• Proceedings of the Korean Information Science Society Conference
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• 2006.10c
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• pp.113-117
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• 2006

유비쿼터스 컴퓨팅의 실현을 위해서는 이동 단말기의 자원 및 컴퓨팅 파워의 효율적 사용이 필수적이다. 특히, 이동 단말기에 내장된 소프트웨어의 수행에 있어 메모리 효율성, 에너지 효율성, 그리고 처리 효율성이 요구된다. 본 논문은 자원이 제약되어 있는 이동 단말기에서의 XML 데이터에 대한 질의 처리 기술에 관한 것이다. 메모리 용량이 크지 않은 단말기의 경우 대량의 XML 데이터에 대한 질의 처리를 수행하기 위해서는 XML 스트림 질의 처리 기술이 활용되어야 한다. 최근에 제시된 XFrag 기법은 홀-필러(hole-filler) 모델을 이용하여 XML 데이터를 XML 조각(fragment)으로 분할(fragmentation)하여 스트림으로 전송하고 처리할 수 있는 기법이다. 이는 메모리 효율성이 요구되는 이동 단말기에서 전체 XML 문서를 재구성하지 않고 XML 데이터에 대한 질의 처리를 가능하게 한다. 그러나 홀-필러 모델을 사용할 경우 홀과 필러에 대한 부가적인 정보를 저장해야 하므로 메모리 효율성이 높지 못하다. 본 논문에서는 XML 데이터의 구조 정보를 표현하는 XML 레이블링(labelling) 기법을 이용하여 XML 데이터를 조각으로 분할하여 조각 스트림에 대한 질의 처리를 수행하는 기법을 제시한다. 구현 및 성능 실험 결과 본 논문에서 제시한 기법이 기존의 XFrag 기법보다 메모리 사용량과 처리 시간 양면 모두에서 우수한 것으로 나타났다.

• Journal of Korea Society of Industrial Information Systems
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• v.17 no.7
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• pp.43-50
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• 2012

Database for the information of the shape accuracy is constructed with the finite element stamping analysis of the center pillar member. Analyses are carried out in order to investigate the effect of tool compensation on the product quality previously performed by an expert in the press shop. The compensation procedure is provided with three sequences for improving shape accuracy of the member by reducing the amount of springback. The analysis result shows that shape inaccuracy in the product is caused by sagging and twisting phenomena from displacement of the section part due to excessive amount of springback. From the database with springback analyses, design modification guidelines are proposed for improving the shape accuracy. The guideline is directly applied to a member with the similar shape and the sound product is obtained successfully reducing the amount of springback.

• Journal of Korean Tunnelling and Underground Space Association
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• v.7 no.3
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• pp.227-237
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• 2005

In this study, the behavior of shallow 2-Arch tunnel due to excavation under horizontal discontinuity plane was verified experimentally. The model tests were carried out by varying the overburden height and the location of the discontinuity plane. The model tests followed exactly the real 2-Arch tunnel construction stages. As a result, it is discovered that stress-transfer mechanism and loosening area around the 2-Arch tunnel depends on the overburden heights and the location of the discontinuity plane. And central pillar load is also dependent on overburden height, location of discontinuity plane and construction stages.

• Proceedings of the KIEE Conference
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• 2015.07a
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• pp.1185-1186
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• 2015

본 논문에서 HVDC $SF_6$ 가스절연시스템(GIS)에서 최적의 에폭시 재질을 알아내기 위해 $Al_2O_3$와 $SiO_2$ 나노필러가 첨가된 총 다섯 종류의 에폭시에 대한 도전율을 측정하여 DC 전계분포 해석을 수행하였다. 해석결과 $75^{\circ}$의 접촉각(에폭시 스페이서와 도체가 이루는 각도)가 가장 우수한 전계특성을 나타냈고 $Al_2O_3$ 2 hundred per resin(phr)의 나노필러가 첨가된 에폭시가 가장 우수한 절연매질로써의 특성을 보여주었다. 또한, 삼중점에서 전계집중 완화를 위하여 $Al_2O_3$ 2 phr의 나노필러가 첨가된 에폭시의 데이터를 기반으로 열해석을 고려한 정상상태 및 극성 반전에 대해 DC 전계 해석을 수행하여 최적의 에폭시 스페이서 형상을 도출하였다.

• Journal of the korean academy of Pediatric Dentistry
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• v.40 no.4
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• pp.247-252
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• 2013

Pit and fissure sealant prevents biofilm accumulation, plays a role in forming a barrier to acidic substance made by the bacteria. The Surface reaction-type pre-reacted glass ionomerI(S-PRG) filler was developed in 1999. S-PRG filler releases fluoride continuously and does not decompose under wet conditions. The aim of this study was to test the microleakage and anticariogenic effect to adjacent enamel of S-PRG filler-containing pit and fissure sealant. Sound premolars and molars were used in this study. A S-PRG filler-containing pit and fissure sealant, Beautisealant$^{(R)}$(Shofu, Japan) was used for this experiment, the composite resin sealant Concise$^{(R)}$(3M ESPE, USA) was used as control. For the microleakage test, all teeth surface were double coated with finger nail varnish, with the exception of a 1.0 mm window around the restoration margins. The teeth were immersed in 2% methylene blue solution for 24 hours and then rinsed in tap water. For the anticariogenic effect evaluation, all tooth were immersed in artificial carious solution for 9 days and rinsed with tap water. Each tooth was embedded in orthodontic acrylic rein and subsequently sectioned longitudinally in a bucco-lingual direction with a low-speed diamond saw. The cut sections were examined using a stereomicroscope. Differences in microleakage between the two groups were not different significantly. But the S-PRG filler-containing pit and fissure sealant showed higher anticariogenic effect than that of flowable resin sealant.

