• Journal of KIISE:Computing Practices and Letters
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• v.9 no.2
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• pp.123-132
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• 2003

The quality certification test is usually conducted by a certifying organization to determine and guarantee the quality of software after the software development phase, commonly without the actual source code, but with by going against the product's manual. In this paper, we implement a Manual-based Automatic Test data generating tool: MaT, the test technique based on manual, that automatizes producing the test data from analysis data of software package and manual. The input data of MaT are the result of the analysis of software and manual. We propose 'menu-based test analysis model' in order to generate the input data. We believe that the proposed technique and tool he]p improving quality and reliability of the software.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.22 no.1
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• pp.327-332
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• 2021

At the package level, semiconductor reliability inspections involves mounting a semiconductor chip package on a test socket. The form of the test socket is basically determined by the form of the chip package. It also acts as a medium to connect with test equipment through mechanical contact of the leads and socket leads in the chip package, and it minimizes signal loss in a signal transmission process so that an inspection signal can be delivered well to the semiconductor. In this study, a technique was applied to examine the interdependence of adjacent electrical transfer routes and the structure of adjacent electrical transfer paths. The goal was to enable short-circuit testing of fewer than 100 silicon test sockets through a single interface for life tests and precision measurements. The test results of the developed device show a test precision of 99% or more and a simultaneous test speed characteristic of 0.66 sec or less.

• Proceedings of the Korean Reliability Society Conference
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• 2011.06a
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• pp.163-171
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• 2011

본 논문에서는 LED 패키지 내부 이종물질간의 열팽창계수 차에 의한 박리 현상 및 이에 따른 LED 광속저하 메커니즘의 규명에 대한 연구를 진행하였다. 친환경 조명의 대두 및 고휘도 White LED의 급속적인 발전과 개발에 따라 LED 패키지 고장 형태가 점점 줄어드는 추세이기는 하나, 여전히 실사용 환경에서는 LED 패키지의 고장이 다양한 형태로 발생되고 있는 것이 실정이다. 이 중 LED 패키지 내부 이종물질간의 박리에 의한 고장은 LED 발광효율을 감소시키는 형태로 발생되고, 이에 대한 영향을 최소화하기 위하여 LED 패키지 제조업체 및 다수의 연구소에서 많은 노력을 기울이고 있다. 대표적인 박리 검사방법으로는 잉크침투 테스트 방법을 보편적으로 사용하고 있으나, 이 방법은 시료의 파손 및 검사 시간이 24시간이상 소요된다는 단점을 가지고 있다. 이에 본 논문에서는 헬륨 가스를 사용하여 LED 패키지 박리 유무를 검출해 내는 평가법을 제시하였고, 이 방법을 통하여 시료 파손 없이 짧은 시간 안에 박리 유무를 평가할 수 있음을 확인 할 수 있었다.

• Proceedings of the Korean Information Science Society Conference
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• 2012.06b
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• pp.258-260
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• 2012

본 논문은 오픈소스 자바 어플리케이션인 JTopas를 대상으로 단위 메소드 테스트를 수행하고, 기존의 IDE 중심의 JUnit 테스트 환경이 아닌 텍스트 UI 테스트 러너 기반으로 테스트를 수행함으로써 얻는 효과를 기술한다. 또한 리눅스 환경을 활용하여 쉘 프로그램으로 테스트 실행 프로그램을 작성하였으며, 이를 통하여 테스트 실행 결과 분석을 용이하게 할 수 있다. 동시에 테스트 코드와 테스트 대상 소스 코드를 관리하는 패키지 구성 방법을 보임으로써, TDD등에서 요구하는 테스트 코드 작성과 소스 코드 작성을 동시에 수행하는 환경을 지원하는 효과가 있다.

• Communications of the Korean Institute of Information Scientists and Engineers
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• v.19 no.11
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• pp.4-9
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• 2001

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.47 no.11
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• pp.1-5
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• 2010

We developed a novel micro-electro mechanical systems (MEMS) test socket using silicon on insulator (SOI) substrate with the cantilever array structure. We designed the round shaped cantilevers with the maximum length of $350{\mu}m$, the maximum width of $200{\mu}m$ and the thickness of $10{\mu}m$ for $650{\mu}m$ pitch for 8 mm x 8 mm area and 121 balls square ball grid array (BGA) packages. The MEMS test socket was fabricated by MEMS technology using metal lift off process and deep reactive ion etching (DRIE) silicon etcher and so on. The MEMS test socket has a simple structure, low production cost, fine pitch, high pin count and rapid prototyping. We verified the performances of the MEMS test sockets such as deflection as a function of the applied force, path resistance between the cantilever and the metal pad and the contact resistance. Fabricated cantilever has 1.3 gf (gram force) at $90{\mu}m$ deflection. Total path resistance was less than $17{\Omega}$. The contact resistance was approximately from 0.7 to $0.75{\Omega}$ for all cantilevers. Therefore the test socket is suitable for BGA integrated circuit (IC) packages tests.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.11 no.3
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• pp.853-858
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• 2010

DRAM package substrate has been demonstrated using a thick alumina layer produced by aluminum anodization process. To apply a transmission-based design methodology, 2 dimensional electromagnetic simulation is performed. The design parameters including signal line width/spacing and alumina's thickness are optimized based on the simulation analysis and are verified with the fabrication and the measurement of the test patterns on the anodic alumina substrate. DDR2 DRAM package is chosen as a design vehicle. Aluminum anodization technique has been applied successfully to fabricate new DRAM package substrate.

• Digital Contents
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• no.8 s.123
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• pp.60-61
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• 2003

3차에 걸친 클로즈 베타테스트를 성공적으로 마치고 지난달 16일 오픈 베타베스트에 들어간 '씰 온라인'은 그리곤 엔터테인먼트에서 2000년에 출시한 패키지 게임 '씰(seal)'의 세계관을 계승한 풀 카툰렌더링 3D 온라인 게임이다.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.1
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• pp.27-31
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• 2009

In this paper, the polymer adhesive bonding technology using wafer-level technology was investigated and warpage results were analyzed. Si and glass wafer was bonded after adhesive polymer layer and dam pattern for uniform state was patterned on glass wafer. In this study, warpage result decreased as the low of bonding temperature of Si wafer, bonding pressure and height of adhesive bonding layer. The availability of adhesive polymer bonding was confirmed by TC, HTC, Humidity soak test after dicing. The result is that defect has not found without reference to warpage.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.8 no.7
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• pp.1524-1531
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• 2004

This study analyzes a load balancing technique using Round Robin Algorithm. The study uses two software packages (Packet Capture and Round Robin Test Package) to check packet volume from Virtual Network structure (data generator, virtual server, Server1,2,3), and finds out traffic distribution toward Server1,2 and 3. The functions of implemented Round Robin Load Balancing Monitoring System include round robin testing, system monitoring, and graphical indication of data transmission and packet volume. As the result of the study shows, Round Robin Algorithm allows servers to ensure definite traffic distribution, unless incoming data loads differ much. Although error levels are high in some cases, they were eventually alleviated by repeated tests for a long period of time.