• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.35-36
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• 2008

In this paper, we studied the long term durability estimation for crystalline photovoltaic module while exposing to mechanical stress. Solar cell and PV module have many different kinds of stresses from cell to module fabrication. For this reason, some solar cell shows micro crack that decrease crystallization. In here, we expose artificial mechanical load on surface of PV module. Through this, the periodic external force on PV module might give an negative effect. The further analysis is described in the following paper.

• The Transactions of the Korean Institute of Electrical Engineers P
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• v.56 no.4
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• pp.168-172
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• 2007

The global environment deteriorating which originated from using of fossil fuel is an serious problem for human being to solve. The photovoltaic energy has been considered as a solution. In advanced countries, research and development for photovoltaic(PV) energy system is carrying on. Once installed, a PV array requires maintenance and fault diagnosis other than an occasional cleaning. In this research, the proposed system monitor and diagnosis the output of PV array by on-line for maintenance of PV power plant. The validity of proposed system is verified using sample system.

• The Bulletin of The Korean Astronomical Society
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• v.37 no.2
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• pp.167.1-167.1
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• 2012

본 논문에서는 인공위성 전개장치용 테잎힌지 특성해석을 수행하고 그 결과에 대하여 분석하였다. 테잎힌지를 이용한 전개장치는 신뢰성이 높고, 형상이 매우 단순하며, 제작단가 또한 저렴하여 우주용 안테나 및 태양전지판에 널리 이용이 되고 있다. 테잎힌지를 이용한 전개장치의 전개특성은 테잎힌지 특성에 의하여 좌우가 되므로 안전성 있는 전개장치 설계를 수행하기 위해서는 가능한 정확한 해석이나 계산이 요구되어진다. 초기에는 쉘 이론등을 바탕으로 테잎힌지의 전개특성을 계산하는 식들이 연구되었으나 테잎힌지의 강한 비선형성 때문에 정확성이 많이 떨어지는 큰 단점이 존재하였다. 이후 많은 연구를 통하여 유한요소모델을 이용한 비선형해석을 통하여 비로소 정확한 전개특성을 해석할 수 있게 되었다. 본 논문에서는 다물체 동역학해석프로그램인 리커다인의 유연체 해석모듈을 이용하여 테잎힌지에 대한 특성해석을 수행하였다. 해석결과 신뢰성 있는 테잎힌지의 전개거동 확인 및 전개특성을 계산할 수 있었다.

• Proceedings of the KIEE Conference
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• 2003.07b
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• pp.1365-1367
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• 2003

In this paper, element technologies such as soldering. arrangement and lamination processes for photovoltaic module manufacture were examined and described as main processes. Especially solder paste and temperature condition in soldering process, loss factor in arrangement process and process conditions in lamination process are investigated to minimize the electrical loss. As a results, temperature condition in soldering process was found to be critical to contact resistance of electrode and life-time. Productivity of the process decreases dramatically by physical damage during arrangement process. Pressure level and press condition of upper chamber in lamination process were important parameters for the reliability. According to the test result of photovoltaic module, electrical properties dropped about $5{\sim}25%$ after 5 years.

• Proceedings of the KIEE Conference
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• 2007.07a
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• pp.214-215
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• 2007

Int this paper, we studied the analysis on long-term durability and output power characteristics of PV modules by variation on local thermal property. Using 5 modules(80W), we measured the maximum output power change during the test period. And the optical transmittance of glass was compared with PV module's maximum power fluctuation. The external environment change effected contamination on the entire or local surface of module. This caused the local temperature variation of each solar cell on PV module. The specific analysis is shown in the following paper.

• Proceedings of the KIEE Conference
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• 2007.07a
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• pp.1220-1221
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• 2007

Building-integrated photovoltaic(BIPV) perform traditional architectural function of walls and roof while also generating electricity. But most of the absorbed solar energy appears passively as heat, raising the temperature of cells and reducing the efficiency with which the active part is converted into electricity. Therefore this paper presents the comparison of electrical, architectural and thermal performance of roof integrated photovoltaic(PV) modules, which is composed of different hybrid structure layer such as urethane form, waffle stud etc.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07a
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• pp.28-32
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• 2004

In this paper, degradation in field-aged PV modules including degradation of interconnect, discoloration of encapsulant and hot spot have been observed and analyzed. From the results, photovoltaic module installed for 6 years shows around 16% drop of electrical properties due to the interconnect degradation and PV module passed 18 years has been found to drop of around 20% mainly by the encapsulant discoloration. Furthermore the difference between low and high temperature of PV array at hot spot goes up to $30^{\circ}C$ and it leads to interconnect degradation. On the other hands, the temperature difference was observed to be around $15^{\circ}C$ at the encapsulant discoloration spot of PV array.

• Proceedings of the KIEE Conference
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• 2005.07b
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• pp.1762-1764
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• 2005

This paper presents manufacturing techniques and distribution status of photovoltaic(PV) module for the success of domestic PV industries. The domestic PV production facilities were about 21MW at the end of 2004. Now it is about 51MW. By 2005 a increase of production facilities expect approximately 70$\sim$80MW. Also domestic PV cumulated installations up to 2004 was about 9,358kW and in 2004 PV system installed around 2,921kW which was increased about 2.8 times compared with last year.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.12-13
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• 2007

In this paper, we studied the analysis of environmental effects on maximum output power change of crystalline silicon photovoltaic module. During the test period, there was a 5% reduction of maximum output power on an average. And the degree of output power uniformity became better compared to initial value. Using climate data like rain, snow and dust, we tried to find the reasons for maximum power fluctuation. The surface of PV module was monitored using microscope and infrared camera to study temperature distribution. The further analysis is described in the following paper.

• 한국신재생에너지학회:학술대회논문집
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• 2010.06a
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• pp.58.1-58.1
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• 2010

In solar cell module manufacturing, single solar cells has to be joined electrically to strings. Copper stripes coated with tin-silver-copper alloy are joined on screen printed silver of solar cells which is called busbar. The bus bar collects the electrons generated in solar cell and it is connected to the next cell in the conventional module manufacturing by a metal stringer using conventional hot air or infrared lamp soldering systems. For thin solar cells, both soldering methods have disadvantages, which heats up the whole cell to high temperatures. Because of the different thermal expansion coefficient, mechanical stresses are induced in the solar cell. Recently, the trend of solar cell is toward thinner thickness below 180um and thus the risk of breakage of solar cells is increasing. This has led to the demand for new joining processes with high productivity and reduced error rates. In our project, we have developed a new method to solder solar cells with a laser heating source. The soldering process using diode laser with wavelength of 980nm was examined. The diode laser used has a maximum power of 60W and a scanner system is used to solder dimension of 6" solar cell and the beam travel speed is optimized. For clamping copper stripe to solar cell, zirconia(ZrO)coated iron pin-spring system is used to clamp both joining parts during a scanner system is traveled. The hot plate temperature that solar cell is positioned during lasersoldering process is optimized. Also, conventional solder joints after $180^{\circ}C$ peel tests are compared to the laser soldering methods. Microstructures in welded zone shows that the diffusion zone between solar cell and metal stripes is better formed than inIR soldering method. It is analyzed that the laser solder joints show no damages to the silicon wafer and no cracks beneath the contact. Peel strength between 4N and 5N are measured, with much shorter joining time than IR solder joints and it is shown that the use of laser soldering reduced the degree of bending of solar cell much less than IR soldering.