• Title/Summary/Keyword: 피코초 레이저

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Picoseconds Laser Drilling and Platform (피코초 레이저 드릴링 공정 및 플랫폼)

  • Suh, Jeong;Shin, Dong-Sig;Sohn, Hyon-Kee;Song, Jun-Yeob
    • Journal of the Korean Society for Precision Engineering
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    • v.27 no.10
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    • pp.40-44
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    • 2010

  • Laser drilling is an enabling technology for Through Silicon Via (TSV) interconnect applications. Recent advances in picoseconds laser drilling of blind, micron sized vias in silicon is presented here highlighting some of the attractive features of this approach such as excellent sidewall quality. In this study, we dealt with comparison of heat affection around drilled hole between a picosecond laser and a nanosecond laser process under the UV wavelength. Points which special attention should be paid are that picosecond laser process lowered experimentally recast layer, surface debris and micro-crack around hole in comparison with nanosecond laser process. These finding suggests that laser TSV process has possibility to drill under $10{\mu}m$ via. Finally, the laser drilling platform was constructed successfully.

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TSV Formation using Pico-second Laser and CDE (피코초 레이저 및 CDE를 이용한 TSV가공기술)

  • Shin, Dong-Sig;Suh, Jeong;Cho, Yong-Kwon;Lee, Nae-Eung
    • Laser Solutions
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    • v.14 no.4
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    • pp.14-20
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    • 2011

  • The advantage of using lasers for through silicon via (TSV) drilling is that they allow higher flexibility during manufacturing because vacuums, lithography, and masks are not required; furthermore, the lasers can be applied to metal and dielectric layers other than silicon. However, conventional nanosecond lasers have disadvantages including that they can cause heat affection around the target area. In contrast, the use of a picosecond laser enables the precise generation of TSVs with a smaller heat affected zone. In this study, a comparison of the thermal and crystallographic defect around laser-drilled holes when using a picosecond laser beam with varing a fluence and repetition rate was conducted. Notably, the higher fluence and repetition rate picosecond laser process increased the experimentally recast layer, surface debris, and dislocation around the hole better than the high fluence and repetition rate. These findings suggest that even the picosecond laser has a heat accumulation effect under high fluence and short pulse interval conditions. To eliminate these defects under the high speed process, the CDE (chemical downstream etching) process was employed and it can prove the possibility to applicate to the TSV industry.

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Practical application of picosecond laser micro-machining to the direct fabrication of a diffraction grating mold (피코초 레이저를 이용한 회절 격자 금형 개발)

  • No, Ji-Hwan;Lee, Je-Hun;Son, Hyeon-Gi;Seo, Jeong;Sin, Dong-Sik
    • Proceedings of the Korean Society of Laser Processing Conference
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    • 2006.06a
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    • pp.97-100
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    • 2006

  • Picosecond (ps) laser micro-machining has emerged as an attractive method of fabricating high-precision microstructures, especially in metals. In this paper, a metallic mold for diffraction gratings is fabricated with a mode-locked 12 ps $Nd:YVO_4$ laser. Laser pulses with a wavelength of 355nm are irradiated on the surface of NOK 80, a mold material, to generate line patterns. In order to minimize the line width, laser power is set just above the ablation threshold of NOK 80. Results show that the spectrum from the fabricated mold is good enough for some industrial application.

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