proposed method was applied to automotive directional Bluetooth speaker which failed to pass CISPR 32 and CISPR 25 EMC tests. Its PCB was redesigned based on the proposed method and it easily passed the EMC tests. The proposed method is useful to EMC-sensitive electronic equipments.