• Korean Chemical Engineering Research
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• v.58 no.1
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• pp.64-68
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• 2020

In this study, metal copper clad laminate can be prepared using epoxy composite filled with thermally conductive fillers. In order to improve the thermal conductivity of epoxy composites, it is important factor to form conductive networks through appropriate packing of conductive fillers in epoxy composite matrix and to decrease the amount of thermally resistant junctions involving a epoxy composite matrix layer between adjacent filler units. This is because epoxy has a thermal conductivity of only 0.2-0.3W, so in order to maintain high thermal conductivity, thermally conductive fillers are connected to each other, so that the gap between particles can be reduced to reduce thermal resistance. The purpose of this study is to find way to achieve highly thermally conductive in the epoxy composite matrix filled with Al₂O₃ and Boron Nitride(BN) filler by filler loading and uniform dispersion. As a results, the use of Al₂O₃/BN hybrid filler in epoxy matrix was found to be effective in increasing thermal conductivity of epoxy composite matrix due to the enhanced connectivity offered by more continuous thermally conductive pathways and uniform dispersion without interfacial voids in epoxy composite matrix. In addition, surface treatmented s-BN improves the filler dispersion and adhesion between the filler and the epoxy matrix, which can significantly decrease the interfacial thermal resistance and increase the thermal conductivity of epoxy composite matrix.

• Polymer(Korea)
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• v.37 no.4
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• pp.494-499
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• 2013

Modified polypropylene (m-PP) was fabricated by furfuryl sulphide (FS) as branching agent and m-PP/nano-filler composites were prepared with silicate and multi-walled carbon nanotube (MWCNT), using a twin screw extruder. The chemical structures and thermal properties of the m-PP were investigated by FTIR and DSC. The chemical structure of the m-PP was confirmed by the existence of =C-H stretching peak of the branching agent at 3100 $cm^{-1}$. There was no district change in melting temperature in case of m-PP, but a certain increase in crystallization temperature was notified and the increase was in the range of $10-20^{\circ}C$. The rheological properties, filler dispersion and foaming behaviors of the m-PP/nano-filler composites were investigated by dynamic rheometer, X-ray diffractometer (XRD) and scanning/transmission electron microscope (SEM/TEM). m-PP/nano-filler composites showed a high complex viscosity at a low frequency, an increase in melt elasticity, and a high shear thinning effect. Compared to pure PP, m-PP and m-PP/nano-filler composites were sufficient to enhance the foaming behavior.

• Journal of the korean academy of Pediatric Dentistry
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• v.31 no.3
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• pp.516-526
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• 2004

Polymerization shrinkage of photoinitiation type composite resin cause several clinical problems. The purpose of this study was to evaluate the shrinkage strain stress, linear polymerization shrinkage, compressive strength and microhardness of recently developed composite resins. The composite resins were divided into four groups according to the contents of matrix and filler type. Group I : $Denfil^{TM}$(Vericom, Korea) with conventional matrix, Group II : $Charmfil^{(R)}$(Dentkist, Korea) with microfiller and nanofller mixture, Group III : $Filtek^{TM}$ Z250(3M-ESPE, USA) TEGDMA replaced by UDMA and Bis-EMA(6) in the matrix, and Group IV : $Filtek^{TM}$ Supreme(3M-ESPE, USA) using pure nanofiller. Preparation of acrylic molds were followed by filling and curing with light gun. Strain gauges were attached to each sample and the leads were connected to a strainmeter. With strainmeter shrinkage strain stress and linear polymerization shrinkage was measured for 10 minutes. The data detected at 1 minute and 10 minutes were analysed statistically with ONE-way ANOVA test. To evaluate the mechanical properties of tested materials, compressive hardness test and microhardness test were also rendered. The results can be summarized as follows : 1. Filling materials in acrylic molds showed initial temporary expansion in the early phase of polymerization. This was followed by contraction with the rapid increase in strain stress during the first 1 minute and gradually decreased during post-gel shrinkage phase. After 1 minute, there's no statistical differences of strain stress between groups. The highest strain stress was found in group IV and followed by group III, I, II at 10 minutes-measurement(p>.05). In regression analysis of strain stress, group III showed minimal inclination and followed by group II, I, IV during 1 minute. 2. In linear polymerization shrinkage test, the composite resins in every group showed initial increase of shrinkage velocity during the first 1 minute, followed by gradually decrease of shrinkage velocity. After 1 minute, group IV and group III showed statistical difference(p<.05). After 10 minutes, there were statistical differences between group IV and group I, III(p<.05) and between group II and group III(p<.05). In regression analysis of linear polymerization shrinkage, group II showed minimal inclination and followed by group IV, III, I during 1 minute. 3. In compressive strength test, group III showed the highest strength and followed by group II, IV, I. There were statistical differences between group III and group IV, I(p<.05). 4. In microhardness test, upper surfaces showed higher value than lower surfaces in every group(p<.05).

• Proceedings of the Materials Research Society of Korea Conference
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• 1999.11a
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• pp.172-172
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• 1999

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.11a
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• pp.56-56
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• 2004