• Corrugated packaging logistics
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• no.48 s.11
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• pp.67-68
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• 2003

폴리아미드는 산 아미드결합(-CO-NH-)에 의해 구성되는 고분자화합물로 나일론으로 알려져 있다. 나일론은 미국 듀퐁사의 상품명인데 폴리아미드대신 사용되고 있다. 나일론6, 나일론66, 나일론610, 나일론11, 나일론12, 나일론46, 나일론MXD6등이 제조되고 있다. 이들 가운데 가장 많이 사용되고 있는 것이 나일론6, 나일론66이다.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.10a
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• pp.423-424
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• 2006

• Korean Chemical Engineering Research
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• v.50 no.1
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• pp.167-172
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• 2012

A new type of thermoplastic elastomer (TPE) based on EPDM ionomer as an elastomer and polyamide-6 as a reinforcing crystalline polymer was prepared and the thermal properties of TPEs were investigated. Especially effects of neutralization of maleated EPDM (MA-EPDM) to prepare EPDM ionomer with zinc oxide and the content of polyamide-6 on the thermal properties of the blends were investigated. Both the neutralization and blending were carried out employing a twin screw extruder. It was found that the neutralization of MA-EPDM results in the increase of cooling crystallization temperatures. Polyamide-6 plays the role of reinforcing filler in the blends due to the high crystallinity. Fine dispesion of polyamide-6 in the blends was confirmed and attributed to the imide formation between the maleic anhydride of MA-EPDM and amine group of polyamide-6. TPEs based on EPDM ionomer/Polyamide-6 blends showed balanced mechanical properties with improvement in heat resistance.

• Proceedings of the Korean Fiber Society Conference
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• 2001.10a
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• pp.183-186
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• 2001

폴리에스테르/폴리아미드의 블렌드는 두 고분자의 단점을 상호 보완할 수 있을 뿐만 아니라 조성비에 의해 원하는 물성을 부여할 수 있는 장점이 있다. 이들 블렌드 중에서 폴리(에틸렌 테레프탈레이트)(PET)/폴리아미드(PA)의 블렌드의 경우 일반적인 폴리에스테르계의 블렌드에서 일어나는 에스테르 교환반응과 마찬가지로 에스테르-아미드 교환반응이 일어나며 이를 이용하여 두 고분자간의 상용성을 향상시키려는 연구가 보고된 바 있다. (중략)

• Elastomers and Composites
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• v.43 no.4
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• pp.253-258
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• 2008

In this study polyamide 6,6 based thermoplastic composite with graphite and carbon black had been examined feasibility for separators of fuel cell which requires good mechanical and electrical properties with gas impermeability. The effects of molding pressure and filler content on the properties of the composite were investigated. Maximum flexural modulus was obtained about 80 wt% graphite, while electrical conductivity increased with graphite content. Flexural strength increased with molding pressure and tended to level-off from $400\;kgf/cm^2$. Molding pressure did not affect the electrical conductivity. The addition of carbon black enhanced the electrical conductivity of the composite. Mechanical properties were decreased under acidic condition.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.24 no.7 s.178
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• pp.1703-1711
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• 2000

Microstructural morphology of molded composites of thermotropic liquid crystalline polymer(LCP) and polyamide 6 (PA6) has been studied as a function of epoxy fraction. Injection-moulding of a thin composite plaque at a temperature below the melting point of the LCP fibrils by suing the extruded LCP/PA6 pellets produced multi-layered structures: 1) the surface skin layer with thickness of 65-120 ym exhibiting a transverse orientation, 2) the sub-skin layer with an orientation perpendicular to the surface skin, i.e. in the flow direction, 3) the core layer with arc-curved flow patterns. Similar microstructural orientations were observed in the respective layers for the composite plaques with different fractions of epoxy.

• Polymer(Korea)
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• v.36 no.6
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• pp.712-720
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• 2012

Thermal degradation for glass fiber-reinforced polyamide 66 composite (PA 66) with respect of thermal exposure time has been investigated using optical microscopy, scanning electron microscopy and Fourier transform infrared spectroscopy. As the thermal exposure time was prolonged, a slight increase in tensile strength for only initial stage and afterward, a proportional decrease of tensile strength was observed. These results can be explained by the increase of crystallinity, followed by the increase of crosslinking density, chain scission and the decrease in chain mobility, due to thermal oxidation with the exposure time. Fourier transform infrared spectroscopy results showed the increase of ketone peak and silica peak on the surface of thermally exposed PA 66. In addition, the thermal decomposition kinetics of PA 66 was analyzed using thermogravimetric analysis at three different heating rates. The relationship between activation energy and lifetime-prediction of PA 66 was investigated by several methodologies, such as statistical tool, UL 746B, Ozawa and Kissinger. The activation energy determined by thermogravimetric analysis had a relatively large value compared with that from the accelerated test. This may result in over-estimating the lifetime of PA 66. In this study, a master curve of exponential fitting has been developed to extrapolate the activation energy at various service temperatures.

• Applied Chemistry for Engineering
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• v.27 no.1
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• pp.50-55
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• 2016

Aromatic diamines containing hexafluoroisopropylidene and ester moiety were synthesized from 4,4'-hexafluoroisopropylidene diphenol and nitrobenzoyl chloride. The reaction of aromatic diamines with hexafluoroisopropylidene phthalicdianhydride (6FDA) or pyromellitic dianhydride (PMDA) gave four kinds of poly(amic acid)s. Their inherent viscosities ranged from 0.196 to 0.346 dL/g. Poly(amic acid)s were converted to polyimides by thermal imidization. The glass transition temperatures ($T_g$) of polyimides were between 241 and $289^{\circ}C$. The 5% weight loss temperatures were recorded in the range of $430{\sim}492^{\circ}C$. The tensile strength of polyimide films were measured as 29.84~64.38 MPa.

• Applied Chemistry for Engineering
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• v.7 no.1
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• pp.194-202
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• 1996

Hot melt adhesive based on the polyamide resin was studied to improve the conventional hot melt adhesives such as ethylene-vinyl acetate which have inherent problems against creep and heat resistance. It was found that the terpolymer of nylons6, nylon66, and nylon12 or the nylon blend instead of nylon homopolymer was suitable base resin for hot melt adhesives, since the disruption of regularity in the polymer chains reduced the crystallinity, resulting in lower melting point and melt viscosity. Also, the rheological properties of the polyamide based hot melt adhesive could be controlled by the incorporation of terpene resin, butyl benzyl phthalate, and paraffin wax. The results of melt viscosities and tensile properties of adhesive itself indicated that the optimum adhesion properties could be obtained through the blending of CM831/843P resins with weight ratio 75/25~50/50. The adhesion between steel and steel was tested by using lap shear geometry. It was found that the surface roughness of steel affected the adhesion strength.

• Journal of the Korean Chemical Society
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• v.18 no.6
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• pp.453-455
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• 1974