• 한국정보통신학회:학술대회논문집
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• 한국해양정보통신학회 2004년도 춘계종합학술대회
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• pp.324-326
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• 2004

엑시머 레이저로 여기되는 분포제환 색소레이저(DFDL: Distributed Feedback Dye Laser)로부터 616nm의 레이저 펄스를 얻고, 이를 제2고조파 발생에 의한 파장변환을 통해 308nm의 극초단 자외 광펄스를 얻었다. 또한 3단의 XeCl 엑시머 레이저 증폭기를 구성하여 자외 광펄스의 증폭을 행하였다.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2008년도 제39회 하계학술대회
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• pp.1005-1006
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• 2008

기존의 전자식 안정기 특히 펄스로 시동되는 HID램프용의 안정기에서는 부가적인 시동회로가 필요하게 된다. 하지만 램프 제조업자에 의해 규정된 점화 펄스폭은 제조업자 간에서도 다양하며, 대단히 높게 되어 있으며 그 펄스폭에는 최소 필요한 값이 있고 이것은 통상 $1.5{\sim}2.5us$정도이다. 이와 같은 시동 펄스폭의 조건을 만족하기 위해서는 시동회로 또한 복잡해지고 제작비용도 고가가 된다. 본 연구는 전력소모가 20[%]이상 절감되면서도 광량이 더 많이 방사되는 메탈핼라이드 램프를 UV경화 시스템 즉, LCD, PDP OLED 모듈조립, 평면, 곡면 스크린 인쇄용, 코팅용, 실험용 UV경화 및 UV노광 시스템 등에 사용 가능한 전자식 안정기를 고주파 시동의 이점을 유지해 가면서 지연 시간에 기인하는 램프의 꺼짐 및 대순환 전류의 문제를 해소하고 고압 대용량 램프를 구동할 수 있는 20KW급 전자식 안정기를 제안하여 22KW UV LAMP를 사용하여 전자식 안정기를 구동 실험으로 검증하였다.

• 한국지반환경공학회 논문집
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• 제12권9호
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• pp.63-69
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• 2011

본 연구에서는 펄스 전기장 처리장치를 이용하여 물, 계면활성제 그리고 휴믹산의 물리화학적 변화 특성을 검토하였다. 펄스 전기장 처리에 따른 물의 구조적 특성변화를 검토한 결과, FT-IR 분석에서 C-N 복합구조와 C=O 구조에서 변화가 일어나는 것으로 나타났으며, NMR 분석에서는 물분자의 운동속도 증가폭이 최소 2.3 Hz에서 9.9 Hz로 나타났다. 각각의 계면활성제를 펄스 전기장 처리 한 결과, 양이온 계면활성제와 음이온 계면활성제의 CMC는 각각 1.3%와 9.2% 낮아지는 것으로 나타났고, UV-vis 값은 증가하는 것으로 나타났다. 그러나 휴믹산은 펄스 전기장 처리를 할 경우 UV-vis 값이 감소하는 것으로 나타났다. 펄스 전기장 처리는 물과 유기화합물의 구조적 특성변화에 직접적인 영향을 미치는 것을 확인할 수 있었다.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2005년도 춘계학술발표대회 개요집
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• pp.314-316
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• 2005

이 논문에서는 아크 용접시 발생하는 IR신호와 UV호의 상호 관계를 알아보려고 레이저 용접진단에 사용되는 IR-UV 센서 모니터링 시스템을 적용하였다. 그 결과 IR신호 크기는 용접폭에 관련이 있고, 펄스 형태의 UV신호는 IR신호 증가율이 임계값을 넘으면 나타나는 것을 알 수 있다.

