• Composites Research
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• v.12 no.5
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• pp.31-39
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• 1999

Glass-fiber reinforced polymeric composites provide the desitable properties of high stiffness and strength as well as specific weight. Hence, they have become some of the most important materials in several industries. These composites can be grouped into thermoplastic and thermoset composites, with thermoplastic composites having several advantages over thermoset composites in mechanical properties and processing. As a result, the study of the material behavior and forming techniques of such composites has attracted considerable attention in recent years. When the continuous fiber-reinforced polymeric composites are molded by flow molding, the molded parts leads to be nonhomogeneity and anisotropic because of the separation and orientation of fibers. As the characteristics of the products are greatly dependent on the separation, it is very important to clarify the separation in relarion to molding conditions, fiber mat structures and mold geometry. In this study, the effects of the mold geometry and the fiber mat structure on the compression moldability are studied using the cup-type molding.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2003.10a
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• pp.101-106
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• 2003

Recent electronic equipment becomes smaller, more functional, and more complex. According to these trends, LTCC(low temperature co-fired ceramic) has been emerged as a promising technology in packaging industry. It consists of multi-layer ceramic sheet, and the circuit has 3D structure. In this technology via hole formation plays an important role because it provides an electric path for the packaging interconnection network. Therefore via hole quality is very important for ensuring performance of LTCC product. Via holes are formed on the green sheet that consists of ceramic(before sintering) layer and PET(polyethylene Terephthalate) one. In this paper we found the correlation between hole quality and process condition such as ceramic thickness, and tool size. The shear behavior of double layer sheet by micro hole punching which is different from that of single layer one was also discussed.

• Transactions of Materials Processing
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• v.14 no.3 s.75
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• pp.277-281
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• 2005

LTCC(Low temperature co-fired ceramic) is being recognized as a significant packaging material of electrical devices for the advantages such as relatively low temperature being needed for process, low conductor resistance and high printing resolution. In the process of LTCC electrical devices, the punched via-hole quality is one of the most important factors on the performance of the device. However, its mechanism is very complicated and optimization of the process seems difficult. In this paper, to clarify the process, via-hole punching experiments were carried out and the punched holes were examined in terms of their burr formation. The effects of thickness of PET sheet, ceramic sheet and punch-to- die clearance on via-hole quality were also discussed. Optimum process conditions are proposed and a factor $\kappa$ is introduced to express effect of the process variables.

• Transactions of Materials Processing
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• v.13 no.1
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• pp.65-71
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• 2004

Recent electronic equipment becomes smaller, more functional, and more complex. According to these trends, LTCC(low temperature co-fired ceramic) has been emerged as a promising technology in packaging industry. It consists of multi-layer ceramic sheet, and the circuit has 3D structure. In this technology via hole formation plays an important role because it provides an electric path for the packaging interconnection network. Therefore via hole qualify is very important for ensuring performance of LTCC product. Via holes are formed on the green sheet that consists of ceramic(before sintering) layer and PET(polyethylene terephthalate) one. In this paper we found the correlation between hole quality and process condition such as PET thickness and ceramic thickness. The shear behavior of double layer sheet by micro hole punching which is different from that of single layer one was also discussed.

• Proceedings of the Korean Society of Dyers and Finishers Conference
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• 2011.03a
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• pp.83-83
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• 2011

나노섬유는 마이크로 섬유에 비해 $10^3$배 정도의 넓은 표면적을 가지며, 다른 섬유와 비교하여 유연성, 투습성과 같은 특성이 우수하다. 나노섬유의 제조방법은 여러 가지가 있으나, 상용화의 가능성, 적용 고분자의 다양성, 제조공정의 단순성, 다양한 제품기술에의 응용성 등을 고려하여 선택하여야 한다. 나노섬유의 제조기술은 방법에 따라 전기방사, 복합방사, 멜트블로운 공정, 에어레이드 공정, 습식 공정 등으로 나눌 수 있다. 전기방사 등 나노섬유를 대량생산하여 상용화하려는 노력을 지속적으로 하고 있으나 나노섬유의 염색가공에 관련되어 기술적 한계로 제품전개에 많은 어려움을 겪고 있다. 그리하여 본 연구에서는 나노섬유 단독으로 제품화하기에는 강도 등의 문제로 PET에 워터펀칭한 복합소재로 개발하여 900nm 이하의 나노섬유에 대한 최적의 날염조건과 현장적용 생산기술을 개발하고자 하였다. 나노섬유 복합소재에 대하여 Brown, Red, Blue, Black 색상의 안료와 Urethane, Rubber, Acrylic, Eco Binder를 사용하여 날염 실험하였으며, 최적의 조건으로 현장생산에 적용하여 생산하였다. 안료의 고착성을 높여 날염성과 염색견뢰도를 증진시키기 위하여 원적외선 열처리기를 개발하여 현장생산에 접목시켰다. 원적외선 열처리기는 벙커C유 또는 가스 등을 사용하는 텐터나 증열기와는 다르게 전기를 에너지원으로 하여 원적외선 램프를 이용한 건열시스템의 형태로 저공해 및 그린 형태의 열처리기 시스템으로, 섬유에 대한 원적외선의 조사거리, 원적외선 램프의 간격, 적용 온도, 원단이송 속도 등에 따른 최적의 원적외선 열처리기 날염조건을 설정하였다. 바인더에 따른 날염성은 우레탄계 바인더를 사용하였을 경우에 가장 선명하고 깊은 색상을 보였으며, 아크릴계 바인더의 경우가 가장 낮은 색상을 보였으며 염색견뢰도는 대체적으로 양호한 결과를 얻었다. 그리고, 최근 환경적인 추세에 맞추어 에코 바인더를 사용하여 날염한 결과 염색성과 내구성 등은 우레탄계와 아크릴계 바인더의 중간 정도의 결과를 보였다.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.12 no.6
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• pp.10-16
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• 2013

