• Tribology and Lubricants
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• v.24 no.2
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• pp.90-95
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• 2008

An elastic-plastic contact analysis is developed using a semi-analytical method. The elastic contact is solved within a Hertz theorem. The reciprocal theorem with initial strains is then introduced, to express the surface geometry as a function of contact stress and plastic strains. The irreversible nature of plasticity leads to an incremental formulation of the elastic-plastic contact problem, and an algorithm to solve this problem is set up. Closed form expression, which give residual stresses and surface displacements from plastic strains, are obtained by integration of the reciprocal theorem. The distribution of contact stress, residual stress and plastic strain are obtained by the changed surface geometry.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.286-286
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• 2010

최근에 환경 오염과 화석 에너지의 고갈 문제를 해결하기 위하여 태양광을 전기 에너지로 변환하는 태양전지 연구에서 가장 이슈가 되는 부분은 저가격화와 고효율이다. 상용화 되어 있는 대부분의 태양전지는 단결정 실리콘 웨이퍼와 다결정 실리콘 웨이퍼를 사용한다. 실리콘 웨이퍼의 원자재 가격을 낮추는 방법에는 한계가 있기 때문에 태양전지 제작 공정에서 공정 단가를 낮추는 방법이 많이 연구되고 있고, 실리콘 웨이퍼가 가지는 재료의 특성상 화합물을 이용한 태양전지 보다 낮은 효율을 가질 수밖에 없기 때문에 반도체 소자 공정을 응용하여 실리콘 웨이퍼 기판에서 고효율을 얻는 방법으로 연구가 진행 되고 있다. 본 연구에서는 마이크로 블라스터를 이용하여 태양전지 cell 상부에 AG(anti-glare)를 가지는 유리 기판을 형성하여 낮은 단가로 태양전지 cell의 효율을 향상시키기 위한 연구를 진행 하였다. 태양전지 cell 상부에 AG를 가지는 유리 기판을 형성하게 되면 태양의 위도가 낮아 표면에서 대부분 반사되는 태양광을 태양전지 cell에서 광기전력효과가 일어나게 하여 효율을 향상시킨다. 이때 사용한 micro blaster 공정은 고속의 입자가 재료를 타격할 때 입자의 아래에는 고압축응력이 발생하게 되고, 이 고압 축응력에 의하여 소성변형과 탄성변형이 발생된다. 이러한 변형이 발전되어 재료의 파괴 초기값보다 크게 되면 크랙이 발생되고, 점점 더 발전하게 되면 재료의 제거가 일어나는 단계로 이루어지는 기계적 건식 식각 공정 기술이라 할 수 있다. 먼저 유리 기판에 마이크로 블라스터 장비를 이용하여 AG를 형성한다. AG는 $Al_2O_3$ 파우더의 입자 크기, 분사 압력, 노즐과 기판과의 간격, 반복 횟수, 노즐 이동 속도 등의 공정 조건에 따른 유리 기판 표면에서의 광학적 특성 및 구조적 특성에 관하여 분석하였다. 일반적인 태양전지 cell 제작 공정에 따라 cell을 제작 한후 AG 유리 기판을 상부에 형성시키고 솔라시뮬레이터를 이용하여 효율을 측정하였다. 이때 솔라시뮬레이터의 광원이 고정되어 있기 때문에 태양전지 cell에 기울기를 주어 태양의 위도 변화에 대해 간접적으로 측정하였다. AG 유리 기판이 태양전지 cell 상부에 형성 되었을 때와 없을 때를 각각 비교하여 AG 유리 기판이 형성된 태양전지 cell에서의 효율 향상을 확인하였다.

