• Proceedings of the Korean Society of Precision Engineering Conference
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• 2001.04a
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• pp.942-945
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• 2001

Pulse electrochemical micromachining offers significant improvements in dimensional accuracy as compared with conventional electrochemical machining. One primary issue in pulse electrochemical micromachining is to identify and control machining depth as well as interelectrode gap size. This paper presents an identification method for the machining depth by in-process analysis of machining current and interelectrode gap size. The inter electrode gap characteristics, including pulse current, effective volumetric electrochemical equivalent and electrolyte conductivity variations, are analysed based on the model and experiments.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2003.10a
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• pp.356-361
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• 2003

Electrochemical micromachining which is not normally considered as a precision process is presented in this paper. The application of voltage Pulses between a tool electrode and a workpiece in an electrochemical environment allows the three-dimensional machining of conducting materials with micrometer precision. In this paper tool-electrodes($5\mu\textrm{m}$ in diameter, 1mm in length) are developed by electrochemical micromaching and micro holes are manufactured using this tool-electrodes we developed already. Micro holes are achieved the accuracy below $50\mu\textrm{m}$ in diameter using ultrashort voltage pulses(0.1-5$\mu\textrm{s}$).

• Journal of the Korean Society for Precision Engineering
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• v.19 no.4
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• pp.101-108
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• 2002

A specially-built EMM (Electrochemical Micro Machining) / PECM (Pulse Electrochemical Machining) cell, a electrode tool filled with non-conducting material, a electrolyte flow control system and a small & stable gap control unit are developed to achieve accurate dimensions of recesses. Two electrolytes, aqueous sodium nitrate and aqueous sodium chloridc arc applied in this study. The farmer electrolyte has better machine-ability than the latter one because of its appropriate changing to the transpassive state without pits on the surface of workpiece. It is easier to control the machining depth precisely by micrometer with pulse current than direct current. This paper also presents an identification method for the machining depth by in-process analysis of machining current and inter electrode gap size. The inter electrode gap characteristics, inc1uding pulse current, effective volumetric electrochemical equivalent and electrolyte conductivity variations, are analyzed based on the model and experiments.

• Journal of the Korean Society for Precision Engineering
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• v.22 no.5 s.170
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• pp.37-44
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• 2005

In this paper, wire electrochemical machining (Wire ECM) with ultra short pulses is presented. Platinum wire with $10{\mu}m$ diameter was used as a tool and 304 stainless steel was locally dissolved by electrochemical machining in 0.1M $H_{2}SO_4$ electrolyte. Wire ECM can be easily applied to the fabrication of arbitrarily shaped micro-grooves without tool wear. The change of machining gap according to applied pulse voltage, pulse on-time and pulse period was investigated and the optimal pulse condition for stable machining was obtained. Using this method, various micro-grooves with less than $20{\mu}m$ width were fabricated.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.10a
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• pp.151-154
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• 2002

In this paper a mathematical model, the results of computer simulation and exprimental investigations of electrochemical machining with a too-electrode are presented. The experimental investigations were carried out in order to evaluate the influence of working voltage, initial interelectrode gap size, and metal remove rate. Accuracy of computer simulation evaluated by differences between results of experimental test and computer simulation depends on electrochemical machining coefficient, total overpotential of electrode process, current density, electrical conductivity of electrolyte, and etc. Metal removal rate would be predicted by the simulation of ECM process.

• Journal of the Korean Society for Precision Engineering
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• v.25 no.3
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• pp.134-140
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• 2008

Micro electrochemical machining (ECM) is conducted on stainless steel 304 using non-toxic electrolyte of citric acid. Electrochemical dissolution region is minimized by applying a few hundred second duration pulses between the tungsten SPM tip and the work material. ECM characteristics according to citric acid concentration, feeding velocity and electric conditions such as pulse amplitude, pulse frequency, and offset voltage are investigated through a series of experiments. Micro holes of $60{\mu}m$ in diameter with the depth of $50{\mu}m$ and $90{\mu}m$ in diameter with the depth of $100{\mu}m$ are perforated. Square and circular micro cavities are also manufactured by electrochemical milling. This research can contribute to the development of safe and environmentally friendly micro ECM process.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.4
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• pp.45-50
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• 2006

Copper via filling is the important factor in 3-D stacking interconnection of SiP (system in package). As the packaging density is getting higher, the size of via is getting smaller. When DC electroplating is applied, a defect-free hole cannot be obtained in a small size via hole. To prevent the defects in holes, pulse and pulse reverse current was applied in copper via filling. The holes, $20\and\;50{\mu}m$ in diameter and $100{\sim}190\;{\mu}m$ in height. The holes were prepared by DRIE method. Ta was sputtered for copper diffusion barrier followed by copper seed layer IMP sputtering. Via specimen were filled by DC, pulse and pulse-reverse current electroplating methods. The effects of additives and current types on copper deposits were investigated. Vertical and horizontal cross section of via were observed by SEM to find the defects in via. When pulse-reverse electroplating method was used, defect free via were successfully obtained.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.05a
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• pp.918-921
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• 2002

Some investigators who have tried to achieve the highly smooth surface finish using electrochemical processes have reported that high current density produced lustrous surfaces while the opposite conditions produced a passive layer and had a tendency to produce a black surface. However, processing at a low current density may produce a non-lustrous surface but the improvement of dimensional accuracy of the surface is significant. The surface with pulse process was a bit more lustrous than with continuous current but the black passive layer still could be found at grooved surface. There are two ways to achieve highly smooth surface finish. One is brushing it with a brush the other is electrochemical machining (ECM) with high current. The former method is the most common polishing practice, but not only may the surface obtained differ from operator to operator, but precision smooth surface on micro grooves are difficult to obtain. The latter one recently has been used to produce a highly smooth surface after EDM process. However, the material removal rate in ECM with high current is relatively high. Hence the original shape of the micro grooves, which was formed by electrochemical micro-machining (EMM) process, may be destroyed. In this study, an electrochemical polishing process using pulse current is adopted as a possible alternative process when micro grooves formed by EMM process should be polished. Mirror-like micro grooves with lustrous and smooth surface can be produced electrochemically with pulse current because the voltage and current used can be lower than the case of continuous current. This study will discuss the accurate control of physical and electrical conditions so as to achieve mirror-like micro grooves with lustrous and smooth surface without destroying the original shape of micro grooves.