• 한국기계가공학회지
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• 제9권3호
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• pp.56-61
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• 2010

Recently, UV pulse laser is widely used in micro machining of the research, development and industry field of IT, NT and BT products because the laser short wavelength provides not only micro drilling, micro cutting and micro grooving which has a very fine line width, but also high absorption coefficient which allows a lot of type of materials to be machined more easily. To analyze the dynamic deformation during a very short processing time, which is nearly about several tens nanoseconds, the commercial Finite Element Analysis (FEA) code, LS-DYNA 3D, was employed for the computitional simulation of the UV laser micro machining behavior for thin copper material in this paper. A finite element model considering high strain rate effect is especially suggested to investigate the micro phenomena which are only dominated by mechanically pressure impact in disregard of thermally heat transfer. From these computational results, some of dynamic deformation behaviors such as dent deformation shapes, strains and stresses distributions were observed and compared with previous experimental works. These will help us to understand micro interaction between UV laser beam and material.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2010년도 춘계학술대회 논문집
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• pp.299-300
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• 2010

• 한국레이저가공학회지
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• 제8권2호
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• pp.7-12
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• 2005

The material processing of UV nanosecond pulse laser cannot be avoided the material shape change and contamination caused by interaction of base material and laser beam. Nowadays, ultra short pulse laser shorter than nanosecond pulse duration is used to overcome this problem. The advantages of this laser are no heat transfer, no splashing material, no left material to the adjacent material. Because of these characteristics, it is so suitable for micro material processing. The processing of sapphire wafer was done by UV 355nm, green 532nm, IR 1064nm. X-Y motorized stage is installed to investigate the proper laser beam irradiation speed and cycles. Also, laser beam fluence and peak power are calculated.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2010년도 춘계학술대회 논문집
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• pp.287-288
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• 2010

• 한국정밀공학회지
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• 제27권10호
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• pp.29-33
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• 2010

UV laser micromachining of metallic materials has been used in microelectronic and other industries. This paper shows on experimental investigation of micromachining of copper using a 355nm UV laser with 50ns pulse duration. A finite element model with high strain rate effect is especially suggested to investigate the phenomena which are only dominated by mechanically pressure impact in disregard of thermally heat transfer. In order to consider the strain rate effect, Cowper-Symonds model was used. To analyze the dynamic deformation during a very short processing time, which is nearly about several tens nanoseconds, a commercial Finite Element Analysis (FEA) code, LS-DYNA 3D, was employed for the computational simulation of the UV laser micro machining behavior for thin copper material. From these computational results, depth of the dent (from one to six pulsed) were observed and compared with previous experimental results. This will help us to understand interaction between UV laser beam and material.

• 상하수도학회지
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• 제23권1호
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• pp.69-75
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• 2009

The characteristics of disinfection and organic removal were investigated with pulse UV lamp in this study. The intensity and emission wavelength of pulse UV Lamp were compared with low pressure UV lamp. The emission spectrum range of pulse UV lamp was between 200 and 400 nm while the emission spectrum of low pressure UV lamp was only single wavelength of 254nm. 3 Log inactivation rate of B. subtilis spore by pulse UV and low pressure UV irradiation was determined as $44.71mJ/cm^2$ and $57.7mJ/cm^2$, respectively. This results implied that wide range of emission spectrum is more effective compared to single wavelength emission at 254nm. 500ng/L of initial 2-MIB concentration was investigated on the removal efficiency by UV only and $UV/H_2O_2$ process. The removal efficiency of UV only process achieved approximately 80% at $8,600mJ/cm^2$ dose. 2-MIB removal rate of $UV/H_2O_2$ (5 mg/L $H_2O_2$) process was 25 times increased compared to UV only process. DOC removal efficiency for the water treatment plant effluent was examined. The removal efficiency of DOC by UV and $UV/H_2O_2$ was no more than 20%. Removal efficiency of THMFP(Trihalomethane Formation Potential), one of the chlorination disinfection by-products, is determined on the UV irradiation and $UV/H_2O_2$ process. Maximum removal efficiency of THMFP was approximately 23%. This result indicates that more stable chemical structures of NOM(Natural Organic Matter) than low molecule compounds such as 2-MIB, hydrogen peroxide and other pollutants affect low removal efficiency for UV photolysis. Consequently, pulse UV lamp is more efficient compared to low pressure lamp in terms of disinfection due to it's broad wavelength emission of UV. Additional effect of pulse UV is to take place the reactions of both direct photolysis to remove micro organics and disinfection simultaneously. It is also expected that hydrogen peroxide enable to enhance the oxidation efficiency on the pulse UV irradiation due to formation of OH radical.