• Journal of Biomedical Engineering Research
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• v.19 no.1
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• pp.53-58
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• 1998

This study examined the distribution of bone mineral density(BMD) and the von Mises stress in the patella. The BMD of eighteen patellae were determined by using quantitative computed tomography and imaging analysis software. It was found that the BMD of the patella varied with location. BMD values were largest at the superior and lateral regions and decreased inferiorly and medially. This distribution appeared to correspond to the organization of trabeculae within the patella. A two-dimensional finite element analysis was performed on each patella. It was also found that the maximum von Mises stress in the patella occurred along the cortical shell on the non-articular surface. The trabecular von Mises stress existed in the posterior region of the patella. These findings demonstrated the potential for finite element studies in vivo. Further, such studies may lead to the development of custom-made, patient-specific patella prostheses.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.34 no.2
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• pp.129-138
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• 2010

Technical ceramics, due to their unique physical properties, are excellent candidate materials for engineering applications involving extreme thermal and chemical environments. When ceramics are rapidly cooled, they receive thermal shock. The thermal shock parameter is defined as the critical temperature difference. The critical temperature difference for ceramic parts is influenced by its size, the convective heat transfer coefficient, etc. The thermal shock for a component is analyzed by using the transient thermal stress. If the transient thermal stress exceeds the modulus of rupture (MOR), cracking by thermal shock is initiated. The critical temperature difference for water is less than the critical temperature difference for air. The three-way catalyst substrate used in this study has an adequate performance against thermal shock because its radial and axial temperature differences existed below the critical temperature differences.

• Journal of Biomedical Engineering Research
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• v.20 no.1
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• pp.37-44
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• 1999

Because of bone resorption, wear of ultra-high molecular weight polyethylene(UHMWPE) in total knee arthroplasty has been recognized as a major factor in long-term failure of knee implant. The surface damage and the following harmful wear debris of UHMWPE is largely related to contact stress. Most of the previous studies focused on the contact condition only at the articulating surface of UHMWPE. Recently, contact stress at the metal-backing interface has been implicated as one of major factors in UHMWPE wear. Therefore, the purpose of the is study is to investigate the effect of the contact stress for different thickness, conformity friction coefficient, and flexion degree of the UHMWPE component in total knee system, considering the contact conditions at both interfaces. In this study, a two-dimensional non-linear plane strain finite element model was developed. The results showed that the maximum value of von-Mises stress occurred below the articulating surface and the contact stress was lower for the more conforming models. All-polyethylene component showed lower stress distribution than the metal-backed component. With increased friction coefficient on the tibiofemoral contact surface, the maximum shear stress increased about twofold.

• Composites Research
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• v.17 no.5
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• pp.15-24
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• 2004

Longitudinal strains (${\varepsilon}_x$) of the core and skin layers in glass fiber reinforced plastic (GFRP) cross-ply composite laminates have been measured using the embedded optical fiber sensor of absolute extrinsic Fabry-Perot interferometer (A-EFPI). Transmission optical microscopy was used to investigate the damage behavior around the A-EFPI sensor. Foil-type strain gauges bonded on both the upper and lower surfaces were used for the measurement of the surface strains. It was shown that values of ${\varepsilon}_x$ in the interior of the skin layer and the core layer measured by embedded A-EFPI sensor were significantly higher than that of the specimen surface measured by strain gauges. The experimental results agreed well with those from finite element analysis on the basis of uniform stress model. Large strains in the core layer led to the occurrence of many transverse cracks which drastically reduced the strain at failure of optical fiber sensor embedded in the core layer.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.3 s.32
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• pp.37-45
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• 2004

Electroless Ni(P) has been widely used for under bump metallization (UBM) of flip chip and surface finish layer in microelectronic packaging because of its excellent solderability, corrosion resistance, uniformity, selective deposition without photo-lithography, and also good diffusion barrier. However, the brittle fracture at solder joints and the spatting of intermetallic compound (IMC) associated with electroless Ni(P) are critical issues for its successful applications. In the present study, the mechanism of IMC spatting and microstructure change of the Ni(P) film were investigated with varying P content in the Ni(P) film (4.6,9, and $13 wt.\%$P). A reaction between Sn penetrated through the channels among $Ni_3Sn_4$ IMCs and the P-rich layer ($Ni_3P$) of the Ni(P) film formed a $Ni_3SnP$ layer. Thickening of the $Ni_3SnP$ layer led to $Ni_3Sn_4$ spatting. After $Ni_3Sn_4$ spatting, the Ni(P) film directly contacted the molten solder and the $Ni_3P$ phase further transformed into a $Ni_2P$ phase. During the crystallization process, some cracks formed in the Ni(P) film to release tensile stress accumulated from volume shrinkage of the film.