• Title/Summary/Keyword: 폼 라텍스

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Mold Making and Casting for Stop-Motion Puppets (스톱모션 퍼핏을 위한 몰드 제작과 캐스팅)

  • Kim, Jung-Ho
    • The Journal of the Korea Contents Association
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    • v.13 no.3
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    • pp.43-53
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    • 2013
  • This paper covers the manufacturing process to improve the quality of the puppet for stop-motion films, especially focuses on the mold making and casting process those are the key steps of the puppet making. Unlike the general mold for a duplication, the mold for puppets has special functions to fix an armature and inject casting materials stably inside, and it is repeatedly baked at high temperature. The practical information about puppet makings is provided including various predictable problems, expertise from many professionals, vender list, and so on.

Characteristics of Low Density Fiberboards for Insulation Material with Different Adhesives (I) - Thermal Insulation Performance and Physical Properties - (다양한 접착제로 제조한 단열재용 저밀도섬유판의 특성(I) - 단열성능 및 물리적 성질 -)

  • Jang, Jae-Hyuk;Lee, Min;Kang, Eun-Chang;Lee, Sang-Min
    • Journal of the Korean Wood Science and Technology
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    • v.45 no.3
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    • pp.360-367
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    • 2017
  • This study was carried out to compare the characteristics of low density fiberboards (LDFs) manufactured with different adhesive types such as melamine urea formaldehyde (MUF), phenol formalehyde (PF), emulsified MDI (eMDI) and latexes resins. As results, hard LDFs were successfully manufactured by MUF, PF and eMDI resins. Thermal conductivities of all LDFs were significantly lower than commercial medium density fiberboard. Especially, all LDFs showed comparable thermal insulation performance with extruded polystyrene foam (XPS). LDF manufactured with eMDI resins showed the highest physical properties such as thickness/length swelling by water absorption and bending strength.

Characteristics of Low Density Fiberboards Bonded with Different Adhesives for Thermal Insulation (II) - Formaldehyde·Total Volatile Organic Compounds Emission Properties and Combustion Shapes - (다양한 접착제로 제조한 단열재용 저밀도섬유판의 특성(II) - 폼알데하이드·총휘발성유기화합물 방출 특성 및 연소 형상 -)

  • Jang, Jae-Hyuk;Lee, Min;Kang, Eun-Chang;Lee, Sang-Min
    • Journal of the Korean Wood Science and Technology
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    • v.45 no.5
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    • pp.580-587
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    • 2017
  • Woodfiber insulation board can be considered as a one of the key material for low energy consumption, comfortable and safety construction of residential space because of its eco-friendly and high thermal insulation performance. This study was carried out to investigate the formaldehyde (HCHO) total volatile organic compounds (TVOC) emission properties and combustion shapes by flame test of low density fiberboards (LDFs) prepared with different adhesives. HCHO TVOC emission and combustion properties of LDFs prepared by melamine urea formaldehyde (MUF), phenol formaldehyde (PF), emulsified methylene diphenyl diisocyanate (eMDI) and latex resin adhesives were measured by desiccator method, 20 L chamber method, and flame test, respectively. As results, LDFs manufactured by MUF, eMDI and latex resin adhesives satisfied the Super $E_0$ grade of HCHO emission performance except PF resin. Furthermore, TVOC emission of all LDFs were satisfied the Korean indoor air quality standard (below $400{\mu}g/m^2{\cdot}h$). Especially, LDF with eMDI resin adhesive showed the lowest HCHO and TVOC emissivity, that $0.14mg/{\ell}$, $12{\mu}g/m^2{\cdot}h$, respectively. However, eMDI emitted the small amount ($3{\mu}g/m^2{\cdot}h$) of toluene in VOC components. In the flame test, LDF with MUF resin adhesives showed the most favorable shape after flame test compare to LDFs prepared other adhesives. Based on HCHO and TVOC emission, and combustion shapes, MUF resin adhesive may be recommended to prepare LDF for insulation purpose.