• Proceedings of the Korean Institute of Surface Engineering Conference
• /
• 1999.10a
• /
• pp.36-36
• /
• 1999

• Journal of Welding and Joining
• /
• v.17 no.1
• /
• pp.28-36
• /
• 1999

• Vacuum Magazine
• /
• v.2 no.4
• /
• pp.16-26
• /
• 2015

Carbon nanomaterials including nanocrystalline diamond and graphene films are expected to play a core role in $21^{st}$ century industries due to their amazing physicochemical properties. To achieve their practical utilization and industrialization, the development of their mass production technologies is strongly required. Recently, a surface wave excited plasma (SWP) which is produced using microwaves has been attracting special attentions as a candidate for the mass production technology of carbon nanomaterials. SWP can allow a low-temperature large-area plasma chemical vapor deposition (CVD) system. Here, this article introduces the promising SWP-CVD technology. Plasma characteristics in a SWP will be introduced in detail to help understanding how to use and control a SWP as a plasma source for CVD applications.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2012.08a
• /
• pp.134-134
• /
• 2012

최근 반도체 및 디스플레이 산업에서 진공, 특히 플라즈마 공정은 중요한 기술로 알려져 있다. 반도체 제조공정은 플라즈마를 이용하여 증착(deposition)공정 및 패터닝을 위한 식각(Dry Etch)공정으로 크게 나뉘고, 디스플레이 공정에서는 Glass위에 형성된 금속오염입자 및 polymer와 같은 불순물을 제거하는 공정으로 식각(Dry Etch)공정을 주로 사용하고 있다. 진공공정장비인 CVD, Etcher는 플라즈마와 활성기체, 고온의 공정온도에 노출 되면서 진공공정장비 부품에 부식이 진행되기 때문에 내플라즈마성이 강한 재료를 코팅하여 사용하고 있다. 하지만 장시간 부식환경에 노출이 되면, 코팅부품에서도 부식이 진행되면서 다량의 오염입자가 발생하여 생산수율 저하에 원인이 되기도 하고, 부품 교체비용이 많이 들기 때문에 산업체에서 많은 어려움을 겪고 있다. 본 연구에서는 산업체에서 코팅부품으로 많이 사용되고 있는 다양한(Al2O3, Y2O3 등) 산화막 및 세라믹코팅 부품의 내플라즈마 특성을 비교 연구하였다.

• Journal of the Korean Vacuum Society
• /
• v.2 no.3
• /
• pp.346-354
• /
• 1993

The diamond particles and films were deposited on Si and qurtz substrate for $CH_4-H_2$ mixed gas by using RF plasma CVD. The temperature of substrate and the thinkness of films deposited on Si substrate were uniformly kept up by inserting metal plate between substrate and substrate holder. On increasing the reaction pressure in the same discharge power, the morphologies of films were changed from well-defind films to micro-crystal or ball-like. When diamond films were deposited on Si substrate from $CH_4-H_2$ mixed gas, we obtained well-defined diamond films at lower concentration than 0.5 vol% of $CH_4/H_2$. The deposited diamond films were indentified by SEM, XRD and Raman spectroscopy.

• Journal of the Korea Institute of Information and Communication Engineering
• /
• v.6 no.1
• /
• pp.99-102
• /
• 2002

Pinholes on the thermally grown oxide, which is called gate oxide, on silicon substrate under polysilicon layer are found and its mechanism is analyzed in this paper. The oxide under a polysilicon layer is broken during the plasma etching process of other polysilicon layer. Both polysilicon layers are separated with 0.8${\mu}{\textrm}{m}$ thick oxide deposited by CVD (Chemical Vapor Deposition). Since broken oxide points are found scattered around an arc occurrence point, it is assumed that an extremely high electric field generated near the arc occurrence point makes the gate oxide broken. 1'he arc occurrence point has been observed on the alignment key and is the mark of low yield. It is found that any arc occurrence can cause chips to fail by breaking the gate oxide, even if are occurrence points are found on scribeline.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2005.06a
• /
• pp.1236-1239
• /
• 2005

Aligned carbon nanotubes(CNTs) array were synthesized using DC plasma-enhanced chemical vapor deposition. Silicon substrate Ni-coated of 5nm thickness were pretreated by $NH_3$ gas with a flow rate of 180sccm, for 10min. CNTs were grown on the pretreated substrates at $30%\;C_2H_2:NH_3$ flow ratios for 10min. Carbon nanotubes with diameters from 60 to 80 nanometers and lengths about 2.7 micrometers were obtained. Vertical alignment of carbon nanotubes were observed by FESEM.

• Proceedings of the Korean Institute of Surface Engineering Conference
• /
• 2012.05a
• /
• pp.192-192
• /
• 2012

플라즈마 CVD와 아크방전법을 혼합한 하이브리드 공정을 통하여 알곤과 메탄 그리고 질소를 인입하여 Cr을 타겟으로한 아크방전과 기판에 전극을 인가하는 방식의 플라즈마 CVD공정을 복합화하여 금속이 함유된 Cr-C:H 박막을 합성하고, 공정에 질소를 인입하여 박막에 질소를 도핑하여 부내식성과 전기적 전도성에 관한 고찰을 하였다. 내부식성은 동전위분극시험에서 $1{\mu}A/cm^2$을 보였고, 전기저항은 $1m{\Omega}-cm$ 이하로 측정되어 내식성과 전기전도성을 동시에 갖는 박막을 합성할 수 있었다. 내식성과 전기전도성에 대한 원인규명을 위하여 박막의 구조분석을 XPS, XRD, Raman 분석을 통하여 실시하였다. 흑연화 탄소(Graphitic carbon)와 금속콤포짓(Metal composite)은 내식성에 영향을 주었으며, 전도성물질의 percolation효과와 질소와 탄소의 단일 결합과정에서 생성되는 잉여전자에 의한 단일 결합(C-N) 분율이 전기전도성에 영향을 주었다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2006.06a
• /
• pp.161-162
• /
• 2006

Scaling rules for TFT application devices have led to the necessity of ultra thin dielectric films and high-k dielectric layers. In this paper, The advantages of high concentration of nitrogen in silicon oxide layer deposited by using $N_2O$ in Inductively Coupled Plasma Chemical Vapor Deposition (ICP-CVD) reported about Ellipsometric measurement, Capacitance-Voltage characterization and processing conditions.

• Proceedings of the Materials Research Society of Korea Conference
• /
• 2007.11a
• /
• pp.63.1-63.1
• /
• 2007