Ultra-fine planing and micro punching are separately used for improving surface roughness and machining dot patterns, respectively, of metal molds. If these separate machining processes are applied for machining of identical molds, there could be an aligning mismatch between the machine tool and the mold. A hybrid machining system combining ultra-fine planing and micro punching was newly developed in this study in order to solve this mismatch; hybrid process technology was also developed for machining dot patterns on a mirror surface of a metal mold. The hybrid machining system has X, Y, and Z axes, and a cam axis for ultra-fine planing. The cam axis and attachable and removable solenoid actuators for micro punching can make large and small sizes of dot patterns, respectively. Ultra-fine planing was applied in the first place to improve the surface roughness of a metal mold; the measured surface roughness was about 20nm. Then, micro punching was applied to machine dot patterns on the same mold. It was possible to control the diameter of the dot patterns by changing the input voltage of the solenoid actuator. Before machining, severe inhomogeneous plastic deformation around the machined dot patterns was also removed by annealing heat treatment. Therefore, it was verified that metal molds with dots patterns for optical products can be machined using a hybrid machining system and the hybrid process technology developed in this study.

• Journal of the Korean Society for Precision Engineering
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• v.22 no.12 s.177
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• pp.156-162
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• 2005

In this paper, we study the mechanism of lead deformation by numerically simulating the stamping process by means of a commercial finite element code. It is very important to analyze effects that the lead shape makes on the lead deformation, because the lead shape is often modified in order to minimize the deformation or to increase the buckling critical load of the punch. Therefore the stamping process, first, numerically simulated by considering as a quasi-static problem. Second, the effect on the lead deformation due to the lead shape variation, a linear lead geometry and a bent lead, was numerically analyzed and discussed. Finally, the punching order was optimized fur multi-lead generating stamping process. The results show that the bent lead is little bit more shifted than the linear lead after the punching process. But the bent lead is vertically less deformed than the linear lead. The punching order to successively generate the lead is good to keep the lead space uniform. The results will be very effectively applied for the design of the blanking or punching dies in industry.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2004.11a
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• pp.260-265
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• 2004

LTCC(Low temperature co-fired ceramic) is being recognized as a significant packaging material of electrical devices for the advantages such as relatively low temperature being needed for process, low conductor resistance and high printing resolution. In the process of LTCC electrical devices, the punched via-hole quality is one of the most important factors on the performance of the device. However, its mechanism is very complicated and optimization of the process seems difficult. In this paper, to clarify the process, via-hole punching experiments were carried out and the punched holes were examined in terms of their burr formation. The effects of thickness of PET sheet and ceramic sheet and punch-to-die clearance on via-hole quality were also discussed. Optimum process conditions are proposed and a factor k is introduced to express effect of the process variables.

• Design & Manufacturing
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• v.15 no.4
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• pp.1-7
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• 2021

A study on in-mold punching technology for hole piercing during molding of hollow plastic parts was conducted. Considering the non-linearity of the HDPE plastic material, mechanical properties were obtained according to the change in temperature and load speed. A standard specimen for the in-mold punching test was designed to implement the in-mold punching process, and the specimen was obtained through injection molding. In order to analyze the influence of process variables during in-mold punching, an in-mold punching mold capable of controlling variables such as temperature and support pressure of the specimen was designed and manufactured. Mold heating characteristics were confirmed through finite element analysis, and punching simulations for changes in process conditions were performed to analyze punching characteristics and reflected in the experiment. Through simulations and experiments, it was found that the heating temperature, punch shape, punching speed, and pressure of the back side of the specimen were very important during in-mold punching of HDPE materials, and optimal conditions were acquired within a given range.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.9 no.3
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• pp.628-631
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• 2008

A company needs to maintain its machines always workable in order to keep the manufacturing time minimal. If any troubles occur, they should be fixed as soon as possible. But, the complexity of modern machines make the trouble shooting difficult. So, it is important that the monitoring system for automated production system to fix every trobule easily. In this paper new, inverter control system for TG feedback a formula Control was developed. The motor control system with TG feedback controller as an effect of load disturbance, it is very difficult to guarantee the robustness of control system. The function of the implementation are 7G feedback type, and temperature scheme. The Inverter Control System approach is based on master-slave control concept. To show validity of the developed new inverter control system, severial experiments are illustrated.